LEADER 01971oam 2200409zu 450 001 996204464603316 005 20210807003354.0 035 $a(CKB)111026746713776 035 $a(SSID)ssj0000455279 035 $a(PQKBManifestationID)12212588 035 $a(PQKBTitleCode)TC0000455279 035 $a(PQKBWorkID)10398359 035 $a(PQKB)11192428 035 $a(NjHacI)99111026746713776 035 $a(EXLCZ)99111026746713776 100 $a20160829d1996 uy 101 0 $aeng 135 $aur||||||||||| 181 $ctxt 182 $cc 183 $acr 200 10$a1996 IEEE International Conference on Microelectronic Test Structures 210 31$a[Place of publication not identified]$cIEEE$d1996 215 $a1 online resource (338 pages) 300 $aBibliographic Level Mode of Issuance: Monograph 311 $a0-7803-2783-7 330 $aThe papers included in this leading international conference examine test structures for microelectronic devices, their recent progress and future directions. Included is a detailed treatment of current developments in silicon and gallium arsenide microelectronic test structure research, implementation, and applications. Also addressed are advances in device characterization, such as increased miniaturization, reduced operating voltages and reduced power requirements through improved measurement and test techniques. Topics highlighted include: Process Characterization, Dimensional Measurements, Interconnection, SOI & Material Characterization, Reliability, Device Characterization, Capacitance Measurements, Statistics. 606 $aIntegrated circuits$vCongresses 606 $aMicroelectronics$vCongresses 615 0$aIntegrated circuits 615 0$aMicroelectronics 676 $a621.3815 801 0$bPQKB 906 $aBOOK 912 $a996204464603316 996 $a1996 IEEE International Conference on Microelectronic Test Structures$92506547 997 $aUNISA