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100   $a20160829d2003      uy              
101 0 $aeng
181   $ctxt
182   $cc
183   $acr
200 10$aICEPT2003 : Fifth International Conference on Electronic Packaging Technology : proceedings : Oct. 28-30, 2003, Shanghai, China
210 31$a[Place of publication not identified]$cIEEE$d2003
300   $aBibliographic Level Mode of Issuance: Monograph
311   $a0-7803-8168-8 
606   $aElectronic packaging$vCongresses
606   $aElectrical & Computer Engineering$2HILCC
606   $aElectrical Engineering$2HILCC
606   $aEngineering & Applied Sciences$2HILCC
615  0$aElectronic packaging
615  7$aElectrical & Computer Engineering
615  7$aElectrical Engineering
615  7$aEngineering & Applied Sciences
676   $a621.381/046
702   $aBarnwell$b Peter G
702   $aBi$b Keyun
702   $aWang$b J
712 02$aZhongguo dian zi xue hui
712 02$aComponents, Packaging & Manufacturing Technology Society
712 12$aInternational Conference on Electronic Packaging Technology
801  0$bPQKB
906   $aPROCEEDING
912   $a996202926103316
996   $aICEPT2003 : Fifth International Conference on Electronic Packaging Technology : proceedings : Oct. 28-30, 2003, Shanghai, China$92510473
997   $aUNISA