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100   $a20160829d2003      uy              
101 0 $aeng
181   $ctxt
182   $cc
183   $acr
200 10$aProceedings of the 10th International Symposium on the Physical & Failure Analysis of Integrated Circuits : IPFA 2003 : [scheduled, 7 to 11 July, 2003, Singapore
210 31$a[Place of publication not identified]$cIEEE$d2003
300   $aBibliographic Level Mode of Issuance: Monograph
311   $a0-7803-7722-2 
606   $aIntegrated circuits$xDefects$vCongresses
606   $aIntegrated circuits$xTesting$vCongresses
606   $aElectrical & Computer Engineering$2HILCC
606   $aEngineering & Applied Sciences$2HILCC
606   $aElectrical Engineering$2HILCC
615  0$aIntegrated circuits$xDefects
615  0$aIntegrated circuits$xTesting
615  7$aElectrical & Computer Engineering
615  7$aEngineering & Applied Sciences
615  7$aElectrical Engineering
676   $a621.3815
702   $aHo$b Philip
712 02$aIEEE Reliability Society
712 02$aNational University of Singapore
712 02$aIEEE Electron Devices Society
712 02$aIEEE Reliability/CPMT/ED Singapore Chapter
712 12$aInternational Symposium on the Physical & Failure Analysis of Integrated Circuits
801  0$bPQKB
906   $aPROCEEDING
912   $a996202483603316
996   $aProceedings of the 10th International Symposium on the Physical & Failure Analysis of Integrated Circuits : IPFA 2003 :$92540908
997   $aUNISA