LEADER 01842oam  2200517zu 450 
001 996202409303316
005 20210806235718.0
035   $a(CKB)1000000000022004
035   $a(SSID)ssj0000394322
035   $a(PQKBManifestationID)12122690
035   $a(PQKBTitleCode)TC0000394322
035   $a(PQKBWorkID)10386940
035   $a(PQKB)11064996
035   $a(EXLCZ)991000000000022004
100   $a20160829d2003      uy              
101 0 $aeng
181   $ctxt
182   $cc
183   $acr
200 00$aDesign, test, integration and packaging of MEMS/MOEMS 2003 : DTIP 2003 : 5-7 May, 2003, Cannes, France
210 31$a[Place of publication not identified]$cIEEE$d2003
300   $aBibliographic Level Mode of Issuance: Monograph
311   $a0-7803-7066-X 
606   $aMicroelectromechanical systems$vCongresses
606   $aOptoelectronic devices$vCongresses
606   $aMicromachining$vCongresses
606   $aMicroelectronic packaging$vCongresses
606   $aElectrical & Computer Engineering$2HILCC
606   $aElectrical Engineering$2HILCC
606   $aEngineering & Applied Sciences$2HILCC
615  0$aMicroelectromechanical systems
615  0$aOptoelectronic devices
615  0$aMicromachining
615  0$aMicroelectronic packaging
615  7$aElectrical & Computer Engineering
615  7$aElectrical Engineering
615  7$aEngineering & Applied Sciences
676   $a621.381
702   $aBergman$b Keren
712 02$aCentre national de la recherche scientifique (France)
712 12$aSymposium on Design, Test, Integration and Packaging of MEMS/MOEMS$d(5th :$f2003 :$eCannes, France)
801  0$bPQKB
906   $aPROCEEDING
912   $a996202409303316
996   $aDesign, Test, Integration and Packaging of MEMS$91889065
997   $aUNISA