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100   $a20200604d2004      uy             0
101 0 $aeng
135   $aur|||||||||||
181   $ctxt
182   $cc
183   $acr
200 10$aHDP '04 $eproceeding of the sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis : June 30-July 3, 2004, Bao Long Hotel, Shanghai, China /$forganized by Institute of Electrical and Electronics Engineers [and fifteen others]
210  1$aPiscataway, New Jersey :$cInstitute of Electrical and Electronics Engineers,$d2004.
215   $a1 online resource (395 pages)
300   $aBibliographic Level Mode of Issuance: Monograph
311   $a0-7803-8620-5 
606   $aIntegrated circuits$xDesign and construction$vCongresses
606   $aElectronic packaging$vCongresses
606   $aMicroelectromechanical systems$vCongresses
615  0$aIntegrated circuits$xDesign and construction
615  0$aElectronic packaging
615  0$aMicroelectromechanical systems
676   $a621.3815
712 02$aInstitute of Electrical and Electronics Engineers,
712 12$aIEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis
801  0$bWaSeSS
801  1$bWaSeSS
906   $aPROCEEDING
912   $a996202159803316
996   $aHDP '04$92525656
997   $aUNISA