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100   $a20160829d1998      uy              
101 0 $aeng
181   $ctxt
182   $cc
183   $acr
200 10$a1998 2nd IEMT/IMC Symposium : April 15-17, 1998, Sonic City-Omiya, Tokyo, Japan
210 31$a[Place of publication not identified]$cIEEE$d1998
300   $aBibliographic Level Mode of Issuance: Monograph
311   $a0-7803-5090-1 
606   $aMicroelectronic packaging$xCongresses$zJapan
606   $aElectronic apparatus and appliances$xCongresses$xDesign and construction
606   $aMicroelectronics industry$xTechnological innovations$xCongresses
606   $aElectrical & Computer Engineering$2HILCC
606   $aElectrical Engineering$2HILCC
606   $aEngineering & Applied Sciences$2HILCC
615  0$aMicroelectronic packaging$xCongresses
615  0$aElectronic apparatus and appliances$xCongresses$xDesign and construction
615  0$aMicroelectronics industry$xTechnological innovations$xCongresses
615  7$aElectrical & Computer Engineering
615  7$aElectrical Engineering
615  7$aEngineering & Applied Sciences
676   $a621.381/046
712 02$aComponents, Packaging & Manufacturing Technology Society
712 02$aInternational Microelectronics and Packaging Society
712 12$aIEMT/IMC Symposium
801  0$bPQKB
906   $aPROCEEDING
912   $a996199638003316
996   $a1998 2nd IEMT$92498123
997   $aUNISA