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035   $a(CKB)111026746722864
035   $a(SSID)ssj0000455139
035   $a(PQKBManifestationID)12194235
035   $a(PQKBTitleCode)TC0000455139
035   $a(PQKBWorkID)10399666
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035   $a(EXLCZ)99111026746722864
100   $a20160829d1998      uy              
101 0 $aeng
181   $ctxt
182   $cc
183   $acr
200 10$a1998 3rd International Conference on Adhesives Joining and Coating Technology in Electronic Manufacturing Proceedings
210 31$a[Place of publication not identified]$cI E E E$d1998
300   $aBibliographic Level Mode of Issuance: Monograph
311   $a0-7803-4934-2 
606   $aElectrical & Computer Engineering$2HILCC
606   $aElectrical Engineering$2HILCC
606   $aEngineering & Applied Sciences$2HILCC
615  7$aElectrical & Computer Engineering
615  7$aElectrical Engineering
615  7$aEngineering & Applied Sciences
676   $a621.381/046
702   $aConstable$b James H
712 02$aComponents, Packaging & Manufacturing Technology Society.
712 12$aAdhesives '98$f(1998 :$eBinghamton, New York)
801  0$bPQKB
906   $aPROCEEDING
912   $a996199451503316
996   $a1998 3rd International Conference on Adhesives Joining and Coating Technology in Electronic Manufacturing Proceedings$92408706
997   $aUNISA