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181   $ctxt
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200 10$a2006 IEEE International Integrated Reliability Workshop final report : Stanford Sierra Conference Center, S. Lake Tahoe, California, October 16-19, 2006
210 31$a[Place of publication not identified]$cElectron Devices Society$d2006
300   $aBibliographic Level Mode of Issuance: Monograph
311   $a1-4244-0296-4 
606   $aIntegrated circuits$xReliability$vCongresses
606   $aIntegrated circuits$xReliability$xWafer-scale integration$vCongresses
606   $aElectrical & Computer Engineering$2HILCC
606   $aEngineering & Applied Sciences$2HILCC
606   $aElectrical Engineering$2HILCC
615  0$aIntegrated circuits$xReliability
615  0$aIntegrated circuits$xReliability$xWafer-scale integration
615  7$aElectrical & Computer Engineering
615  7$aEngineering & Applied Sciences
615  7$aElectrical Engineering
676   $a621.3815
712 02$aIEEE Reliability Society
712 02$aIEEE Electron Devices Society
712 12$aInternational Integrated Reliability Workshop
801  0$bPQKB
906   $aPROCEEDING
912   $a996197886603316
996   $a2006 IEEE International Integrated Reliability Workshop final report : Stanford Sierra Conference Center, S. Lake Tahoe, California, October 16-19, 2006$92514867
997   $aUNISA