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100   $a20160829d2007      uy              
101 0 $aeng
181   $ctxt
182   $cc
183   $acr
200 10$aExtended abstracts of the Seventh International Workshop on Junction Technology : June 8-9, 2007, Kyoto, Japan
210 31$a[Place of publication not identified]$cIEEE$d2007
300   $aBibliographic Level Mode of Issuance: Monograph
311   $a1-4244-1103-3 
606   $aSemiconductors$xJunctions$vCongresses
606   $aSemiconductors$xDesign and construction$vCongresses
606   $aIntegrated circuits$xVery large scale integration$xDesign and construction$vCongresses
606   $aElectrical & Computer Engineering$2HILCC
606   $aEngineering & Applied Sciences$2HILCC
606   $aElectrical Engineering$2HILCC
615  0$aSemiconductors$xJunctions
615  0$aSemiconductors$xDesign and construction
615  0$aIntegrated circuits$xVery large scale integration$xDesign and construction
615  7$aElectrical & Computer Engineering
615  7$aEngineering & Applied Sciences
615  7$aElectrical Engineering
676   $a621.3815/2
712 02$aIEEE Electron Devices Society
712 02$aOyo Butsuri Gakkai Shirikon Tekunoroji Bunkakai.
712 02$aZhongguo dian zi xue hui
712 12$aInternational Workshop on Junction Technology
801  0$bPQKB
906   $aPROCEEDING
912   $a996197885203316
996   $aExtended abstracts of the Seventh International Workshop on Junction Technology : June 8-9, 2007, Kyoto, Japan$92532714
997   $aUNISA