LEADER 02072nam0 22003971i 450 001 UON00466685 005 20231205105147.4 010 $a978-28-658-9080-4$bVol. 1. 010 $a978-28-658-9081-1$bVol. 2. 010 $a978-28-658-9082-8$bOpera completa 100 $a20160418f2015 |0itac50 ba 101 $afre 102 $aFR 105 $a|||| 1|||| 200 1 $aAccattone$fPier Paolo Pasolini$gpréface par Carlo Levi$gtraduction de l'italien par Jean-Claude Zancarini pour le scénario d'Accattone et par Hervé Jougert-Laurencin pour les autres textes 205 $aParis : Macula$bc2015 210 $a2 vol.$cill. ; 24 cm 215 $aVol. 2.: Dossier Accattone / textes de Hervé Joubert-Laurencin ... [et al.]$dtraductions de l'italien de Marie Fabre et Anna Rocchi Pullberg. 316 $aPrezzo complessivo di due volumi$5IT-UONSI ITAII/2548 a 410 1$1001UON00467841$12001 $aˆLe ‰Film$1210 $aParis$cMacula 620 $aFR$dParis$3UONL002984 676 $a791.4372$cDescrizione, valutazione critica, sceneggiatura di singoli film$v21 700 1$aPASOLINI$bPier Paolo$3UONV118732$0153085 702 1$aFABRE$bMarie$3UONV231736 702 1$aJOUGERT-LAURENCIN$bHervé$3UONV231732 702 1$aLevi$bCarlo$3UONV009111 702 1$aROCCHI PULLBERG$bAnna$3UONV231737 702 1$aZANCARINI$bJean-Claude$3UONV231731 712 $aMacula$3UONV260744$4650 801 $aIT$bSOL$c20250214$gRICA 912 $aUON00466685 950 $aSIBA - SISTEMA BIBLIOTECARIO DI ATENEO$dSI ITA II 2548 b $eSI 17956 7 2548 b 950 $aSIBA - SISTEMA BIBLIOTECARIO DI ATENEO$dSI ITA II 2548 a $eSI 17955 7 2548 a Prezzo complessivo di due volumi 951 $aSIBA - SISTEMA BIBLIOTECARIO DI ATENEO$bSI2016448 1J 20160418 996 $aAccattone$91399066 997 $aUNIOR LEADER 04088nam 2200649 a 450 001 9911004764503321 005 20200520144314.0 010 $a1-283-15268-1 010 $a9786613152688 010 $a1-4377-7890-9 035 $a(CKB)2670000000092965 035 $a(EBL)727062 035 $a(OCoLC)735603879 035 $a(SSID)ssj0000507823 035 $a(PQKBManifestationID)12204191 035 $a(PQKBTitleCode)TC0000507823 035 $a(PQKBWorkID)10547606 035 $a(PQKB)10867948 035 $a(MiAaPQ)EBC727062 035 $a(PPN)153878134 035 $a(EXLCZ)992670000000092965 100 $a20110713d2011 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aAdhesives technology for electronic applications $ematerials, processing, reliability /$fJames J. Licari and Dale W. Swanson 205 $a2nd ed. 210 $aBoston $cElsevier$dc2011 215 $a1 online resource (415 p.) 225 1 $aMaterials and processes for electronic applications series 300 $aDescription based upon print version of record. 311 $a0-12-810370-1 311 $a1-4377-7889-5 320 $aIncludes bibliographical references and index. 327 $aFront Cover; Dedication; Adhesives Technology for Electronic Applications: Materials, Processing, Reliability; Copyright; Contents; Preface; Acknowledgments; Disclaimer; Chapter 1 -Introduction; 1.1 -Adhesive types and classifications; 1.2 -Summary of packaging technologies; 1.3 -History of adhesives in electronic applications; 1.4 -Comparison of polymer adhesives with metallurgical and vitreous attachment materials; 1.5 -Specifications; 1.6 -Market and market trends; References; Chapter 2 -Functions and theory of adhesives; 2.1 -Mechanical attachment; 2.2 -Electrical connections 327 $a2.3 -Thermal dissipation2.4 -Stress dissipation; References; Chapter 3 -Chemistry, Formulation, and Properties of Adhesives; 3.1 -Chemistry; 3.2 -Formulation additives; 3.3 -Formulation processes; 3.4 -Properties; References; Chapter 4 -Adhesive Bonding Processes; 4.1 -Cleaning; 4.2 -Surface treatments; 4.3 -Adhesive dispensing; 4.4 -Placement of devices and components; 4.5 -Curing; 4.6 -Rework; References; Chapter 5 -Applications; 5.1 -General applications; 5.2 -Specific applications; References; Chapter 6 -Reliability; 6.1 -Physics of failure methodology; 6.2 -Failure modes and mechanisms 327 $a6.3 -Reliability prediction and modeling6.4 -Qualification, quality control, and specifications; References; Chapter 7 -Test and Inspection Methods; 7.1 -Physical tests; 7.2 -Electrical tests; 7.3 -Environmental tests; 7.4 -Thermal tests; 7.5 -Mechanical and thermomechanical tests; 7.6 -Chemical analysis; References; Appendix; Conversion factors; Abbreviations, Acronyms, and Symbols; Index 330 $a Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups. The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this b 410 0$aMaterials and processes for electronic applications series. 606 $aElectronics$xMaterials 606 $aAdhesives 606 $aElectronic packaging 615 0$aElectronics$xMaterials. 615 0$aAdhesives. 615 0$aElectronic packaging. 676 $a621.381 700 $aLicari$b James J$01822366 701 $aSwanson$b Dale W$01822367 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9911004764503321 996 $aAdhesives technology for electronic applications$94388527 997 $aUNINA