LEADER 01916nam 2200337 450 001 996574960003316 005 20231211115046.0 010 $a1-5044-6343-9 024 7 $a10.1109/IEEESTD.2020.9036129 035 $a(CKB)5280000000208121 035 $a(NjHacI)995280000000208121 035 $a(EXLCZ)995280000000208121 100 $a20231211d2020 uy 0 101 0 $aeng 135 $aur||||||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$a1838-2019 - IEEE Standard for Test Access Architecture for Three-Dimensional Stacked Integrated Circuits /$fInstitute of Electrical and Electronics Engineers 210 1$aNew York, New York :$cIEEE,$d2020. 215 $a1 online resource (73 pages) 330 $aIEEE Std 1838 is a die-centric standard; it applies to a die that is intended to be part of a multi-die stack. This standard defines die-level features that, when compliant dies are brought together in a stack, comprise a stack-level architecture that enables transportation of control and data signals for the test of (1) intra-die circuitry and (2) inter-die interconnects in both (a) pre-stacking and (b) post-stacking situations, the latter for both partial and complete stacks in both pre-packaging, post-packaging, and board-level situations. The primary focus of inter-die interconnect technology addressed by this standard is through-silicon vias (TSVs); however, this does not preclude its use with other interconnect technologies such as wire-bonding. 606 $aMicrowave transmission lines$xStandards 615 0$aMicrowave transmission lines$xStandards. 676 $a621.38132 801 0$bNjHacI 801 1$bNjHacl 906 $aDOCUMENT 912 $a996574960003316 996 $a1838-2019 - IEEE Standard for Test Access Architecture for Three-Dimensional Stacked Integrated Circuits$92584729 997 $aUNISA LEADER 01023nam0 22002771i 450 001 UON00343025 005 20231205104305.950 100 $a20091104d1960 |0itac50 ba 101 $ager 102 $aDE 105 $a|||| 1|||| 200 1 $aProsa$fRobert Walser$gAuswahl und Nachwort von Walter Höllerer 210 $aBerlin und Frankfurt am Main$cSuhrkamp$dc1960 215 $a214 p., 1 ritr.$d20 cm. 620 $aDE$dBerlin$3UONL003157 620 $aDE$dFrankfurt am Main$3UONL003175 676 $a833$cLetteratura narrativa tedesca$v21 700 1$aWALSER$bRobert$3UONV173537$0176328 702 1$aHÖLLERER$bWalter$3UONV166499 712 $aSuhrkamp$3UONV260759$4650 801 $aIT$bSOL$c20240220$gRICA 899 $aSIBA - SISTEMA BIBLIOTECARIO DI ATENEO$2UONSI 912 $aUON00343025 950 $aSIBA - SISTEMA BIBLIOTECARIO DI ATENEO$dSI TED 25 I WAL $eSI ST 796 5 996 $aProsa$91361024 997 $aUNIOR