LEADER 01758oam 2200505zu 450 001 9910171005803321 005 20210803233436.0 010 $a1-315-79150-1 035 $a(CKB)1000000000577717 035 $a(SSID)ssj0000333056 035 $a(PQKBManifestationID)12083972 035 $a(PQKBTitleCode)TC0000333056 035 $a(PQKBWorkID)10355444 035 $a(PQKB)11297254 035 $a(EXLCZ)991000000000577717 100 $a20160829d1987 uy 101 0 $aeng 181 $ctxt 182 $cc 183 $acr 200 00$aGerontological social work with families : a guide to practice issues and service delivery 210 31$a[Place of publication not identified]$cHaworth Press$d1987 300 $aBibliographic Level Mode of Issuance: Monograph 311 $a0-86656-599-X 606 $aSocial work with older people$xServices for$zUnited States 606 $aOlder people$xFamily relationships$zUnited States 606 $aOlder people$xCare$zUnited States 606 $aOlder people$zUnited States 606 $aSocial Welfare & Social Work - General$2HILCC 606 $aSocial Welfare & Social Work$2HILCC 606 $aSocial Sciences$2HILCC 615 0$aSocial work with older people$xServices for 615 0$aOlder people$xFamily relationships 615 0$aOlder people$xCare 615 0$aOlder people 615 7$aSocial Welfare & Social Work - General 615 7$aSocial Welfare & Social Work 615 7$aSocial Sciences 676 $a362.6/042 702 $aDobrof$b Rose 801 0$bPQKB 906 $aBOOK 912 $a9910171005803321 996 $aGerontological social work with families : a guide to practice issues and service delivery$92249983 997 $aUNINA LEADER 00723nam a2200217 i 4500 001 991000358779707536 005 20020506125610.0 008 991016s|||| fr ||| | fre 035 $ab10689072-39ule_inst 035 $aEXGIL144197$9ExL 040 $aBiblioteca Interfacoltà$bita 100 1 $aLabiche, Eugene $0396096 245 10$aTheatre /$cLabiche 260 $aParis :$bGerard, 300 $a374 p. ;$c18 cm. 907 $a.b10689072$b02-04-14$c28-06-02 912 $a991000358779707536 945 $aLE002 Fondo Giudici A 1080$g1$iLE002G-2502$lle002$o-$pE0.00$q-$rn$so $t0$u0$v0$w0$x0$y.i1078312x$z28-06-02 996 $aThéâtre$9309925 997 $aUNISALENTO 998 $ale002$b01-01-99$cm$da $e-$ffre$gfr $h0$i1 LEADER 04506nam 2200613 450 001 9910787022703321 005 20230803205450.0 010 $a3-03826-636-1 035 $a(CKB)3710000000251918 035 $a(EBL)1910949 035 $a(SSID)ssj0001378389 035 $a(PQKBManifestationID)11801049 035 $a(PQKBTitleCode)TC0001378389 035 $a(PQKBWorkID)11339245 035 $a(PQKB)10166864 035 $a(Au-PeEL)EBL1910949 035 $a(CaPaEBR)ebr10951273 035 $a(OCoLC)893677821 035 $a(MiAaPQ)EBC1910949 035 $a(EXLCZ)993710000000251918 100 $a20141017h20142014 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$a11th international congress molded interconnect devices $escientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany /$fedited by Jo?rg Franke [and three others] 210 1$aPfaffikon, Switzerland :$cTTP,$d2014. 210 2$aEnfield, New Hampshire :$cTrans Tech Publications Ltd,$d[date of distribution not identified] 210 4$d©2014 215 $a1 online resource (119 p.) 225 1 $aAdvanced Materials Research,$x1662-8985 ;$vVolume 1038 300 $aDescription based upon print version of record. 311 $a3-03835-252-7 320 $aIncludes bibliographical references at the end of each chapters and index. 327 $a11th International Congress Molded Interconnect Devices - Scientific Proceedings; Preface and Committees; Table of Contents; Chapter 1: Development and Prototyping; Method for the Identification and Comparison of Alternative Process Chains Focusing on Economics Efficiency Analysis during the Conceptual Design of Mechatronic Integrated Devices; Novel Approach for the Implementation of 3D-MID Compatible Routing Functionalities into Computer-Aided Design Tools; Optimized Process Sequences for Prototyping of Molded Interconnect Devices; Integration of Functional Circuits into FDM Parts 327 $aChapter 2: Printing TechnologiesPrinting of Functional Structures on Molded 3D Devices; Electrical Functionalization of Thermoplastics by Combining Plasmadust Coating and Aerosol Jet Printing; Production of Miniaturized Sensor Structures on Polymer Substrates Using Inkjet Printing; Progress in the Manufacturing of Molded Interconnected Devices by 3D Microcontact Printing; Chapter 3: Materials and Manufacturing; Characterization of Electromagnetic Properties of MID Materials for High Frequency Applications up to 67 GHz 327 $aNovel Laser Induced Metallization for Three Dimensional Molded Interconnect Device Applications by Spray MethodExperimental Investigation of Laser Sintering of Conductive Adhesive for Functional Prototypes Produced by Embedding Stereolithography; MID Fabricated by Ultrasonic Processing; Usage of Industrial Robots as Flexible Handling Devices Supporting the Process of Three Dimensional Conductive Pattern Generation; Chapter 4: Manufacturing Processes; Study of MID Technologies for Automotive Lighting and Light Signaling Devices; Chapter 5: Assembly Technologies and Inspection 327 $aDesign and Solder Process Optimization in MID Technology for High Power ApplicationsChapter 6: Quality and Reliability; Hot Pin Pull Method - New Test Procedure for the Adhesion Measurement for 3D-MID; Keywords Index; Authors Index 330 $aCollection of selected, peer reviewed papers from the 11 th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. 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