LEADER 01009nam0 22002651i 450 001 UON00050570 005 20231205102224.222 100 $a20020107d1974 |0itac50 ba 101 $aeng 102 $aGB 105 $a|||| 1|||| 200 1 $aFieldwork in medieval archaeology$fChristopher Taylor 210 $aLondon$cB.T. Batsford$d1974 215 $a175 p.$cfig.$d22 cm 606 $aArcheologia Medievale$3UONC017315$2FI 620 $aGB$dLondon$3UONL003044 686 $aIG X D$cINTERESSE GENERALE - ARCHEOLOGIA - SCIENZE SUSSIDIARIE$2A 700 1$aTAYLOR$bChristopher$3UONV031935$0388730 712 $aBatsford$3UONV247727$4650 801 $aIT$bSOL$c20250919$gRICA 899 $aSIBA - SISTEMA BIBLIOTECARIO DI ATENEO$2UONSI 912 $aUON00050570 950 $aSIBA - SISTEMA BIBLIOTECARIO DI ATENEO$dSI IG X D 015 $eSI ARC2796 7 015 996 $aFieldwork in medieval archaeology$91147827 997 $aUNIOR LEADER 04597nam 22005175 450 001 9910254982603321 005 20251116155600.0 010 $a94-017-7512-5 024 7 $a10.1007/978-94-017-7512-0 035 $a(CKB)3710000000718383 035 $a(EBL)4533454 035 $a(DE-He213)978-94-017-7512-0 035 $a(MiAaPQ)EBC4533454 035 $a(PPN)194075346 035 $a(EXLCZ)993710000000718383 100 $a20160526d2016 u| 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$a3D Flash Memories /$fedited by Rino Micheloni 205 $a1st ed. 2016. 210 1$aDordrecht :$cSpringer Netherlands :$cImprint: Springer,$d2016. 215 $a1 online resource (391 p.) 300 $aDescription based upon print version of record. 311 08$a94-017-7510-9 320 $aIncludes bibliographical references at the end of each chapters and index. 327 $aDedication Page -- Foreword -- Preface -- Introduction -- About the Editor -- Acknowledgements -- 1 The Business of NAND -- 2 Reliability of 3D NAND Flash memories -- 3 3D Stacked NAND Flash memories -- 4 3D Charge Trap NAND Flash memories -- 5 3D Floating Gate NAND Flash memories -- 6 Advanced Architectures for 3D NAND Flash memories with vertical channel -- 7 3D VG-Type NAND Flash memories -- 8 RRAM Cross-point arrays -- 9 3D Multi-Chip Integration and Packaging Technology -- 10 BCH and LDPC Error Correction Codes for NAND Flash memories -- 11 Advanced algebraic and graph-based ECC schemes for modern NVMs -- 12 System-Level Considerations on Design of 3D NAND Flash memories -- Index. 330 $aThis book walks the reader through the next step in the evolution of NAND flash memory technology, namely the development of 3D flash memories, in which multiple layers of memory cells are grown within the same piece of silicon. It describes their working principles, device architectures, fabrication techniques and practical implementations, and highlights why 3D flash is a brand new technology. After reviewing market trends for both NAND and solid state drives (SSDs), the book digs into the details of the flash memory cell itself, covering both floating gate and emerging charge trap technologies. There is a plethora of different materials and vertical integration schemes out there. New memory cells, new materials, new architectures (3D Stacked, BiCS and P-BiCS, 3D FG, 3D VG, 3D advanced architectures); basically, each NAND manufacturer has its own solution. Chapter 3 to chapter 7 offer a broad overview of how 3D can materialize. The 3D wave is impacting emerging memories as well and chapter 8 covers 3D RRAM (resistive RAM) crosspoint arrays. Visualizing 3D structures can be a challenge for the human brain: this is way all these chapters contain a lot of bird?s-eye views and cross sections along the 3 axes. The second part of the book is devoted to other important aspects, such as advanced packaging technology (i.e. TSV in chapter 9) and error correction codes, which have been leveraged to improve flash reliability for decades. Chapter 10 describes the evolution from legacy BCH to the most recent LDPC codes, while chapter 11 deals with some of the most recent advancements in the ECC field. Last but not least, chapter 12 looks at 3D flash memories from a system perspective. Is 14nm the last step for planar cells? Can 100 layers be integrated within the same piece of silicon? Is 4 bit/cell possible with 3D? Will 3D be reliable enough for enterprise and datacenter applications? These are some of the questions that this book helps answering by providing insights into 3D flash memory design, process technology and applications. 606 $aComputer storage devices 606 $aElectronic circuits 606 $aMemory Structures$3https://scigraph.springernature.com/ontologies/product-market-codes/I12034 606 $aElectronic Circuits and Devices$3https://scigraph.springernature.com/ontologies/product-market-codes/P31010 606 $aCircuits and Systems$3https://scigraph.springernature.com/ontologies/product-market-codes/T24068 615 0$aComputer storage devices. 615 0$aElectronic circuits. 615 14$aMemory Structures. 615 24$aElectronic Circuits and Devices. 615 24$aCircuits and Systems. 676 $a004 702 $aMicheloni$b Rino$4edt$4http://id.loc.gov/vocabulary/relators/edt 906 $aBOOK 912 $a9910254982603321 996 $a3D Flash Memories$92288981 997 $aUNINA