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035   $a(IEEE)6183551
035   $a(OCoLC)793103961
035   $a(PPN)270633723
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035   $a(EXLCZ)992670000000166902
100   $a20110708d2012      uy         0
101 0 $aeng
135   $aur|n|---|||||
181   $ctxt
182   $cc
183   $acr
200 10$aElectrical modeling and design for 3D integration $e3D integrated circuits and packaging signal integrity, power integrity, and EMC /$fEr-Ping Li
210   $aHoboken, N.J. $cWiley$dc2012
215   $a1 online resource (390 p.)
300   $aDescription based upon print version of record.
311 08$a9780470623466 
311 08$a0470623462 
320   $aIncludes bibliographical references and index.
327   $aMacromodeling of Complex Interconnects in 3D Integration -- 2.5D Simulation Method for 3D Integrated Systems -- Hybrid Integral Equation Modeling Methods for 3D Integration -- Systematic Microwave Network Analysis for 3D Integrated Systems -- Modeling of Through-Silicon Vias (TSV) in 3D Integration.
330   $a New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems  Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and 
606   $aThree-dimensional integrated circuits
606   $aIntegrated circuits
615  0$aThree-dimensional integrated circuits.
615  0$aIntegrated circuits.
676   $a621.3815
686   $aTEC008050$2bisacsh
700   $aLi$b Er-Ping$01636077
801  0$bMiAaPQ
801  1$bMiAaPQ
801  2$bMiAaPQ
906   $aBOOK
912   $a9911020335303321
996   $aElectrical modeling and design for 3D integration$94417664
997   $aUNINA

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200 1 $aBasarapradipa$fShaktipada Rajaguru
210   $aCalcutta$c[s. n.]$d1966
215   $a143 p.$d23 cm
606   $aLetteratura bengali$xNarrativa$3UONC030997$2FI
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