LEADER 05541nam 2200709Ia 450 001 9911020256503321 005 20200520144314.0 010 $a9786610838752 010 $a9781280838750 010 $a1280838752 010 $a9780470060490 010 $a0470060492 010 $a9780470060506 010 $a0470060506 035 $a(CKB)1000000000357114 035 $a(EBL)291033 035 $a(OCoLC)319546537 035 $a(SSID)ssj0000263623 035 $a(PQKBManifestationID)11207837 035 $a(PQKBTitleCode)TC0000263623 035 $a(PQKBWorkID)10274556 035 $a(PQKB)10295145 035 $a(MiAaPQ)EBC291033 035 $a(Perlego)2787902 035 $a(EXLCZ)991000000000357114 100 $a20060526d2007 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aUltra wideband signals and systems in communication engineering /$fM. Ghavami, L. B. Michael, R. Kohno 205 $a2nd ed. 210 $aChichester, England ;$aHoboken, NJ $cJohn Wiley$dc2007 215 $a1 online resource (336 p.) 300 $aPrevious ed.: 2004. 311 08$a9780470027639 311 08$a0470027630 320 $aIncludes bibliographical references (p. [287]-296) and index. 327 $aUltra Wideband Signals and Systems in Communication Engineering; Contents; Preface; Acknowledgments; List of Figures; List of Tables; Introduction; I.1 Ultra wideband overview; I.2 A note on terminology; I.3 Historical development of UWB; I.4 UWB regulation overview; I.4.1 Basic definitions and rules; I.5 Key benefits of UWB; I.6 UWB and Shannon's theory; I.7 Challenges for UWB; I.8 Summary; 1 Basic properties of UWB signals and systems; 1.1 Introduction; 1.2 Power spectral density; 1.3 Pulse shape; 1.4 Pulse trains; 1.5 Spectral masks; 1.6 Multipath; 1.7 Penetration characteristics 327 $a1.8 Spatial and spectral capacities1.9 Speed of data transmission; 1.10 Cost; 1.11 Size; 1.12 Power consumption; 1.13 Summary; 2 Generation of UWB waveforms; 2.1 Introduction; 2.1.1 Damped sine waves; 2.2 Gaussian waveforms; 2.3 Designing waveforms for specific spectral masks; 2.3.1 Introduction; 2.3.2 Multiband modulation; 2.4 Practical constraints and effects of imperfections; 2.5 Summary; 3 Signal-processing techniques for UWB systems; 3.1 The effects of a lossy medium on a UWB transmitted signal; 3.2 Time domain analysis; 3.2.1 Classification of signals; 3.2.2 Some useful functions 327 $a3.2.3 Some useful operations3.2.4 Classification of systems; 3.2.5 Impulse response; 3.2.6 Distortionless transmission; 3.3 Frequency domain techniques; 3.3.1 Fourier transforms; 3.3.2 Frequency response approaches; 3.3.3 Transfer function; 3.3.4 Laplace transform; 3.3.5 z-transform; 3.3.6 The relationship between the Laplace transform, the Fourier transform, and the z-transform; 3.4 UWB signal-processing issues and algorithms; 3.5 Detection and amplification; 3.6 Summary; 4 UWB channel modeling; 4.1 A simplified UWB multipath channel model; 4.1.1 Number of resolvable multipath components 327 $a4.1.2 Multipath delay spread4.1.3 Multipath intensity profile; 4.1.4 Multipath amplitude-fading distribution; 4.1.5 Multipath arrival times; 4.2 Path loss model; 4.2.1 Free space loss; 4.2.2 Refraction; 4.2.3 Reflection; 4.2.4 Diffraction; 4.2.5 Wave clutter; 4.2.6 Aperture-medium coupling loss; 4.2.7 Absorption; 4.2.8 Example of free space path loss model; 4.3 Two-ray UWB propagation model; 4.3.1 Two-ray path loss; 4.3.2 Two-ray path loss model; 4.3.3 Impact of path loss frequency selectivity on UWB transmission; 4.4 Frequency domain autoregressive model; 4.4.1 Poles of the AR model 327 $a4.5 IEEE proposals for UWB channel models4.5.1 An analytical description of the IEEE UWB indoor channel model; 4.6 Summary; 5 UWB communications; 5.1 Introduction; 5.2 UWB modulation methods; 5.2.1 PPM; 5.2.2 BPM; 5.3 Other modulation methods; 5.3.1 OPM; 5.3.2 PAM; 5.3.3 OOK; 5.3.4 Summary of UWB modulation methods; 5.4 Pulse trains; 5.4.1 Gaussian pulse train; 5.4.2 PN channel coding; 5.4.3 Time-hopping PPM UWB system; 5.5 UWB transmitter; 5.6 UWB receiver; 5.6.1 Detection; 5.6.2 Pulse integration; 5.6.3 Tracking; 5.6.4 Rake receivers; 5.7 Multiple access techniques in UWB 327 $a5.7.1 Frequency division multiple access UWB 330 $aThe thoroughly revised and updated second edition of Ultra Wideband Signals and Systems in Communication Engineering features new standards, developments and applications. It addresses not only recent developments in UWB communication systems, but also related IEEE standards such as IEEE 802.15 wireless personal area network (WPAN). Examples and problems are included in each chapter to aid understanding. Enhanced with new chapters and several sections including Standardization, advanced topics in UWB Communications and more applications, this book is essential reading for senior unde 606 $aBroadband communication systems 606 $aUltra-wideband devices 615 0$aBroadband communication systems. 615 0$aUltra-wideband devices. 676 $a621.382 676 $a621.3821 700 $aGhavami$b M$0892233 701 $aMichael$b L. B$01841885 701 $aKohno$b R$0892235 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9911020256503321 996 $aUltra wideband signals and systems in communication engineering$94421775 997 $aUNINA LEADER 03206nam 22005173 450 001 9911019458603321 005 20240602090312.0 010 $a9781119179283 010 $a1119179289 010 $a9781119179290 010 $a1119179297 035 $a(MiAaPQ)EBC31357617 035 $a(Au-PeEL)EBL31357617 035 $a(CKB)32170745900041 035 $a(Exl-AI)31357617 035 $a(Perlego)4430151 035 $a(EXLCZ)9932170745900041 100 $a20240602d2024 uy 0 101 0 $aeng 135 $aurcnu|||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aThermal Management for Opto-Electronics Packaging and Applications 205 $a1st ed. 210 1$aNewark :$cJohn Wiley & Sons, Incorporated,$d2024. 210 4$dİ2024. 215 $a1 online resource (370 pages) 311 08$a9781119179276 311 08$a1119179270 327 $aCover -- Title Page -- Copyright Page -- Contents -- List of Nomenclatures -- About the Authors -- Preface -- Chapter 1 Introduction -- 1.1 Development History of Packaging -- 1.1.1 BGA -- 1.1.2 CSP -- 1.1.3 MCM -- 1.1.4 3D Packaging -- 1.2 Heat Generation in Opto-electronic Package -- 1.2.1 Heat Generation Due to Nonradiative Recombination -- 1.2.2 Heat Generation Due to Shockley?Read?Hall (SRH) Recombination -- 1.2.3 Heat Generation Due to Auger Recombination -- 1.2.4 Heat Generation Due to Surface Recombination -- 1.2.5 Heat Generation Due to Current Crowding and Overflow -- 1.2.6 Heat Generation Due to Light Absorption -- 1.3 Thermal Issues and Challenges -- 1.3.1 Thermal Management -- 1.3.2 Mechanical/Electrical Reliability -- 1.4 Organization Arrangement -- References -- Chapter 2 Thermal Conduction and Solutions -- 2.1 Concept of Thermal Conduction -- 2.2 Thermal Resistance -- 2.2.1 Basic Concept of Thermal Resistance -- 2.2.2 Thermal Contact Resistance$7Generated by AI. 330 $aThis book, authored by Xiaobing Luo, Run Hu, and Bin Xie, focuses on the thermal management of packaging and its applications. It delves into the development history of packaging technologies, the challenges of heat generation in electronic packages, and various thermal management solutions. Key topics include thermal conduction, convection, radiation, and the use of advanced materials such as graphene and phase-change materials. The book also explores opto-thermal modeling and the enhancement of thermal interface materials. It aims to provide comprehensive knowledge for engineers, researchers, and students in the field of thermal management in electronics.$7Generated by AI. 606 $aElectronic packaging$7Generated by AI 606 $aHeat engineering$7Generated by AI 615 0$aElectronic packaging 615 0$aHeat engineering 700 $aLuo$b Xiaobing$01761564 701 $aHu$b Run$01761565 701 $aXie$b Bin$0696064 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9911019458603321 996 $aThermal Management for Opto-Electronics Packaging and Applications$94417246 997 $aUNINA