LEADER 01236nas2-2200373---450- 001 990006075170203316 005 20150918122452.0 010 $a978-2-8107-0320-3 035 $a000607517 035 $aUSA01000607517 035 $a(ALEPH)000607517USA01 035 $a000607517 100 $a20141013d2014----km-y0itay50------ba 101 $afre 102 $aFR 105 $a||||||||001yy 200 1 $a<<95/2014 : >> Seneque, un philosophe homme de theatre?$eActes de la Table ronde de Paris del 30-31 mars 2012 (Musée d'art et d'histoire de Saint-Denis / ENS rue d'Ulm)$fcoordinateur Jean-Pierre Aygon 210 $aToulouse$cPresses Universitaires du Mirail$d2014 215 $a208 p.$d23 cm 410 0$12001 454 1$12001 461 1$10010104340$12001$aPallas 600 1$aSeneca,$2BNCF$bLucio Anneo 676 $a872.01 700 1$aAYGON,$bJean-Pierre$0753588 801 0$aIT$bsalbc$gISBD 912 $a990006075170203316 951 $aV.3.B. 583$b250444 L.M.$cV.3.B.$d378893 959 $aBK 969 $aUMA 979 $aALESSANDRA$b90$c20150918$lUSA01$h1214 979 $aALESSANDRA$b90$c20150918$lUSA01$h1224 996 $a95/2014 : Seneque, un philosophe homme de theatre$91516035 997 $aUNISA LEADER 05363nam 22006734a 450 001 9911020182703321 005 20200520144314.0 010 $a9786610349630 010 $a9781280349638 010 $a1280349638 010 $a9780470007808 010 $a047000780X 010 $a9780470007792 010 $a0470007796 035 $a(CKB)1000000000354588 035 $a(EBL)252635 035 $a(OCoLC)77133727 035 $a(SSID)ssj0000190213 035 $a(PQKBManifestationID)11199405 035 $a(PQKBTitleCode)TC0000190213 035 $a(PQKBWorkID)10165778 035 $a(PQKB)10750000 035 $a(MiAaPQ)EBC252635 035 $a(Perlego)2770531 035 $a(EXLCZ)991000000000354588 100 $a20051118d2006 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 00$aLead-free electronics /$fedited by Sanka Ganesan, Michael Pecht 210 $aHoboken, N.J. $cWiley-Interscience$dc2006 215 $a1 online resource (796 p.) 300 $aDescription based upon print version of record. 311 08$a9780471786177 311 08$a0471786179 320 $aIncludes bibliographical references and index. 327 $aLead-free Electronics; Contents; Preface; Editors; Contributors; Acknowledgments; Chapter 1 Lead-free Electronics: Overview; 1.1 What Is Lead-free?; 1.2 Why Lead-free?; 1.2.1 Legislation; 1.2.2 Market differentiation; 1.2.3 Environmental stewardship; 1.3 Who Are the First Consumers for Lead-free Products?; 1.3.1 Affluent societies; 1.3.2 Social/cultural motivation; 1.3.3 Consumer response to lead-free electronics; 1.4 Are There Any Technical Barriers to Lead-free Electronics?; 1.4.1 Technical issues; 1.4.2 Reliability concerns; 1.5 How Will We Migrate to Lead-free Electronics? 327 $a1.5.1 Potential mismatches: obsolescence and compatibility1.5.2 Supply chain issues; 1.6 When Will Lead-free Products Be Widely Available?; 1.6.1 Recycling and material recovery systems; 1.7 summary; 1.8 References; Chapter 2 Lead-free Legislations, Exemptions, and Compliance; 2.1 Overview of the Lead-free Legislation; 2.1.1 WEEE Directive; 2.1.2 RoHS Directive; 2.1.3 Electronic Waste Recycling Act in California; 2.1.4 Hazardous material ban in China; 2.2 Exemptions; 2.2.1 Lead in glass of cathode ray tubes, electronic components and fluorescent tubes 327 $a2.2.2 Lead in high melting temperature type solders2.2.3 Lead in solders for servers, storage and storage array systems; 2.2.4 Lead in solders for network infrastructure equipment; 2.2.5 Lead in electronic ceramic parts; 2.3 Impact of Exemptions; 2.3.1 Military electronics; 2.3.2 Automotive electronics; 2.3.3 Avionics; 2.3.4 Oil and gas well electronics; 2.3.5 Medical electronics; 2.3.6 Industrial. network infrastructure, server and storage electronics; 2.3.7 Risks due to exemptions; 2.4 Compliance with the Legislation; 2.5 Recommendations and Conclusions; 2.6 References 327 $aChapter 3 Lead-free Alloys: Overview3.1 Lead-Free Alloys Requirements; 3.2 Binary Alloys; 3.3 Ternary and Quaternary Alloys; 3.3.1 Tin-silver-copper alloys; 3.3.2 Tin-silver-bismuth alloys; 3.3.3 Tin-silver-copper-bismuth alloy; 3.3.4 Tin-silver-copper-antimony alloy; 3.3.5 Tin-zinc-bismuth alloy; 3.3.6 Worldwide suppliers for lead-free alloys; 3.4 Summary; 3.5 References; Chapter 4 Lead-free Manufacturing; 4.1 Introduction; 4.2 Alloy Selection; 4.2.1 Sn58Bi; 4.2.2 SnZnBi; 4.2.3 SnAgBi; 4.2.4 Sn3.5Ag; 4.2.5 Sn0.7Cu; 4.2.6 SnAgCU; 4.2.7 Summary of alloy selection for reflow soldering 327 $a4.3 Alloy Selection for Wave Soldering4.4 Characteristics of Selected Tin-Silver-Copper Alloy; 4.4.1 Various compositions; 4.4.2 Reflow characteristics; 4.5 Considerations and Tests for Lead-free Components; 4.5.1 Suggested test requirements for lead-free components; 4.6 Assuring Material Readiness for Lead-free Assembly; 4.7 Tracing Lead-free Systems; 4.7.1 Process change notices (PCN); 4.7.2 Component part numbers (CPN); 4.8 Solder Paste Handling; 4.9 Surface-Mount Assembly Process; 4.9.1 Screen printing; 4.9.2 Pick and place; 4.9.3 Reflow; 4.10 Wave Solder Process 327 $a4.10.1 Materials considerations for wave soldering 330 $aLead-free Electronics provides guidance on the design and use of lead-free electronics as well as technical and legislative perspectives. All the complex challenges confronting the elec-tronics industry are skillfully addressed:* Complying with state legislation* Implementing the transition to lead-free electronics, including anticipating associated costs and potential supply chain issues* Understanding intellectual property issues in lead-free alloys and their applications, including licensing and infringement* Implementing cost effective manufacturing and testing* Reducin 606 $aElectronic apparatus and appliances 606 $aLead-free electronics manufacturing processes 615 0$aElectronic apparatus and appliances. 615 0$aLead-free electronics manufacturing processes. 676 $a621.3815 701 $aGanesan$b Sanka$0771351 701 $aPecht$b Michael$0719287 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9911020182703321 996 $aLead-free electronics$91574008 997 $aUNINA