LEADER 02365oam 2200673 a 450 001 9910692090303321 005 20210112081432.0 035 $a(CKB)5470000002350517 035 9 $aocm52631858 035 $a(OCoLC)52631858$z(OCoLC)664539577 035 $a(EXLCZ)995470000002350517 100 $a20030717d1980 ua 0 101 0 $aeng 135 $aurbn||||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 14$aThe quality of water discharging from the New River and Clear Fork basins, Tennessee /$fby R.S. Parker and W.P. Carey ; prepared in cooperation with the U.S. Soil Conservation Service, the U.S. Army Corps of Engineers, the Tennessee Valley Authority, the University of Tennessee at Knoxville, and the Tennessee Division of Geology 210 1$aNashville, Tenn. :$cU.S. Geological Survey, Water Resources Division,$d[1980] 215 $a1 online resource (vi, 52 pages) $cillustrations, maps 225 1 $aWater-resources investigations ;$v80-37 300 $aTitle from title screen (viewed May 28, 2003). 300 $a"August 1980." 320 $aIncludes bibliographical references. 606 $aWater$xPollution$zClear Fork Watershed (Tenn. and Ky.) 606 $aWater$xPollution$zTennessee$zNew River Watershed 606 $aWater quality$zTennessee 606 $aWater$xPollution$2fast 606 $aWater quality$2fast 607 $aTennessee$2fast 607 $aTennessee$zNew River Watershed$2fast 607 $aUnited States$zClear Fork Watershed$2fast 615 0$aWater$xPollution 615 0$aWater$xPollution 615 0$aWater quality 615 7$aWater$xPollution. 615 7$aWater quality. 700 $aParker$b Randolph S$01385397 701 $aCarey$b William P$01385398 712 02$aGeological Survey (U.S.).$bWater Resources Division. 801 0$bGPO 801 1$bGPO 801 2$bOCLCQ 801 2$bAGL 801 2$bOCLCE 801 2$bOCLCQ 801 2$bOCLCF 801 2$bOCLCO 801 2$bOCLCQ 801 2$bBUF 801 2$bLWA 801 2$bUOK 801 2$bOCLCA 801 2$bINT 801 2$bOCLCQ 906 $aBOOK 912 $a9910692090303321 996 $aThe quality of water discharging from the New River and Clear Fork basins, Tennessee$93432863 997 $aUNINA LEADER 06076nam 2200829 a 450 001 9911019683103321 005 20200520144314.0 010 $a9786613072368 010 $a9781283072366 010 $a128307236X 010 $a9780470886656 010 $a047088665X 010 $a9780470886793 010 $a047088679X 010 $a9780470950012 010 $a0470950013 010 $a9780470886786 010 $a0470886781 035 $a(CKB)2550000000032153 035 $a(EBL)698705 035 $a(SSID)ssj0000482387 035 $a(PQKBManifestationID)11306136 035 $a(PQKBTitleCode)TC0000482387 035 $a(PQKBWorkID)10524996 035 $a(PQKB)10724093 035 $a(MiAaPQ)EBC698705 035 $z(PPN)17022449X 035 $a(PPN)156594846 035 $a(OCoLC)714797067 035 $a(FR-PaCSA)88803209 035 $a(FRCYB88803209)88803209 035 $a(Perlego)1012431 035 $a(EXLCZ)992550000000032153 100 $a20100723d2010 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 00$aStructural dynamics of electronic and photonic systems /$fedited by Ephraim Suhir, David S. Steinberg, T.X. Yu 210 $aHoboken, N.J. $cWiley$d2010 215 $a1 online resource (610 p.) 300 $aIncludes index. 311 08$a9780470250020 311 08$a047025002X 327 $aStructural Dynamics of Electronic and Photonic Systems; Contents; Preface; Contributors; 1 Some Major Structural Dynamics-Related Failure Modes and Mechanisms in Micro- and Opto-Electronic Systems and Dynamic Stability of These Systems; 2 Linear Response to Shocks and Vibrations; 3 Linear and Nonlinear Vibrations Caused by Periodic Impulses; 4 Random Vibrations of Structural Elements in Electronic and Photonic Systems; 5 Natural Frequencies and Failure Mechanisms of Electronic and Photonic Structures Subjected to Sinusoidal or Random Vibrations 327 $a6 Drop/Impact of Typical Portable Electronic Devices: Experimentation and Modeling7 Shock Test Methods and Test Standards for Portable Electronic Devices; 8 Dynamic Response of Solder Joint Interconnections to Vibration and Shock; 9 Test Equipment, Test Methods, Test Fixtures, and Test Sensors for Evaluating Electronic Equipment; 10 Correlation between Package-Level High-Speed Solder Ball Shear/Pull and Board-Level Mechanical Drop Tests with Brittle Fracture Failure Mode, Strength, and Energy 327 $a11 Dynamic Mechanical Properties and Microstructural Studies of Lead-Free Solders in Electronic Packaging12 Fatigue Damage Evaluation for Microelectronic Components Subjected to Vibration; 13 Vibration Considerations for Sensitive Research and Production Facilities; 14 Applications of Finite Element Analysis: Attributes and Challenges; 15 Shock Simulation of Drop Test of Hard Disk Drives; 16 Shock Protection of Portable Electronic Devices Using a "Cushion" of an Array of Wires (AOW); 17 Board-Level Reliability of Lead-Free Solder under Mechanical Shock and Vibration Loads 327 $a18 Dynamic Response of PCB Structures to Shock Loading in Reliability Tests19 Linear Response of Single-Degree-of-Freedom System to Impact Load: Could Shock Tests Adequately Mimic Drop Test Conditions?; 20 Shock Isolation of Micromachined Device for High-g Applications; 21 Reliability Assessment of Microelectronics Packages Using Dynamic Testing Methods; 22 Thermal Cycle and Vibration/Drop Reliability of Area Array Package Assemblies; 23 Could an Impact Load of Finite Duration Be Substituted with an Instantaneous Impulse?; Index 330 $a"The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer's viewpoint will be conducted to the key components' level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice"--$cProvided by publisher. 330 $a"The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading"--$cProvided by publisher. 606 $aElectronic apparatus and appliances$xReliability 606 $aOptoelectronic devices$xReliability 606 $aFault tolerance (Engineering) 606 $aMicrostructure 606 $aStructural dynamics 615 0$aElectronic apparatus and appliances$xReliability. 615 0$aOptoelectronic devices$xReliability. 615 0$aFault tolerance (Engineering) 615 0$aMicrostructure. 615 0$aStructural dynamics. 676 $a621.382 701 $aSuhir$b Ephraim$01840398 701 $aYu$b T. X$g(Tongxi),$f1941-$01604361 701 $aSteinberg$b David S$043610 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9911019683103321 996 $aStructural dynamics of electronic and photonic systems$94419923 997 $aUNINA