LEADER 00991nam 2200349 450 001 9910793489503321 005 20230814231139.0 010 $a80-246-4101-1 035 $a(CKB)4100000007742526 035 $a(MiAaPQ)EBC5720125 035 $a(EXLCZ)994100000007742526 100 $a20190321d2018 uy 0 101 0 $acze 135 $aurcnu|||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aAnatomie Pro Nele?kar?ske? Zdravotnicke? Obory /$fDavid Kachli?k 210 1$a[Place of publication not identified] :$cKarolinum,$d2018. 215 $a1 online resource (153 pages) 311 $a80-246-4058-9 606 $aAnatomy 615 0$aAnatomy. 676 $a612 700 $aKachlik$b David$01546293 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910793489503321 996 $aAnatomie Pro Nele?kar?ske? Zdravotnicke? Obory$93801775 997 $aUNINA LEADER 08586nam 2200685Ia 450 001 9911019340303321 005 20200520144314.0 010 $a9786611032487 010 $a9781281032485 010 $a1281032484 010 $a9780470171479 010 $a0470171472 010 $a9780470171462 010 $a0470171464 024 7 $a10.1002/9780470171479 035 $a(CKB)1000000000376983 035 $a(EBL)316186 035 $a(SSID)ssj0000190214 035 $a(PQKBManifestationID)11165849 035 $a(PQKBTitleCode)TC0000190214 035 $a(PQKBWorkID)10166739 035 $a(PQKB)11051223 035 $a(MiAaPQ)EBC316186 035 $a(CaBNVSL)mat05201530 035 $a(IDAMS)0b0000648104a9eb 035 $a(IEEE)5201530 035 $a(OCoLC)181369032 035 $a(PPN)273202243 035 $a(Perlego)2763152 035 $a(EXLCZ)991000000000376983 100 $a20070602d2007 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 00$aLead-free electronics $eiNEMI projects lead to successful manufacturing /$fedited by Edwin Bradley ... [et al.] 210 $aHoboken, N. J. $cWiley ;$aPiscataway, N. J. $cIEEE Press$dc2007 215 $a1 online resource (468 p.) 300 $aDescription based upon print version of record. 311 08$a9780471448877 311 08$a0471448877 320 $aIncludes bibliographical references and index. 327 $aPreface (Ronald W. Gedney) -- Contributors -- Introduction (Jasbir Bath and Carol A. Handwerker) -- Lead-Free Assembly Project -- Alloy Group -- Process Group -- Component Group -- Reliability Group -- Follow-On Projects/Work -- 1. Alloy Selection (Carol A. Handwerker, Ursula Kattner, Kilwon Moon, Jasbir Bath, Edwin Bradley, and Polina Snugovsky) -- 1.1. Introduction -- 1.2. Lead-Free Alloys Considered by iNEMI in 1999 as Replacements for Tin-Lead Eutectic Solder -- 1.3. Fundamental Properties of Lead-Free Solder Alloys Affecting Manufacturing and Reliability -- 1.4. R&D Issues Remaining in Lead-Free Solder Implementation -- 1.5. Summary -- References -- 2. Review and Analysis of Lead-Free Solder Material Properties (Jean-Paul Clech) -- 2.1. Introduction -- 2.2. Tin-Lead Properties and Models -- 2.3. Tin-Silver Properties and Creep Data -- 2.4. Tin-Silver-Copper Properties and Creep Data -- 2.5. Alloy Comparisons -- 2.6. General Conclusions/Recommendations -- Appendix A: Tin-Silver Creep Data -- Appendix B: Tin-Silver-Copper Creep Data -- Acknowledgments -- References -- 3. Lead-Free Solder Paste Technology (Ning-Cheng Lee) -- 3.1. Introduction -- 3.2. Materials -- 3.3. Rheology -- 3.4. Applications -- 3.5. Reflow Soldering -- 3.6. Microstructures of Reflowed Joints -- 3.7. Challenges of Lead-Free Reflow Soldering -- 3.8. Summary -- References -- 4. Impact of Elevated Reflow Temperatures on Component Performance (Richard D. Parker, Jack MCCullen, Nick Lycoudes, and R. J. Arvikar) -- 4.1. Introduction to Component "Lead-Free? Issues -- 4.2. Moisture/Reflow Impact on Packaged Integrated Circuits -- 4.3. Impact of Increased Solder Peak Reflow Temperatures on Moisture Sensitivity Level Ratings -- 4.4. Impact of Increased Solder Peak Reflow Temperatures -- 4.5. Observations on Profiling for the Lead-Free Reflow Processes -- 4.6. IC Package Improvement Options for Better Package MSL at Higher Lead-Free Solder Reflow Temperatures. 327 $a4.7. Frequency Control Products -- 4.8. "Lead-Free? Cost Impact on Components -- 4.9. Packaging Identification of Lead-free Packaged ICs -- 4.10. Conclusions -- Acknowledgments -- References -- 5. Lead-Free Assembly Reliability--General (Edwin Bradley) -- 5.1. Introduction -- 5.2. Basic Physical Properties of Solder -- 5.3. Creep Deformation -- 5.4. Thermal Fatigue -- 5.5. Creep Rupture -- 5.6. Isothermal (Mechanical) Fatigue -- 5.7. Out-of-Plane Bending -- 5.8. Impact/Shock Loading -- 5.9. Effect of Rework on Reliability -- 5.10. High-Temperature Operating Life (HTOL) -- 5.11. Electrochemical Migration -- 5.12. Tin Whiskering -- 5.13. Tin Pest -- 5.14. Summary -- Acknowledgments -- References -- 6. Lead-Free Assembly Reliability: iNEMI Evaluation and Results (Elizabeth Benedetto and John Sohn) -- 6.1. Reliability Team Goals -- 6.2. Reliability Test Matrix -- 6.3. Component-Paste-Board Finish Combinations -- 6.4. Components -- 6.5. Test Vehicles -- 6.6. Pre-Test/Post-Assembly Information -- 6.7. CTE Determination: Component and Boards -- 6.8. Thermal Cycling Conditions -- 6.9. Failure Criteria -- 6.10. Thermal Cycle Relative Performance -- 6.11. Failure Data, Analysis Packages -- 6.12. Weibull Analyses -- 6.13. Post-Cycling Failure Analysis -- 6.14. Bend Testing -- 6.15. Electrochemical Migration Testing [36, 37] -- 6.16. iNEMI Team Conclusions -- 6.17. Overall Summary, Conclusions -- 6.18. ASTM Test Methods -- References -- 7. Tin Whiskers: Mitigation Strategies and Testing (Heidi L. Reynolds, C. J. Lee, and Joe Smetana) -- 7.1. Introduction -- 7.2. Mitigation Strategies -- 7.3. Tin Whisker Test Development -- 7.4. Summary -- Acknowledgments -- References -- 8. Lead-Free Reflow and Rework (Jasbir Bath) -- 8.1. Introduction -- 8.2. Printability of Lead-Free Solder Pastes -- 8.3. Soak Versus Ramp Temperature Profiles -- 8.4. Effect of Peak Temperature Versus Reflow Performance -- 8.5. Effect of Reflow Atmosphere on Solderability of Lead-Free Solder. 327 $a8.6. Convection Versus IR Reflow Ovens -- 8.7. Reflow Temperature Delta on Boards and Components -- 8.8. Visual Inspection of Lead-Free Soldered Joints -- 8.9. Automated Optical Inspection (AOI) -- 8.10. X-ray Inspection of Lead-Free Soldered Joints -- 8.11. Acoustic Microscopy Inspection of Components Before and After Lead-Free Reflow -- 8.12. Lead-Free Rework of BGA/CSP Soldered Joints -- 8.13. Lead-Free Hand-Soldering Rework -- 8.14. In-Circuit Testing and Functional Testing (ICT/FT) of Soldered Joints -- 8.15. Yield Data -- 8.16. Surface-Mount Fillet Lifting and Reliability of Reflowed Soldered Joints -- 8.17. Conclusions -- 8.18. Future Work -- Acknowledgments -- References -- 9. Case Study: Pb-Free Assembly, Rework, and Reliability Analysis of IPC Class 2 Assemblies (Jerry Gleason, Charlie Reynolds, Matt Kelly, Jasbir Bath, Quyen Chu, Ken Lyjak, and Patrick Roubaud) -- 9.1. Introduction -- 9.2. Approach and Strategy -- 9.3. Observations and Results -- 9.4. Conclusions -- 9.5. Summary -- Acknowledgments -- References -- 10. Implementing RoHS and WEEE-Compliant Products (Jim MCElroy and Cynthia Williams) -- 10.1. Introduction -- 10.2. Are Your Products within the Scope of the EU ROHS? -- 10.3. Ten Steps to ROHS Compliance -- 10.4. Part Numbering Important for Differentiating Lead-Free from Tin-Lead Components and Boards -- 10.5. A Standards-Based Approach to Materials Declaration -- 10.6. Standards -- 10.7. High-Reliability Requirements -- 10.8. Business Impact of Supply Chain Conversion -- 10.9. Summary -- References -- Index. 330 $aBased on the results of a more than two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing is the first practical, primary reference to cover Pb-free solder assembly as well as the analysis and reasoning behind the selection of Sn-Ag-Cu as the recommended Pb-free replacement for Sn-Pb. Reflecting the results of a two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing provides full coverage of the issues surrounding the implementation of Pb-free solder into electronic board assembly. This book is extremely timely???most electronic manufacturers are going to change over to Pb free soldering by 2006 to meet new European laws. All manufacturers around the globe are going to be affected by this change. The text provides specific results from the thirty company NEMI project activities. It contains integrated and fully documented book chapters with references to existing published work in the area. These serve as tremendous resources for engineers and companies faced with making the switch to Pb-free solder assembly. 606 $aLead-free electronics manufacturing processes 606 $aSolder and soldering 615 0$aLead-free electronics manufacturing processes. 615 0$aSolder and soldering. 676 $a621.381531 701 $aBradley$b Edwin$01697229 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9911019340303321 996 $aLead-free electronics$94077778 997 $aUNINA