LEADER 01329nam 2200385Ia 450 001 996393984003316 005 20200824124947.0 035 $a(CKB)3810000000004642 035 $a(EEBO)2240873940 035 $a(OCoLC)ocm11209716e 035 $a(OCoLC)11209716 035 $a(EXLCZ)993810000000004642 100 $a19840928d1657 uy | 101 0 $aeng 135 $aurbn||||a|bb| 200 12$aA summarie account of Mr. Iohn Dury's former and latter negotiation for the procuring of the true gospell peace$b[electronic resource] $ewith Christian moderation and charitable unity amongst the Protestant churches and academies 210 $aLondon $cPrinted for the author$d1657 215 $a[2], 46 p 300 $aReproduction of the original in the Harvard University Library. 330 $aeebo-0062 606 $aChristian union 606 $aChurch history$yModern period, 1500- 615 0$aChristian union. 615 0$aChurch history 700 $aDury$b John$f1596-1680.$0820763 801 0$bEAE 801 1$bEAE 801 2$bUMI 801 2$bm/c 801 2$bUMI 801 2$bWaOLN 906 $aBOOK 912 $a996393984003316 996 $aA summarie account of Mr. Iohn Dury's former and latter negotiation for the procuring of the true gospell peace$92328122 997 $aUNISA LEADER 02537oam 2200577zu 450 001 9911019322703321 005 20230617031312.0 010 $a1-280-55666-8 010 $a9786610556663 010 $a0-471-64826-4 010 $a0-471-64827-2 035 $a(CKB)1000000000019083 035 $a(SSID)ssj0000299220 035 $a(PQKBManifestationID)11266101 035 $a(PQKBTitleCode)TC0000299220 035 $a(PQKBWorkID)10240415 035 $a(PQKB)11598834 035 $a(MiAaPQ)EBC5247727 035 $a(Au-PeEL)EBL5247727 035 $a(CaONFJC)MIL55666 035 $a(OCoLC)1027132205 035 $a(NjHacI)991000000000019083 035 $a(EXLCZ)991000000000019083 100 $a20160829d2004 uy 101 0 $aeng 135 $aurcnu|||||||| 181 $ctxt 182 $cc 183 $acr 200 10$aIC Component Sockets 210 31$a[Place of publication not identified]$cJohn Wiley & Sons Incorporated$d2004 215 $a1 online resource (230 pages) 300 $aBibliographic Level Mode of Issuance: Monograph 311 $a0-471-46050-8 320 $aIncludes bibliographical references and index. 327 $a1. IC Component Socket Overview -- 2. Component Socket Properties -- 3. IC Component Socket Materials -- 4. Component Sockets for PTH Packages -- 5. Component Sockets for J-Leaded Packages -- 6. Component Sockets for Gull-wing Packages -- 7. Component Sockets for BGA Packages -- 8. Component Sockets for LGA Packages -- 9. Failure Modes and Mechanisms -- 10. Socket Testing and Qualification -- 11. Reliability Assessment -- 12. Standards and Specifications -- App. B. Socket Manufacturers. 330 $aAlthough Integrated Circuit (IC) component sockets have assumed an essential role in IC design, test, and performance upgrade, there is currently no single source covering all aspects of IC component sockets. This book is a valuable reference for IC managers and engineers who face the challenges of grasping the rapid evolution of interconnection technology. 606 $aPrinted circuits$xEquipment and supplies 606 $aElectric connectors 606 $aMicroelectronic packaging 615 0$aPrinted circuits$xEquipment and supplies. 615 0$aElectric connectors. 615 0$aMicroelectronic packaging. 676 $a621.381531 700 $aLiu$b Weifeng$01652184 702 $aPecht$b Michael 801 0$bPQKB 906 $aBOOK 912 $a9911019322703321 996 $aIC Component Sockets$94416152 997 $aUNINA