LEADER 03399nam  22007215  450 
001 9911015970103321
005 20250721130933.0
010   $a3-031-94795-9
024 7 $a10.1007/978-3-031-94795-7
035   $a(MiAaPQ)EBC32227084
035   $a(Au-PeEL)EBL32227084
035   $a(CKB)39694542900041
035   $a(DE-He213)978-3-031-94795-7
035   $a(OCoLC)1531323144
035   $a(EXLCZ)9939694542900041
100   $a20250721d2025      u|         0
101 0 $aeng
135   $aurcnu||||||||
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 10$aElectronic Materials Innovations and Reliability in Advanced Memory Packaging /$fby Chong Leong Gan, Chen Yu Huang
205   $a1st ed. 2025.
210  1$aCham :$cSpringer Nature Switzerland :$cImprint: Springer,$d2025.
215   $a1 online resource (278 pages)
225 1 $aSpringer Series in Reliability Engineering,$x2196-999X
311 08$a3-031-94794-0 
327   $aInfluences of Electronic Materials Properties on Packaging Reliability -- Mechanical and Thermal Stress of Encapsulant and New Materials in Memory Packaging -- Materials Development for Future Data Center Applications -- Advanced Chiplets and Heterogenous Integration in Memory Device Packaging -- Hybrid Bonding Device Packaging -- Hardware Reliability for Memory Modules and SSDs -- Innovative Sustainable Electronics Materials in Advanced Memory Packaging -- PCB and Substrate in Future Memory Applications.
330   $aThis book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD). The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.
410  0$aSpringer Series in Reliability Engineering,$x2196-999X
606   $aElectronics$xMaterials
606   $aElectronic circuits
606   $aElectronic circuit design
606   $aMaterials
606   $aIndustrial engineering
606   $aProduction engineering
606   $aElectronic Materials
606   $aElectronic Circuits and Systems
606   $aElectronics Design and Verification
606   $aMaterials Engineering
606   $aIndustrial and Production Engineering
615  0$aElectronics$xMaterials.
615  0$aElectronic circuits.
615  0$aElectronic circuit design.
615  0$aMaterials.
615  0$aIndustrial engineering.
615  0$aProduction engineering.
615 14$aElectronic Materials.
615 24$aElectronic Circuits and Systems.
615 24$aElectronics Design and Verification.
615 24$aMaterials Engineering.
615 24$aIndustrial and Production Engineering.
676   $a541.0421
676   $a621.3815
700   $aGan$b Chong Leong$01355814
701   $aHuang$b Chen-Yu$01834518
801  0$bMiAaPQ
801  1$bMiAaPQ
801  2$bMiAaPQ
906   $aBOOK
912   $a9911015970103321
996   $aElectronic Materials Innovations and Reliability in Advanced Memory Packaging$94410011
997   $aUNINA