LEADER 01094nam a2200289 i 4500 001 991001446479707536 005 20020507193613.0 008 980410s1996 uk ||| | eng 020 $a0582277825 035 $ab10848654-39ule_inst 035 $aLE01312386$9ExL 040 $aDip.to Matematica$beng 082 0 $a515.353 084 $aAMS 35S05 100 1 $aZaidman, Samuel$041530 245 10$aTopics in pseudo-differential operators /$cS. Zaidman 260 $aHarlow :$bLongman ; Reading, Mass. : Addison Wesley Longman,$c1996 300 $a117 p. ;$c25 cm. 490 0 $aPitman research notes in mathematics series, ISSN 02693674 ;$v359 500 $aIncludes bibliographical references and indexes 650 4$aPseudodifferential operators 907 $a.b10848654$b23-02-17$c28-06-02 912 $a991001446479707536 945 $aLE013 35S ZAI11 (1996)$g1$i2013000097497$lle013$o-$pE0.00$q-$rl$s- $t0$u0$v0$w0$x0$y.i1095966x$z28-06-02 996 $aTopics in pseudo-differential operators$9375056 997 $aUNISALENTO 998 $ale013$b01-01-98$cm$da $e-$feng$guk $h0$i1 LEADER 03449nam 22005295 450 001 9910350298303321 005 20230808181026.0 010 $a981-13-7224-1 024 7 $a10.1007/978-981-13-7224-7 035 $a(CKB)4100000008525920 035 $a(DE-He213)978-981-13-7224-7 035 $a(MiAaPQ)EBC5746944 035 $a(PPN)235667218 035 $a(EXLCZ)994100000008525920 100 $a20190403d2019 u| 0 101 0 $aeng 135 $aurnn#008mamaa 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aHeterogeneous integrations /$fby John H. Lau 205 $a1st ed. 2019. 210 1$aSingapore :$cSpringer Singapore :$cImprint: Springer,$d[2019]. 215 $a1 online resource (XXII, 368 p. 386 illus., 342 illus. in color.) 311 $a981-13-7223-3 327 $aChapter 1. Overview of 3D IC Heterogeneous Integrations -- Chapter 2. RDLs for Heterogeneous Integrations on Organic Substrates -- Chapter 3. RDLs for Heterogeneous Integration on Silicon (TSV-Interposers) -- Chapter 4. RDLs for Heterogeneous Integration on Silicon (Bridges) -- Chapter 5. RDLs for Heterogeneous Integration on Fan-Out Substrates -- Chapter 6. 3D IC Heterogeneous Integration in Memory Stacking -- Chapter 7. 3D IC Heterogeneous Integration in PoP Formats -- Chapter 8. 3D IC Heterogeneous Integration in Chip-to-Chip Formats -- Chapter 9. 3D IC Heterogeneous Integration with LED and VCSEL -- Chapter 10. Future Trends of 3D IC Heterogeneous Integrations. 330 $aHeterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc. 606 $aIntegrated circuits 606 $aElectronics 606 $aMicroelectronics 606 $aElectronic circuits 606 $aElectronics and Microelectronics, Instrumentation$3https://scigraph.springernature.com/ontologies/product-market-codes/T24027 606 $aCircuits and Systems$3https://scigraph.springernature.com/ontologies/product-market-codes/T24068 606 $aElectronic Circuits and Devices$3https://scigraph.springernature.com/ontologies/product-market-codes/P31010 615 0$aIntegrated circuits. 615 0$aElectronics. 615 0$aMicroelectronics. 615 0$aElectronic circuits. 615 14$aElectronics and Microelectronics, Instrumentation. 615 24$aCircuits and Systems. 615 24$aElectronic Circuits and Devices. 676 $a621.381 700 $aLau$b John H.$4aut$4http://id.loc.gov/vocabulary/relators/aut$0972648 906 $aBOOK 912 $a9910350298303321 996 $aHeterogeneous Integrations$92228299 997 $aUNINA LEADER 03933nam 22006375 450 001 9911010537003321 005 20250614130258.0 010 $a981-9617-58-8 024 7 $a10.1007/978-981-96-1758-6 035 $a(MiAaPQ)EBC32156804 035 $a(Au-PeEL)EBL32156804 035 $a(CKB)39300994900041 035 $a(OCoLC)1524424945 035 $a(DE-He213)978-981-96-1758-6 035 $a(EXLCZ)9939300994900041 100 $a20250614d2025 u| 0 101 0 $aeng 135 $aurcnu|||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aProceedings of International Conference on Information Technology and Applications $eICITA 2024 /$fedited by Abrar Ullah, Sajid Anwar 205 $a1st ed. 2025. 210 1$aSingapore :$cSpringer Nature Singapore :$cImprint: Springer,$d2025. 215 $a1 online resource (956 pages) 225 1 $aLecture Notes in Networks and Systems,$x2367-3389 ;$v1248 311 08$a981-9617-57-X 327 $aUnveiling the Hidden Pandemic of IoT Malware with Biological and Health Approaches -- Auditing Windows Bluetooth Security at the Application Layer -- Comparison of Machine Learning Models for Early Prediction of Diabetes with LIME Interpretability -- Pattern Recognition in Disaster Response: Leveraging Machine Learning for Twitter Analysis -- TTL: Transformer and Transfer Learning Approach To Detect Sunflower Disease -- The Moderating Role of Risk Aversion in an Extended UTAUT Cryptocurrency Adoption Model -- NLP on Text Messages using Sentimentality Investigation -- Audio-Visual Features-based Framework for Advertisement Detection from Sports Videos -- Context-aware Medical Question Answering: An Extended Transformers-Based Approach with BioBERT Encoding for Restricted Domain Queries -- Enhancing Seabass Detection in Aquaculture: A Step Towards Automated Behavioural Analysis using AI. 330 $aThis book includes high-quality papers presented at 18th International Conference on Information Technology and Applications (ICITA 2024), held in Sydney, Australia, during October 17?19, 2024. The book presents original research work of academics and industry professionals to exchange their knowledge of the state-of-the-art research and development in information technology and applications. The topics covered in the book are cloud computing, business process engineering, machine learning, evolutionary computing, big data analytics, internet of things and cyber-physical systems, information and knowledge management, computer vision and image processing, computer graphics and games?programming, mobile computing, ontology engineering, software and systems modeling, human computer interaction, online learning?/e-learning, computer networks, and web engineering. 410 0$aLecture Notes in Networks and Systems,$x2367-3389 ;$v1248 606 $aComputational intelligence 606 $aArtificial intelligence 606 $aTelecommunication 606 $aMathematical statistics$xData processing 606 $aComputational Intelligence 606 $aArtificial Intelligence 606 $aCommunications Engineering, Networks 606 $aStatistics and Computing 615 0$aComputational intelligence. 615 0$aArtificial intelligence. 615 0$aTelecommunication. 615 0$aMathematical statistics$xData processing. 615 14$aComputational Intelligence. 615 24$aArtificial Intelligence. 615 24$aCommunications Engineering, Networks. 615 24$aStatistics and Computing. 676 $a006.3 700 $aUllah$b Abrar$01733435 701 $aAnwar$b Sajid$01733436 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9911010537003321 996 $aProceedings of International Conference on Information Technology and Applications$94397493 997 $aUNINA