LEADER 04852oam 2200625 450 001 996465846503316 005 20210714233436.0 010 $a3-540-48309-8 024 7 $a10.1007/3-540-48309-8 035 $a(CKB)1000000000211123 035 $a(SSID)ssj0000322449 035 $a(PQKBManifestationID)11243191 035 $a(PQKBTitleCode)TC0000322449 035 $a(PQKBWorkID)10288072 035 $a(PQKB)10097934 035 $a(DE-He213)978-3-540-48309-0 035 $a(MiAaPQ)EBC3072945 035 $a(MiAaPQ)EBC6485640 035 $a(PPN)155199633 035 $a(EXLCZ)991000000000211123 100 $a20210714d1999 uy 0 101 0 $aeng 135 $aurnn|008mamaa 181 $ctxt 182 $cc 183 $acr 200 00$aDatabase and expert systems applications $e10th international conference, DEXA '99, Florence, Italy, August 30 - September 1999 : proceedings /$fTrevor Bench-Capon, Giovanni Soda and A. Min Tjoa (editors) 205 $a1st ed. 1999. 210 1$aBerlin, Heidelberg :$cSpringer,$d[1999] 210 4$d©1999 215 $a1 online resource (XXXVI, 1110 p.) 225 1 $aLecture Notes in Computer Science ;$v1460 300 $aBibliographic Level Mode of Issuance: Monograph 311 $a3-540-66448-3 320 $aIncludes bibliographical references at the end of each chapters and index. 327 $aInvited Talk -- Object-Orientation I -- Query Aspects I -- Fundamentals for Applications I -- Advanced Databases I -- Object-Orientation II -- Query Aspects II -- Fundamentals for Applications II -- Advanced Databases II -- Object-Orientation III -- Query Aspects III -- Fundamentals for Applications III -- Advanced Databases III -- Object-Orientation IV -- Using Contextual Fuzzy Views to Query Imprecise Data -- Combining Pat-Trees and Signature Files for Query Evaluation in Document Databases -- Answering Queries by Semantic Caches -- Fundamentals for Applications IV -- Advanced Databases IV -- Object-Orientation V -- Query Aspects V -- Fundamentals for Applications V -- Advanced Databases V -- Heterogeneous, Distributed and Federated Database Systems I -- Transactions I -- Applications I -- Data-Warehousing and Data-Mining I -- Heterogeneous, Distributed and Federated Database Systems II -- Transactions II -- Applications II -- Data-Warehousing and Data-Mining II -- Heterogeneous, Distributed and Federated Database Systems III -- Transactions III -- Spatial Aspects I -- World Wide Web Applications I -- Temporal Aspects -- Spatial Aspects II -- World Wide Web Applications II -- Invited Talk. 330 $aThe Database and Expert Systems Applications (DEXA) conferences bring together researchers and practitioners from all over the world to exchange ideas, experiences and opinions in a friendly and stimulating environment. The papers are at once a record of what has been achieved and the first steps towards shaping the future of information systems. DEXA covers a broad field, and all aspects of database, knowledge base and related technologies and their applications are represented. Once again there were a good number of submissions: 241 papers were submitted and of these the programme committee selected 103 to be presented. DEXA?99 took place in Florence and was the tenth conference in the series, following events in Vienna, Berlin, Valencia, Prague, Athens, London, Zurich, Toulouse and Vienna. The decade has seen many developments in the areas covered by DEXA, developments in which DEXA has played its part. I would like to express thanks to all the institutions which have actively supported and made possible this conference, namely: ? University of Florence, Italy ? IDG CNR, Italy ? FAW ? University of Linz, Austria ? Austrian Computer Society ? DEXA Association In addition, we must thank all the people who have contributed their time and effort to make the conference possible. Special thanks go to Maria Schweikert (Technical University of Vienna), M. Neubauer and G. Wagner (FAW, University of Linz). We must also thank all the members of the programme committee, whose careful reviews are important to the quality of the conference. 410 0$aLecture notes in computer science ;$v1460. 606 $aDatabase management$vCongresses 606 $aObject-oriented databases$vCongresses 606 $aExpert systems (Computer science)$vCongresses 615 0$aDatabase management 615 0$aObject-oriented databases 615 0$aExpert systems (Computer science) 676 $a005.74 702 $aBench-Capon$b Trevor 702 $aSoda$b Giovanni 702 $aTjoa$b A Min 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bUtOrBLW 906 $aBOOK 912 $a996465846503316 996 $aDatabase and Expert Systems Applications$9772107 997 $aUNISA LEADER 05365nam 2200649 a 450 001 9911007368603321 005 20200520144314.0 010 $a1-282-76970-7 010 $a0-08-094746-8 010 $a9786612769702 010 $a1-282-00282-1 010 $a9786612002823 010 $a0-8155-1773-4 035 $a(CKB)1000000000696162 035 $a(EBL)428546 035 $a(OCoLC)297184847 035 $a(SSID)ssj0000072257 035 $a(PQKBManifestationID)11107194 035 $a(PQKBTitleCode)TC0000072257 035 $a(PQKBWorkID)10094592 035 $a(PQKB)11406321 035 $a(MiAaPQ)EBC428546 035 $a(EXLCZ)991000000000696162 100 $a20070907d2008 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 00$aHandbook of silicon wafer cleaning technology /$fedited by Karen A. Reinhardt, Werner Kern 205 $a2nd ed. 210 $aNorwich, NY $cWilliam Andrew$dc2008 215 $a1 online resource (749 p.) 225 1 $aMaterials science & process technology series 300 $aDescription based upon print version of record. 311 $a0-8155-1554-5 320 $aIncludes bibliographical references and index. 327 $aFront Cover; Handbook of Silicon Wafer Cleaning Technology; Copyright Page; Contents; Foreword; Preface to the Second Edition; Preface to First Edition; PART I: INTRODUCTION AND OVERVIEW; Chapter 1. Overview and Evolution of Silicon Wafer Cleaning Technology; 1.1 Introduction; 1.2 Importance of Clean and Conditioned Wafer Surfaces; 1.3 Overview of Wafer Contamination Aspects; 1.4 Overview of Wafer Cleaning and Surface Conditioning Technology; 1.5 Evolution of Wafer Cleaning Science and Technology; 1.6 Summary and Conclusion; References 327 $aChapter 2. Overview of Wafer Contamination and Defectivity2.1 Wafer Contamination; 2.2 Behavior and Impact of Contamination; 2.3 Sources of Defects and Contamination; References; PART II: WET CHEMICAL PROCESS; Chapter 3. Particle Deposition and Adhesion; 3.1 Introduction to Particle Deposition and Adhesion; 3.2 Particle Transport, Deposition, and Adhesion; 3.3 Particle Adhesion; 3.4 Particle Removal; 3.5 Summary; References; Chapter 4. Aqueous Cleaning and Surface Conditioning Processes; 4.1 Overview of Aqueous Cleaning, Rinsing, and Drying Applications and Techniques 327 $a4.2 Common Chemistries and Their Applications4.3 Process Variables Affecting Cleaning; 4.4. Rinsing and Drying; 4.5 Aqueous Cleaning Equipment; 4.6 Current and Future Challenges; 4.7 Summary; Acknowledgments; References; PART III: DRY CLEANING PROCESSES; Chapter 5. Gas-phase Wafer Cleaning Technology; 5.1 Introduction and Overview of Gas-Phase and Vapor-Phase Cleaning and Surface Conditioning; 5.2 Chemistry and Mechanisms; 5.3 Removal of Silicon Oxides with HF Vapor; 5.4 O3 and UV/O3 for Organic Removal, Resist Stripping, and Surface Oxidation; 5.5 UV/Cl2 for Metallic Contamination Removal 327 $a5.6 Applications for Gas-Phase Cleaning5.7 Process Equipment; 5.8 Integrated Process Equipment; 5.9 Summary; Acknowledgments; References; Chapter 6. Plasma Stripping, Cleaning, and Surface Conditioning; 6.1 Introduction to Plasma Stripping and Cleaning; 6.2 Applications of Plasma Stripping, Cleaning, and Surface Conditioning; 6.3 Mechanisms of Plasma Stripping, Cleaning, and Surface Conditioning; 6.4 Plasma Stripping, Cleaning, and Surface Conditioning Equipment; 6.5 Plasma Diagnostics; 6.6 Plasma Damage; 6.7 Conclusions; Acknowledgments; References 327 $aChapter 7. Cryogenic Aerosols and Supercritical Fluid Cleaning7.1 Cryogenic and Supercritical Cleaning as Emerging Technologies; 7.2 Introduction to Cryogenic Aerosols; 7.3 Introduction to Supercritical and Densified Fluid Cleaning; 7.4 Summary; Acknowledgments; References; PART IV: ANALYTICAL AND CONTROL ASPECTS; Chapter 8. Detection and Measurement of Particulate Contaminants; 8.1 Measurements of Particle and Defects; 8.2 Defect and Particle Measurements on Wafers; 8.3 Particle Measurement in Liquid Chemicals; 8.4 Particle Measurement in Vacuum, Gas, and Air; Acknowledgements; References 327 $aChapter 9. Surface Chemical Composition and Morphology 330 $aThe second Edition of the Handbook of Silicon Wafer Cleaning Technology is intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. The integration of the clean processes into the device manufacturing flow will be presented with respect to other manufacturing steps such as thermal, implant, etching, and photolithography processes. The Handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue, and photoresist from wafer surfaces. Both the process and t 410 0$aMaterials science and process technology series. 606 $aSilicon-on-insulator technology 615 0$aSilicon-on-insulator technology. 676 $a621.3815/2 701 $aReinhardt$b Karen A$01678514 701 $aKern$b Werner$f1925-$01823206 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9911007368603321 996 $aHandbook of silicon wafer cleaning technology$94389757 997 $aUNINA