LEADER 05254nam 2200613Ia 450 001 9911006867503321 005 20200520144314.0 010 $a9786612002755 010 $a1-282-00275-9 010 $a1-282-00276-7 010 $a0-8155-1763-7 010 $a1-59124-079-4 035 $a(CKB)111056552537490 035 $a(EBL)566701 035 $a(OCoLC)729017802 035 $a(SSID)ssj0000072232 035 $a(PQKBManifestationID)11971877 035 $a(PQKBTitleCode)TC0000072232 035 $a(PQKBWorkID)10095725 035 $a(PQKB)10165753 035 $a(MiAaPQ)EBC566701 035 $a(EXLCZ)99111056552537490 100 $a19971010d1998 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aHandbook of physical vapor deposition (PVD) processing $efilm formation, adhesion, surface preparation and contamination control /$fby Donald M. Mattox 210 $aWestwood, NJ $cNoyes Publications$dc1998 215 $a1 online resource (947 p.) 300 $aDescription based upon print version of record. 311 $a0-8155-1422-0 320 $aIncludes bibliographical references and index. 327 $aFront Cover; Handbook of Physical Vapor Depositon (PVD) Processing: Film Formation, Adhesion, Surface Preparation and Contamination Control; Copyright Page; Dedication; Table of Contents; Chapter 1. Introduction; 1.1 SURFACE ENGINEERING; 1.2 THIN FILM PROCESSING; 1.3 PROCESS DOCUMENTATION; 1.4 SAFETY AND ENVIRONMENTAL CONCERNS; 1.5 UNITS; 1.6 SUMMARY; FURTHER READING; REFERENCES; Chapter 2. Substrate ("Real") Surfaces and Surface Modification; 2.1 INTRODUCTION; 2.2 MATERIALS AND FABRICATION; 2.3 ATOMIC STRUCTURE AND ATOM-PARTICLE INTERACTIONS 327 $a2.4 CHARACTERIZATION OF SURFACES AND NEAR-SURFACE REGIONS2.5 BULK PROPERTIES; 2.6 MODIFICATION OF SUBSTRATE SURFACES; 2.7 SUMMARY; FURTHER READING; REFERENCES; Chapter 3. The Low-Pressure Gas and Vacuum Processing Environment; 3.1 INTRODUCTION; 3.2 GASES AND VAPORS; 3.3 GAS-SURFACE INTERACTIONS; 3.4 VACUUM ENVIRONMENT; 3.5 VACUUM PROCESSING SYSTEMS; 3.6 VACUUM PUMPING; 3.7 VACUUM AND PLASMA COMPATIBLE MATERIALS; 3.8 ASSEMBLY; 3.9 EVALUATING VACUUM SYSTEM PERFORMANCE; 3.10 PURCHASING A VACUUM SYSTEM FOR PVD PROCESSING; 3.11 CLEANING OF VACUUM SURFACES; 3.12 SYSTEM-RELATED CONTAMINATION 327 $a3.13 PROCESS-RELATED CONTAMINATION3.14 TREATMENT OF SPECIFIC MATERIALS; 3.15 SAFETY ASPECTS OF VACUUM TECHNOLOGY; 3.16 SUMMARY; FURTHER READING; REFERENCES; Chapter 4. The Low-Pressure Plasma Processing Environment; 4.1 INTRODUCTION; 4.2 THE PLASMA; 4.3 PLASMA-SURFACE INTERACTIONS; 4.4 CONFIGURATIONS FOR GENERATING PLASMAS; 4.5 ION AND PLASMA SOURCES; 4.6 PLASMA PROCESSING SYSTEMS; 4.7 PLASMA-RELATED CONTAMINATION; 4.8 SOME SAFETY ASPECTS OF PLASMA PROCESSING; 4.9 SUMMARY; FURTHER READING; REFERENCES; Chapter 5. Vacuum Evaporation and Vacuum Deposition; 5.1 INTRODUCTION 327 $a5.2 THERMAL VAPORIZATION5.3 THERMAL VAPORIZATION SOURCES; 5.4 TRANSPORT OF VAPORIZED MATERIAL; 5.5 CONDENSATION OF VAPORIZED MATERIAL; 5.6 MATERIALS FOR EVAPORATION; 5.7 VACUUM DEPOSITION CONFIGURATIONS; 5.8 PROCESS MONITORING AND CONTROL; 5.9 CONTAMINATION FROM THE VAPORIZATION SOURCE; 5.10 ADVANTAGES AND DISADVANTAGES OF VACUUM DEPOSITION; 5.11 SOME APPLICATIONS OF VACUUM DEPOSITION; 5.12 GAS EVAPORATION AND ULTRAFINE PARTICLES; 5.13 OTHER PROCESSES; 5.14 SUMMARY; FURTHER READING; REFERENCES; Chapter 6. Physical Sputtering and Sputter Deposition (Sputtering; 6.1 INTRODUCTION 327 $a6.2 PHYSICAL SPUTTERING6.3 SPUTTERING CONFIGURATIONS; 6.4 TRANSPORT OF THE SPUTTER-VAPORIZED SPECIES; 6.5 CONDENSATION OF SPUTTERED SPECIES; 6.6 SPUTTER DEPOSITION GEOMETRIES; 6.7 TARGETS AND TARGET MATERIALS; 6.8 PROCESS MONITORING AND CONTROL; 6.9 CONTAMINATION DUE TO SPUTTERING; 6.10 ADVANTAGES AND DISADVANTAGES OF SPUTTER DEPOSITION; 6.11 SOME APPLICATIONS OF SPUTTER DEPOSITION; 6.12 SUMMARY; FURTHER READING; REFERENCES; Chapter 7. Arc Vapor Deposition; 7.1 INTRODUCTION; 7.2 ARCS; 7.3 ARC SOURCE CONFIGURATIONS; 7.4 REACTIVE ARC DEPOSITION; 7.5 ARC MATERIALS 327 $a7.6 ARC VAPOR DEPOSITION SYSTEM 330 $aThis book covers all aspects of physical vapor deposition (PVD) process technology from the characterizing and preparing the substrate material, through deposition processing and film characterization, to post-deposition processing. The emphasis of the book is on the aspects of the process flow that are critical to economical deposition of films that can meet the required performance specifications. The book covers subjects seldom treated in the literature: substrate characterization, adhesion, cleaning and the processing. The book also covers the widely discussed subjects of vacuum te 606 $aVapor-plating$vHandbooks, manuals, etc 606 $aMetals$xFinishing$vHandbooks, manuals, etc 615 0$aVapor-plating 615 0$aMetals$xFinishing 676 $a671.735 700 $aMattox$b D. M$0964240 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9911006867503321 996 $aHandbook of physical vapor deposition (PVD) processing$94388576 997 $aUNINA