LEADER 05514nam 2200781 a 450 001 9911006688403321 005 20200520144314.0 010 $a1-282-75508-0 010 $a9786612755088 010 $a1-282-25321-2 010 $a9786612253218 010 $a0-8155-1789-0 010 $a1-59124-063-8 035 $a(CKB)111056552536438 035 $a(EBL)428680 035 $a(OCoLC)437112476 035 $a(SSID)ssj0000072289 035 $a(PQKBManifestationID)11107350 035 $a(PQKBTitleCode)TC0000072289 035 $a(PQKBWorkID)10094523 035 $a(PQKB)10455516 035 $a(SSID)ssj0001379960 035 $a(PQKBManifestationID)11891117 035 $a(PQKBTitleCode)TC0001379960 035 $a(PQKBWorkID)11367128 035 $a(PQKB)11163521 035 $a(MiAaPQ)EBC428680 035 $a(MiAaPQ)EBC4952419 035 $a(Au-PeEL)EBL4952419 035 $a(CaONFJC)MIL225321 035 $a(OCoLC)1024256745 035 $a(EXLCZ)99111056552536438 100 $a19950522d1995 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 00$aHigh density plasma sources $edesign, physics, and performance /$fedited by Oleg A. Popov 210 $aPark Ridge, N.J. $cNoyes Publications$dc1995 215 $a1 online resource (467 p.) 225 1 $aMaterials science and process technology series 300 $aDescription based upon print version of record. 311 $a0-08-094616-X 311 $a0-8155-1377-1 320 $aIncludes bibliographical references and index. 327 $aFront Cover; High Density Plasma Sources: Design, Physics and Performance; Copyright Page; Contents; Chapter 1 Helicon Plasma Sources; 1.0 INTRODUCTION; 2.0 SUMMARY OF THEORY; 3.0 EXPERIMENTAL TESTS OF THEORY; 4.0 DESIGN OF HELICON SOURCES; 5.0 HELICON REACTORS FOR ETCHING AND DEPOSITION; ACKNOWLEDGMENTS; REFERENCES; Chapter 2 Planar Inductive Sources; 1.0 INTRODUCTION; 2.0 OPERATION; 3.0 POWER COUPLING; 4.0 FACTORS AFFECTING PROCESSING OF SUBSTRATES; 5.0 ETCHING APPLICATIONS OF PLANAR INDUCTIVELY COUPLED PLASMA SOURCES; REFERENCES 327 $aChapter 3 Electrostatically-Shielded Inductively-Coupled RF Plasma Sources1.0 INTRODUCTION; 2.0 SURVEY OF HIGH DENSITY PLASMA SOURCES; 3.0 ANATOMY OF AN INDUCTIVELY COUPLED PLASMA; 4.0 UNSHIELDED HELICAL PLASMA SOURCES; 5.0 ELECTROSTATIC SHIELDING; 6.0 ESRF PLASMA SOURCE APPLICATIONS; 7.0 CONCLUSIONS; REFERENCES; Chapter 4 Very High Frequency Capacitive Plasma Sources; 1.0 INTRODUCTION; 2.0 STRUCTURE OF HIGH FREQUENCY CAPACITIVE PLASMAS; 3.0 ENERGY TRANSFER; 4.0 VHF PLASMA PARAMETERS; 5.0 VHF PROCESSING RESULTS; 6.0 SUMMARY; ACKNOWLEDGMENTS; REFERENCES; Chapter 5 Surface Wave Plasma Sources 327 $a1.0 INTRODUCTION2.0 SUMMARY OF THE MAIN PROPERTIES OF SW SUSTAINED PLASMA COLUMNS; 3.0 ESSENTIAL ELEMENTS AND GENERAL FEATURES OF SW PLASMA SOURCES; 4.0 A FAMILY OF EFFICIENT SW LAUNCHERS FOR SUSTAINING PLASMA COLUMNS; 5.0 TYPICAL EXPERIMENTAL ARRANGEMENTS; 6.0 CONCLUSION; ACKNOWLEDGMENTS; REFERENCES; Chapter 6 Microwave Plasma Disk Processing Machines; 1.0 INTRODUCTION; 2.0 HISTORICAL DEVELOPMENT OF HIGH-DENSITY MICROWAVE PLASMA SOURCES AT MICHIGAN STATE UNIVERSITY; 3.0 THE GENERIC MICROWAVE PLASMA PROCESSING MACHINE; 4.0 SPECIFIC EXAMPLES OF MICROWAVE PLASMA PROCESSING MACHINES 327 $a5.0 MICROWAVE PLASMA MACHINE PROCESS VARIABLES, AND PERFORMANCE FIGURES OF MERIT6.0 MULTIPOLAR ECR REACTOR PERFORMANCE IN ARGON GAS; 7.0 ECR REACTOR DESIGN CONSIDERATIONS; 8.0 PROCESS APPLICATIONS; 9.0 DISCUSSION; ACKNOWLEDGMENTS; REFERENCES; Chapter 7 Electron Cyclotron Resonance Plasma Sources; 1.0 INTRODUCTION; 2.0 PRINCIPLES OF ECR SOURCE OPERATION; 3.0 SPECIAL ECR CONFIGURATIONS AND APPLICATIONS; 4.0 OPEN ISSUES FOR ECR SOURCES; 5.0 SUMMARY; ACKNOWLEDGMENTS; REFERENCES; Chapter 8 Distributed ECR Plasma Sources; 1.0 INTRODUCTION 327 $a2.0 MULTIPOLAR MAGNETIC FIELD CONFINEMENT: FROM MULTIPOLAR DISCHARGES TO DECR PLASMAS3.0 PLASMA UNIFORMITY IN MULTIPOLAR DISCHARGES: THEORETICAL AND EXPERIMENTAL ASPECTS; 4.0 CONFINEMENT AND TRAPPING OF FAST ELECTRONS IN MULTIPOLAR MAGNETIC FIELDS; 5.0 DISTRIBUTED ELECTRON CYCLOTRON RESONANCE PLASMAS (DECR PLASMAS); 6.0 FROM DECR TO UNIFORM DECR (UDECR) PLASMAS; 7.0 PLASMA PROCESSING IN DECR PLASMAS; 8.0 CONCLUSION; REFERENCES; Index 330 $aThis book describes the design, physics, and performance of high density plasma sources which have been extensively explored in low pressure plasma processing, such as plasma etching and planarization, plasma enhanced chemical vapor deposition of thin films, sputtered deposition of metals and dielectrics, epitaxial growth of silicon and GaAs, and many other applications. This is a comprehensive survey and a detailed description of most advanced high density plasma sources used in plasma processing. The book is a balanced presentation in that it gives both a theoretical treatment and pr 410 0$aMaterials science and process technology series. 606 $aPlasma density 606 $aPlasma generators 606 $aHigh temperature plasmas 615 0$aPlasma density. 615 0$aPlasma generators. 615 0$aHigh temperature plasmas. 676 $a621.044 701 $aPopov$b Oleg A$01822933 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9911006688403321 996 $aHigh density plasma sources$94389381 997 $aUNINA