LEADER 03364nam 2200709 a 450 001 9911006553303321 005 20240617142004.0 010 $a9780819490933 010 $a1-62870-104-8 010 $a0-8194-9093-8 024 7 $a10.1117/3.924283 035 $a(CKB)2670000000396662 035 $a(EBL)1120176 035 $a(OCoLC)854970277 035 $a(SSID)ssj0000819238 035 $a(PQKBManifestationID)11436082 035 $a(PQKBTitleCode)TC0000819238 035 $a(PQKBWorkID)10844581 035 $a(PQKB)11054756 035 $a(MiAaPQ)EBC1120176 035 $a(OCoLC)801513077 035 $a(CaBNVSL)gtp00552686 035 $a(SPIE)9780819490933 035 $a(PPN)237277484 035 $a(EXLCZ)992670000000396662 100 $a20120719d2012 fy 0 101 0 $aeng 135 $aurbn#|||m|||a 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aIntroduction to semiconductor manufacturing technology /$fHong Xiao 205 $aSecond edition 210 1$aBellingham, Wash. :$cSPIE,$d[2012] 210 4$d©2012 215 $a1 online resource (704 pages) 225 1 $aSPIE Press monograph ;$vPM220 300 $aDescription based upon print version of record. 311 1 $a9780819490926 311 1 $a0-8194-9092-X 320 $aIncludes bibliographical references. 327 $aPreface to the first edition -- Preface to the second edition -- Chapter 1. Introduction -- Chapter 2. Introduction to integrated circuit fabrication -- Chapter 3. Semiconductor basics -- Chapter 4. Wafer manufacturing, epitaxy, and substrate engineering -- Chapter 5. Thermal processes -- Chapter 6. Photolithography -- Chapter 7. Plasma basics -- Chapter 8. Ion implantation -- Chapter 9. Etch -- Chapter 10. Chemical vapor deposition and dielectric thin films -- Chapter 11. Metallization -- Chapter 12. Chemical mechanical polishing -- Chapter 13. Process integration -- Chapter 14. Integrated circuit processing technologies -- Chapter 15. Future trends and summary. 330 $aIntegrated circuit fabrication is a complex process, and engineers must have a deep understanding of the intricate technolgies involved in order to be successful. This book, intended for technical and college students, provides an overview of key concepts, equipment, and techniques used in fabs today. A history of the field is included as context for modern practictioners. The second edition covers advancements made in the past decade and adds new illustrations. 410 0$aSPIE Press monograph ;$vPM220. 606 $aSemiconductors$xDesign and construction 606 $aSemiconductor industry 606 $aSemiconductors$xDisseny i construcció$2lemac 606 $aSemiconductors$xIndústria i comerç$2lemac 615 0$aSemiconductors$xDesign and construction. 615 0$aSemiconductor industry. 615 7$aSemiconductors$xDisseny i construcció. 615 7$aSemiconductors$xIndústria i comerç 676 $a621.3815/2 700 $aXiao$b Hong$0524778 712 02$aSociety of Photo-Optical Instrumentation Engineers. 801 0$bCaBNVSL 801 1$bCaBNVSL 801 2$bCaBNVSL 906 $aBOOK 912 $a9911006553303321 996 $aIntroduction to semiconductor manufacturing technology$94391654 997 $aUNINA