LEADER 05079nam 2200577 a 450 001 9911006531703321 005 20200520144314.0 010 $a1-299-19290-4 010 $a0-08-052421-4 035 $a(CKB)1000000000281395 035 $a(EBL)1129805 035 $a(OCoLC)829460506 035 $a(SSID)ssj0000073115 035 $a(PQKBManifestationID)11125430 035 $a(PQKBTitleCode)TC0000073115 035 $a(PQKBWorkID)10116584 035 $a(PQKB)10270120 035 $a(MiAaPQ)EBC1129805 035 $a(EXLCZ)991000000000281395 100 $a19901010d1991 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 00$aThin film processes$hII /$fedited by John L. Vossen, Werner Kern 210 $aBoston $cAcademic Press, Inc.$dc1991 215 $a1 online resource (881 p.) 225 0 $aThin film processes ;$v2 300 $aDescription based upon print version of record. 311 $a0-12-728251-3 320 $aIncludes bibliographical references and index. 327 $aFront Cover; Thin Film Processes II; Copyright Page; Table of Contents; List of Contributors; Preface; Part I; Chapter I-1. Introduction; I. The Organization of This Book; II. Other Film Deposition and Etching Processes; References; Part II; Chapter II-1. Glow Discharge Plasmas and Sources for Etching and Deposition; I. Introduction; II. Processing Plasmas; III. dc Diode Plasmas; IV. rf Diode Plasmas; V. Afterglow Plasmas; VI. Plasmas in the Presence of Magnetic Fields; VII. Magnetrons; VIII. Broad-Beam Ion Sources; IX. Measurements in Plasmas; X. Intrusive Diagnostics 327 $aXI. Nonintrusive DiagnosticsXII. Conclusion; References; Chapter II-2. Evaporation Processes; I. Introduction; II. Evaporation Process; III. Model of Film Growth in Evaporation Processes; IV. Theory and Mechanisms; V. Implementation of Evaporation Processes; VI. Deposition of Materials; VII. Materials Synthesized by Evaporation-Based Processes; VIII. Structure and Properties of Evaporated Films; IX. Conclusions; References; Chapter II-3. Molecular Beam Epitaxy; I. Introduction; II. Building Blocks of the MBE System; III. Basics of the Growth Process; IV. Trends and Future Development 327 $aAcknowledgmentsReferences; Chapter II-4. Sputter Deposition Processes; I. Introduction; II. Sputter Sources; III. Sputter Deposition of Conducting Films; IV. Sputter Deposition of Dielectric Films; V. Sputter Coating Systems; VI. Emerging Technologies; VII. Concluding Remarks; References; Chapter II-5. The Cathodic Arc Plasma Deposition of Thin Films; I. Introduction; II. Ion Plating; III. The Cathodic Arc; IV. Emitted Material; V. Cathodic Arc Deposition; VI. Thin Film Deposition; VII. Applications; VIII. Conclusion; References; Part III; Chapter III-1. Thermal Chemical Vapor Deposition 327 $aI. IntroductionII. Fundamentals of Thermal CVD; III. Production Reactor Systems; IV. CVD of Insulators and Dielectrics; V. CVD of Elemental and Compound Semiconductors; VI. CVD of Conductors; VII. Summary, Conclusions, and Future Outlook; References; Chapter III-2. OMVPE of Compound Semiconductors; I. Introduction; II. The OMVPE Technique and Growth System; III. Organometallic Compounds; IV. Gas-Phase and Surface Reaction Mechanisms; V. OMVPE Transport Phenomena and Modelling; VI. Materials Characterization and Development; VII. Fundamental Growth Issues; VIII. OMVPE Growth 327 $aIX. Impurities in OMVPE-Grown Compound SemiconductorsX. Summary; References; Chapter III-3. Photochemical Vapor Deposition; I. Introduction; I. Introduction; II. Fundamental Aspects of Photochemical Vapor Deposition; III. Reactors, Optical Sources, and Associated Equipment; IV. Metal Films; V. Semiconductors; VI. Dielectrics; VII. Conclusions; Acknowledgments; References; Chapter III-4. Sol-Gel Coatings; II. The Sol-Gel Process; III. Thin Film Formation; IV. Applications; V. SUMMARY; Acknowledgment; References; Part IV; Chapter IV-1. Plasma-Enhanced Chemical Vapor Deposition; I. Introduction 327 $aII. Summary of Plasma Fundamentals 330 $aThis sequel to the 1978 classic, Thin Film Processes, gives a clear, practical exposition of important thin film deposition and etching processes that have not yet been adequately reviewed. It discusses selected processes in tutorial overviews with implementation guide lines and an introduction to the literature. Though edited to stand alone, when taken together, Thin Film Processes II and its predecessor present a thorough grounding in modern thin film techniques.Key Features* Provides an all-new sequel to the 1978 classic, Thin Film Processes* Introduces new topics, and sever 606 $aThin films 615 0$aThin films. 676 $a621.381/52 701 $aVossen$b John L$01824315 701 $aKern$b Werner$f1925-$01823206 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9911006531703321 996 $aThin film processes$94391414 997 $aUNINA