LEADER 05083nam 22006014a 450 001 9911006519703321 005 20200520144314.0 010 $a1-282-01383-1 010 $a9786612013836 010 $a0-08-094708-5 010 $a0-8155-1689-4 035 $a(CKB)1000000000220556 035 $a(EBL)428636 035 $a(OCoLC)476274548 035 $a(SSID)ssj0000449318 035 $a(PQKBManifestationID)11293985 035 $a(PQKBTitleCode)TC0000449318 035 $a(PQKBWorkID)10429118 035 $a(PQKB)10500594 035 $a(MiAaPQ)EBC428636 035 $a(EXLCZ)991000000000220556 100 $a20040426d2005 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 00$aDiffusion processes in advanced technological materials /$fedited by Devendra Gupta 210 $aNorwich, N.Y. $cWilliam Andrew Pub.$dc2005 215 $a1 online resource (551 p.) 300 $aDescription based upon print version of record. 311 $a0-8155-1501-4 320 $aIncludes bibliographical references and index. 327 $aFront Cover; Diffusion Processes in Advanced Technological Materials; Copyright Page; Contents; Contributors; Preface; Chapter 1. Diffusion in Bulk Solids and Thin Films: Some Phenomenological Examples; 1.1 Introduction; 1.2 Diffusion in Single Crystals; 1.3 Structurally Inhomogeneous Samples; 1.4 Some Illustrative Experimental Data; 1.5 General Characteristics of Grain Boundary Diffusion; 1.6 Diffusion in Quasicrystalline and Amorphous Alloys; 1.7 Summary; Acknowledgment; References; Chapter 2. Solid State Diffusion and Bulk Properties; 2.1 Introduction; 2.2 Correlations with Bulk Properties 327 $a2.3 Equilibrium Thermodynamic Calculation of Diffusion Parameters2.4 Summary; Acknowledgment; Appendix 2A. Taylor Series Expansion of ?G*; Appendix 2B. Evaluation of Errors in Estimated Parameters; References; Chapter 3. Atomistic Computer Simulation of Diffusion; 3.1 Introduction; 3.2 Atomic Interaction Models; 3.3 Molecular Statics; 3.4 Harmonic Approximation; 3.5 Equilibrium Defect Concentrations; 3.6 Transition Rate Calculations; 3.7 Kinetic Monte Carlo Simulations; 3.8 Molecular Dynamics; 3.9 Conclusions; Acknowledgment; References 327 $aChapter 4. Bulk and Grain Boundary Diffusion in Intermetallic Compounds4.1 Introduction; 4.2 Crystal Structures and Point Defects in Ni, Ti, and Fe Aluminides; 4.3 Diffusion Mechanisms in Intermetallics; 4.4 Experimental Results on Bulk Diffusion in Ordered Aluminides; 4.5 Discussion of Lattice Diffusion in Intermetallics; 4.6 Grain Boundary Diffusion; 4.7 Summary; Acknowledgments; References; Chapter 5. Diffusion Barriers in Semiconductor Devices/Circuits; 5.1 Introduction; 5.2 Diffusion Barriers from the 1960s Through the 1990s 327 $a5.3 Brief Review of Diffusion and the Influencing Material Factors5.4 Diffusion Barrier Materials; 5.5 New Concepts in Affecting APDB Behavior at the Interfaces; 5.6 Brief Discussion of an APDB for Low-k ILD Materials; 5.7 Summary; References; Chapter 6. Reactive Phase Formation: Some Theory and Applications; 6.1 Introduction; 6.2 Theoretical Considerations; 6.3 Practical Problems in Electronic Technology; 6.4 Conclusions; Acknowledgments; References; Chapter 7. Metal Diffusion in Polymers and on Polymer Surfaces; 7.1 Introduction 327 $a7.2 Diffusion During Nucleation and Growth of Metal Films on Polymers7.3 Metal-Polymer Interaction; 7.4 Diffusion in the Polymer Bulk; 7.5 Summary and Conclusions; Acknowledgments; References; Chapter 8. Measurement of Stresses in Thin Films and Their Relaxation; 8.1 Introduction; 8.2 Measurement Techniques; 8.3 Stress Relaxation; 8.4 Conclusion; References; Chapter 9. Electromigration in Cu Thin Films; 9.1 Introduction; 9.2 Cu Interconnection Integration; 9.3 Test Structure and Experiment; 9.4 Microstructure; 9.5 Theory; 9.6 Resistance and Void Growth; 9.7 Fast Diffusion Paths 327 $a9.8 Lifetime Distribution 330 $aThis new game book for understanding atoms at play aims to document diffusion processes and various other properties operative in advanced technological materials. Diffusion in functional organic chemicals, polymers, granular materials, complex oxides, metallic glasses, and quasi-crystals among other advanced materials is a highly interactive and synergic phenomenon. A large variety of atomic arrangements are possible. Each arrangement affects the performance of these advanced, polycrystalline multiphase materials used in photonics, MEMS, electronics, and other applications of current and deve 606 $aDiffusion 606 $aDiffusion processes$xMathematical models 615 0$aDiffusion. 615 0$aDiffusion processes$xMathematical models. 676 $a530.4/15 701 $aGupta$b D$01822241 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9911006519703321 996 $aDiffusion processes in advanced technological materials$94388358 997 $aUNINA