LEADER 05327nam 2200613 a 450 001 9911004850403321 005 20240410151603.0 010 $a1-68015-510-5 010 $a1-61503-727-6 035 $a(CKB)2560000000054998 035 $a(EBL)3002443 035 $a(SSID)ssj0000630689 035 $a(PQKBManifestationID)11392488 035 $a(PQKBTitleCode)TC0000630689 035 $a(PQKBWorkID)10747024 035 $a(PQKB)10299041 035 $a(MiAaPQ)EBC3002443 035 $a(Au-PeEL)EBL3002443 035 $a(CaPaEBR)ebr10439476 035 $a(OCoLC)929147892 035 $a(BIP)33989567 035 $a(EXLCZ)992560000000054998 100 $a20110114d2010 uy 0 101 0 $aeng 135 $aurcn||||||||| 181 $ctxt 182 $cc 183 $acr 200 10$aISTFA 2010 $econference proceedings from the 36th International Symposium for Testing and Failure Analysis, November 14-18, 2010, InterContinental Hotel Dallas, Dallas, Texas, USA /$fsponsored by EDFAS--Electronic Device Failure Analysis Society, ISTFA/2010, ASM International 210 $aMaterials Park, Ohio $cASM International$d2010 215 $a1 online resource (486 p.) 300 $aDescription based upon print version of record. 311 08$a1-61503-041-7 320 $aIncludes bibliographical references and index. 327 $a""Contents""; ""Combining High-Resolution Pulsed TIVA and Nanoprobing Techniques to Identify Drive Strength Issues in Mixed-signal Circuits""; ""Laser Voltage Imaging: A new Perspective of Laser Voltage Probing""; ""Two-Photon X-Variation Mapping Based on a Diode-Pumped Femtosecond Laser""; ""Quantitative, nanoscale free-carrier concentration mapping using terahertz near-field nanoscopy""; ""Laser-Thermal Imaging""; ""Mobile Diffractive Solid Immersion Lens Design for Backside Laser Based Fault Localization""; ""Volume Electrical Failure Analysis for Product-Specific Yield Enhancement"" 327 $a""Case Study in Fault Isolation of a Metal Short for Yield Enhancement""""Failure Analysis Methodology on Systematic defect in ADC_PLL Ring Pattern due to Plasma De-chuck Process""; ""Fault Isolation of Sub-surface Leakage Defects Using Electron Beam Induced Current Characterization in Next-Generation Flash Memory Technology Development""; ""A case study: Observation of counter doping of gate poly and its validation in high density 90nm CMOS SRAM Bitcell""; ""Magnetic Microscopy for 3D structures: use of the Simulation Approach for the precise localization of deep buried weak currents"" 327 $a""Advanced Sample Preparation Method for Lead Free Bump IMC and Solder Grain Image Enhancement""""Extending Acoustic Microscopy for Comprehensive Failure Analysis Applications""; ""Process induced defects in the silicon substrate: Approaches for successful Failure Analysis.""; ""X-sectional Scanning Capacitance Microscopy (SCM) Applications on Deep Submicron Devices at Specific Sites""; ""High Volume and Fast Turnaround Automated Inline TEM Sample Preparation for Manufacturing Process Monitoring""; ""Backscattered Electron Imaging for Embedded Subtle Defects in 32nm Processes"" 327 $a""Semi-Automated Full Wafer In-line SRAM Failure Analysis By Dual Beam Focused Ion Beam (FIB)""""Simulation Studies of Fluorine-induced Corrosion and Defects on Microchip Al Bondpads in Wafer Fabrication""; ""A Novel Wet Etch In-situ Decapsulation of Devices on Boards""; ""Low Temperature Plasma Decapsulation of Copper-wire-bonded and Exposed Copper Metallization Devices""; ""Decapsulation of Copper Bonded Plastic Encapsulated Integrated Circuits Utilizing Laser Ablation and Mixed Acid Chemistry"" 327 $a""Photoluminescence and EBIC for Process Control and Failure Analysis in Si-Based Photovoltaics""""Combined electron beam induced current imaging (EBIC) and focused ion beam (FIB) techniques for thin film solar cell characterization""; ""Activation Energy Analysis of Dark and Laser Illuminated I-V Characteristics of Thin-film Poly Silicon Solar Cells""; ""Characterization and failure analysis of 3D integrated semiconductor devices-novel tools for fault isolation, target preparation and high resolution material analysis""; ""A Novel Junction Profiling Methodology"" 327 $a""Improvement of optical resolution through chip backside using FIB trenches"" 330 $aThis volume features research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and review papers are included, as well as guides to new and unique tools and methodologies, applications and results. 606 $aElectronics$xMaterials$xTesting$vCongresses 606 $aElectronic apparatus and appliances$xTesting$vCongresses 615 0$aElectronics$xMaterials$xTesting 615 0$aElectronic apparatus and appliances$xTesting 712 02$aASM International. 712 02$aElectronic Device Failure Analysis Society. 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9911004850403321 996 $aISTFA 2010$94392646 997 $aUNINA