LEADER 03833nam  22006254a 450 
001 9911004800603321
005 20200520144314.0
010   $a1-282-01328-9
010   $a9786612013287
010   $a0-8155-1600-2
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035   $a(EBL)428576
035   $a(OCoLC)437112411
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035   $a(PQKBTitleCode)TC0000071369
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100   $a20050502d2005      uy         0
101 0 $aeng
135   $aur|n|---|||||
181   $ctxt
182   $cc
183   $acr
200 10$aAdhesives technology for electronic applications $ematerials, processes, reliability /$fby James J. Licari and Dale W. Swanson
210   $aNorwich, NY $cWilliam Andrew Pub.$dc2005
215   $a1 online resource (477 p.)
225 1 $aMaterials and processes for electronic applications series
300   $aDescription based upon print version of record.
311   $a0-8155-1513-8 
320   $aIncludes bibliographical references and index.
327   $aFront Cover; Adhesives Technology for Electronic Applications: Materials, Processes, Reliability; Copyright Page; Table of Contents; Chapter 1. Introduction; 1.1 ADHESIVE TYPES AND DEFINITIONS; 1.2 SUMMARY OF PACKAGING TECHNOLOGIES; 1.3 HISTORY OF ADHESIVES IN ELECTRONIC APPLICATIONS; 1.4 COMPARISON OF POLYMER ADHESIVES WITH METALLURGICAL AND VITREOUS ATTACHMENT MATERIALS; 1.5 SPECIFICATIONS; 1.6 THE MARKET; REFERENCES; Chapter 2. Functions and Theory of Adhesives; 2.1 MECHANICAL ATTACHMENT; 2.2 ELECTRICAL CONNECTIONS; 2.3 THERMAL DISSIPATION; 2.4 STRESS DISSIPATION; REFERENCES
327   $aChapter 3. Chemistry, Formulation, and Properties of Adhesives3.1 CHEMISTRY; 3.2 FORMULATION; 3.3 PROPERTIES; REFERENCES; Chapter 4. Adhesive Bonding Processes; 4.1 CLEANING; 4.2 SURFACE TREATMENTS; 4.3 ADHESIVE DISPENSING; 4.4 PLACEMENT OF DEVICES AND COMPONENTS; 4.5 CURING; 4.6 REWORK; REFERENCES; Chapter 5. Applications; 5.1 GENERAL APPLICATIONS; 5.2 SPECIFIC APPLICATIONS; REFERENCES; Chapter 6. Reliability; 6.1 FAILURE MODES AND MECHANISMS; 6.2 SPECIFICATIONS; REFERENCES; Chapter 7. Test and Inspection Methods; 7.1 PHYSICAL TESTS; 7.2 ELECTRICAL TESTS; 7.3 ENVIRONMENTAL TESTS
327   $a7.4 THERMAL TESTS7.5 MECHANICAL AND THERMOMECHANICAL TESTS; 7.6 CHEMICAL ANALYSIS; REFERENCES; Appendix; CONVERSION FACTORS; ABBREVIATIONS, ACRONYMS, AND SYMBOLS; Index
330   $aThis book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV, microwave, and moisture (which comply with current environmental and energy requirements) are covered. Over 80 tables and 120 figures provide a wealth of data on properties, performance, and rel
410  0$aMaterials and processes for electronic applications series.
606   $aElectronics$xMaterials
606   $aAdhesives
606   $aElectronic packaging
615  0$aElectronics$xMaterials.
615  0$aAdhesives.
615  0$aElectronic packaging.
676   $a621.381
700   $aLicari$b James J.$f1930-$01404327
701   $aSwanson$b Dale W$01822367
801  0$bMiAaPQ
801  1$bMiAaPQ
801  2$bMiAaPQ
906   $aBOOK
912   $a9911004800603321
996   $aAdhesives technology for electronic applications$94391990
997   $aUNINA