LEADER 04088nam 2200649 a 450 001 9911004764503321 005 20200520144314.0 010 $a1-283-15268-1 010 $a9786613152688 010 $a1-4377-7890-9 035 $a(CKB)2670000000092965 035 $a(EBL)727062 035 $a(OCoLC)735603879 035 $a(SSID)ssj0000507823 035 $a(PQKBManifestationID)12204191 035 $a(PQKBTitleCode)TC0000507823 035 $a(PQKBWorkID)10547606 035 $a(PQKB)10867948 035 $a(MiAaPQ)EBC727062 035 $a(PPN)153878134 035 $a(EXLCZ)992670000000092965 100 $a20110713d2011 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aAdhesives technology for electronic applications $ematerials, processing, reliability /$fJames J. Licari and Dale W. Swanson 205 $a2nd ed. 210 $aBoston $cElsevier$dc2011 215 $a1 online resource (415 p.) 225 1 $aMaterials and processes for electronic applications series 300 $aDescription based upon print version of record. 311 $a0-12-810370-1 311 $a1-4377-7889-5 320 $aIncludes bibliographical references and index. 327 $aFront Cover; Dedication; Adhesives Technology for Electronic Applications: Materials, Processing, Reliability; Copyright; Contents; Preface; Acknowledgments; Disclaimer; Chapter 1 -Introduction; 1.1 -Adhesive types and classifications; 1.2 -Summary of packaging technologies; 1.3 -History of adhesives in electronic applications; 1.4 -Comparison of polymer adhesives with metallurgical and vitreous attachment materials; 1.5 -Specifications; 1.6 -Market and market trends; References; Chapter 2 -Functions and theory of adhesives; 2.1 -Mechanical attachment; 2.2 -Electrical connections 327 $a2.3 -Thermal dissipation2.4 -Stress dissipation; References; Chapter 3 -Chemistry, Formulation, and Properties of Adhesives; 3.1 -Chemistry; 3.2 -Formulation additives; 3.3 -Formulation processes; 3.4 -Properties; References; Chapter 4 -Adhesive Bonding Processes; 4.1 -Cleaning; 4.2 -Surface treatments; 4.3 -Adhesive dispensing; 4.4 -Placement of devices and components; 4.5 -Curing; 4.6 -Rework; References; Chapter 5 -Applications; 5.1 -General applications; 5.2 -Specific applications; References; Chapter 6 -Reliability; 6.1 -Physics of failure methodology; 6.2 -Failure modes and mechanisms 327 $a6.3 -Reliability prediction and modeling6.4 -Qualification, quality control, and specifications; References; Chapter 7 -Test and Inspection Methods; 7.1 -Physical tests; 7.2 -Electrical tests; 7.3 -Environmental tests; 7.4 -Thermal tests; 7.5 -Mechanical and thermomechanical tests; 7.6 -Chemical analysis; References; Appendix; Conversion factors; Abbreviations, Acronyms, and Symbols; Index 330 $a Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups. The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this b 410 0$aMaterials and processes for electronic applications series. 606 $aElectronics$xMaterials 606 $aAdhesives 606 $aElectronic packaging 615 0$aElectronics$xMaterials. 615 0$aAdhesives. 615 0$aElectronic packaging. 676 $a621.381 700 $aLicari$b James J$01822366 701 $aSwanson$b Dale W$01822367 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9911004764503321 996 $aAdhesives technology for electronic applications$94388527 997 $aUNINA