LEADER 03156oam 22007335 450 001 9910971190703321 005 20240410034719.0 010 $a9781464804557 010 $a1464804559 024 7 $a10.1596/978-1-4648-0454-0 035 $a(CKB)3710000000436075 035 $a(EBL)2081825 035 $a(SSID)ssj0001535078 035 $a(PQKBManifestationID)11892151 035 $a(PQKBTitleCode)TC0001535078 035 $a(PQKBWorkID)11498809 035 $a(PQKB)11196303 035 $a(PQKBManifestationID)16122195 035 $a(PQKB)24304021 035 $a(MiAaPQ)EBC2081825 035 $a(DLC) 2015012688 035 $a(Au-PeEL)EBL2081825 035 $a(CaPaEBR)ebr11069095 035 $a(CaONFJC)MIL803546 035 $a(OCoLC)905970274 035 $a(DNLM)101654840 035 $a(US-djbf)18546829 035 $a(Perlego)1484277 035 $a(EXLCZ)993710000000436075 100 $a20150327d2015 uf 0 101 0 $aeng 135 $aurcn||||||||| 181 $2rdacontent 182 $2rdamedia 183 $2rdacarrier 200 00$aHealth care for all $etoward universal health coverage and equity in Latin America and the Caribbean : evidence from selected countries /$fedited by Tania Dmytraczenko and Gisele Almeida 205 $a1st ed. 210 1$aWashington, DC :$cThe World Bank Group,$d2015. 215 $a1 online resource(pages cm) 225 1 $aDirections in development 300 $aDescription based upon print version of record. 311 08$a9781464804540 311 08$a1464804540 320 $aIncludes bibliographical references. 327 $aSetting the context for universal health coverage reforms in LAC -- Universal health coverage policies in LAC -- Progress toward universal coverage in LAC : outcomes, utilization, and financial protection -- Assessing progress toward universal coverage : beyond utilization and financial protection. 330 $aOver the past three decades, many countries of Latin America and the Caribbean have recognized health as a human right. Since the early 2000's, 46 million more people in the countries studied are covered by health programs with explicit guarantees of affordable care. Reforms have been accompanied by a rise in public spending for health, financed largely from general revenues that prioritized or explicitly target the population without capacity to pay. Political commitment has generally translated into larger budgets as well as passage of legislation that ring-fenced funding for health. Most 410 0$aDirections in development (Washington, D.C.) 410 0$aWorld Bank e-Library. 606 $aPublic health$zLatin America 606 $aSocial medicine$zLatin America 606 $aMedical policy$zLatin America 615 0$aPublic health 615 0$aSocial medicine 615 0$aMedical policy 676 $a362.1098 702 $aDmytraczenko$b Tania 702 $aAlmeida$b Gisele 712 02$aWorld Bank Group, 801 0$bDNLM/DLC 801 1$bDLC 906 $aBOOK 912 $a9910971190703321 996 $aHealth care for all$94357851 997 $aUNINA LEADER 07507nam 2200589 a 450 001 9910965393403321 005 20251117080530.0 010 $a1-62081-544-3 035 $a(CKB)2670000000161016 035 $a(EBL)3021164 035 $a(SSID)ssj0000688207 035 $a(PQKBManifestationID)11396686 035 $a(PQKBTitleCode)TC0000688207 035 $a(PQKBWorkID)10762149 035 $a(PQKB)11460510 035 $a(MiAaPQ)EBC3021164 035 $a(Au-PeEL)EBL3021164 035 $a(CaPaEBR)ebr10681364 035 $a(OCoLC)780443362 035 $a(BIP)33556292 035 $a(EXLCZ)992670000000161016 100 $a20110112d2011 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 00$aCopper alloys $epreparation, properties and applications /$fMichael Naboka and Jennifer Giordano, editors 205 $a1st ed. 210 $aHauppauge, N.Y. $cNova Science Publishers$dc2011 215 $a1 online resource (281 p.) 225 1 $aMaterials science and technologies 300 $aDescription based upon print version of record. 311 08$a1-61209-504-6 320 $aIncludes bibliographical references and index. 327 $aIntro -- COPPER ALLOYS: PREPARATION, PROPERTIES AND APPLICATIONS -- COPPER ALLOYS: PREPARATION, PROPERTIES AND APPLICATIONS -- CONTENTS -- PREFACE -- Chapter 1 ELECTROCATALYTIC OXIDATION OF METHANOL AND GLUCOSE ON NICU ALLOY ELECTRODE -- ABSTRACT -- 1. INTRODUCTION -- 2. MATERIALS AND METHODS -- 3. RESULTS AND DISCUSSION -- 3.1. Surface Analysis of Electrodeposited NiCu Alloy -- 3.2. Electrochemical Behavior of GC/Ni and GC/NiCu in Alkaline Solution -- 3.3. Electro-Oxidation of Methanol -- 3.4. Electro-Oxidation of Glucose -- CONCLUSION -- REFERENCES -- Chapter 2 ELECTRODEPOSITION OF COPPER BASED ALLOYS AND MULTILAYER FOR GIANT MAGNETO RESISTANCE APPLICATIONS -- ABSTRACT -- INTRODUCTION -- EXPERIMENTAL SURVEY -- EFFECT OF NUMBER OF BILAYERS -- EFFECT OF MAGNETIC LAYER THICKNESS ON THE GMR -- EFFECT OF NON-MAGNETIC LAYER THICKNESS ON THE GMR -- CO-CU/CU MULTILAYER FILMS -- Ni-Cu/Cu Multilayer Films -- Co-Ni-Cu/Cu Multilayer Films -- Fe-Co-Cu/Cu Multilayer Films -- Fe-Ni-Cu/Cu Multilayer Films -- Co-Zn-Cu/Cu Multilayer Films -- Fe-Co-Ni-Cu/Cu Multilayer Films -- CONCLUSION -- REFERENCES -- Chapter 3 DEVELOPMENT AND CHARACTERIZATION OF NICKEL-COPPER-BASED SUBSTRATES FOR 2ND GENERATION HIGH-CRITICAL TEMPERATURE SUPERCONDUCTING TAPES -- ABSTRACT -- INTRODUCTION -- EXPERIMENTAL -- RECRYSTALLIZATION TEXTURE -- Pure Copper -- Binary Nickel-Copper -- Ternary Ni-Cu-Co Alloy -- Ternary Ni-Cu-W Alloy -- MAGNETIC PROPERTIES -- OXIDATION BEHAVIOUR -- MECHANICAL PROPERTIES -- APPLICATION OF NI-CU-CO ALLOY TEXTURED SUBSTRATE FOR YBCO FILM DEPOSITION -- CONCLUSION -- ACKNOWLEDGMENT -- REFERENCES -- Chapter 4 MAGNETORESISTANCE EFFECTS IN CU AND CO, CO/CU MULTILAYERS AND GRANULAR CU-CO ALLOYS AND IN RAPIDLY QUENCHED GD-DOPED CU-CO ALLOYS -- ABSTRACT -- INTRODUCTION -- MAGNETORESISTANCE OF PURE COPPER. 327 $aMAGNETORESISTANCE OF ALLOYS AND COMPOSITES COPPER - COBALT -- MAGNETORESISTANCE OF ALLOYS COPPER - COBALT - GADOLINIUM -- ACKNOWLEDGMENTS -- REFERENCES -- Chapter 5 MECHANICAL PROPERTIES OF COPPER UNDER DYNAMIC LOAD -- ABBREVIATIONS -- DEFINITION OF COOPER PROPERTIES BY KOLSKY METHOD -- Experimental Apparatus for Dynamic Tests -- Determination of the Dynamic Characteristics of Strength and Plasticity -- RESULTS OF TESTS OF COPPER USING KOLSKY METHOD -- CRITICAL SPALL STRENGTH OF COPPER -- Experimental Apparatus for Slpall Strength Determination -- Critical Spall Strength Determination -- Durability of Copper at Explosive Jet High-Speed Stretching -- Dynamic Viscosity and Cooper Relaxation Time Under Dynamic Load -- CONCLUSION -- REFERENCES -- Chapter 6 COPPER ALLOY MICROSTRUCTURES FOR APPLICATION IN MICROREACTORS -- ABSTRACT -- I. INTRODUCTION -- II. EXPERIMENTAL -- Materials, Processing and Characterization -- III. RESULTS AND DISCUSSION -- III.1. Zeolite Film Growth on Copper-Based Plates -- III.2. Zeolite Film Growth on Brass Microchannels -- III.3. Confined Zeolite Film Growth on Brass Microchannels -- III.3. Zeolite Film Growth on Brass Microgrids -- IV. MICROREACTOR ASSEMBLY WITH THE ZEOLITE/BRASS MICROSTRUCTURES -- CONCLUSIONS -- ACKNOWLEDGMENTS -- REFERENCES -- Chapter 7 COMPOSITE ELECTRODEPOSITS WITH C60 FULLERENE -- ABSTRACT -- INTRODUCTION -- EXPERIMENTAL -- RESULTS AND DISCUSSION -- REFERENCES -- Chapter 8 INFLUENCE OF ALLOYING WITH NI, AL, ZN, SN AND AG ON THE ANNEAL HARDENING EFFECT IN SINTERED COPPER BASE ALLOYS -- ABSTRACT -- INTRODUCTION -- EXPERIMENTAL -- Cold Rolling -- Anneal Hardening Effect -- CONCLUSIONS -- ACKNOWLEDGMENTS -- REFERENCES -- Chapter9HIGHSTRENGTHCOPPER-BASEDCONDUCTORMATERIALS -- Abstract -- 1.GeneralAspectsofCu-BasedConductorMaterials -- 1.1.TheSpecificResistivity -- 1.2.HardeningofConductorMaterials. 327 $a1.3.CommonCu-basedConductorMaterials -- 1.3.1.Nickel-BasedPrecipitates -- 1.3.2.Iron-BasedPrecipitates -- 1.3.3.Titanium-BasedPrecipitates -- 1.3.4.Chromium-BasedPrecipitates -- 1.3.5.ComparisonoftheConstituents -- 2.Cu-AgAlloys -- 2.1.PrecipitationReaction -- 2.2.SeparatingMatrixGrains -- 2.3.ThirdElementAdditions -- 2.3.1.CuAgCeandCuAgY -- 2.3.2.CuAgNiandCuAgMg -- 2.3.3.CuAgCrandCuAgFe -- 2.3.4.CuAgZr -- 2.4.StrengthandConductivity -- 3.Cu-NbAlloys -- 3.1.SurpassingtheSolubilityLimits -- 3.2.PrecipitationReaction -- 3.3.MicrostructuresStability -- 3.4.StrengthandConductivity -- 4.SummaryandOutlook -- Acknowledgment -- References -- Chapter 10 NEW MATERIALS FOR TECHNOLOGICAL APPLICATIONS FROM THE TI CR CU TERNARY SYSTEM -- ABSTRACT -- INTRODUCTION -- Background -- From the Binaries Ti Cr, Ti Cu and Cr Cu to the Ternary Ti Cr Cu System -- EXPERIMENTAL -- RESULTS -- Phase Equilibria in the Ti Cr Cu System at 800 °C -- The Pseudo Binary (Ti1 Xcrx)(Cr1 Ycuy)2 Phase -- The Ternary Compound Ti3(Crxcu1 X)5 -- The Pseudo Binary (Ti1 Xcrx)2(Crycu1 Y) -- The Pseudo Binary (Ti1 Xcux)(Crycu1 Y) -- The Pseudo Binary Ti2(Crxcu1 X)3 and Ti3(Crxcu1 X)4 -- The Binary Ticu4 Phase -- Metastable "Ti3Cu" and "Ticu3" Phases -- Physical Properties of a Fcc Cu Solid Solution Phase and the Ternary Ti3CrCu4 Compound -- CONCLUDING SUMMARY -- REFERENCES -- Chapter 11 CHEMICAL MECHANICAL POLISHING OF COPPER ALLOYS -- 1. INTRODUCTION -- 2. FUNDAMENTALS OF CHEMICAL MECHANICAL POLISHING -- 2.1. Material Removal Rate, MRR -- 2.2. Chemical Processes and Related Mechanisms of Material Removal -- 3. SLURRY COMPOSITIONS -- 4. POLISHING PAD DESIGN -- CONCLUSIONS -- ACKNOWLEDGMENT -- REFERENCES -- INDEX. 330 $aThis books presents current research in the study of the preparation, properties and applications of copper alloys. Topics discussed include the electrodeposition of copper based alloys for giant magneto resistance applications; the mechanical properties of copper under dynamic load; copper alloy micro-structures for application in microreactors and high strength copper-based conductor materials. 410 0$aMaterials science and technologies series. 606 $aCopper alloys$xMetallurgy 615 0$aCopper alloys$xMetallurgy. 676 $a669/.3 701 $aNaboka$b Michael$01863790 701 $aGiordano$b Jennifer$01863791 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910965393403321 996 $aCopper alloys$94470475 997 $aUNINA