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100   $a20050525d2005      uy         0
101 0 $aeng
135   $aurcn|||||||||
181   $ctxt
182   $cc
183   $acr
200 00$aLead-free solder interconnect reliability /$fedited by Dongkai Shangguan
205   $a1st ed.
210   $aMaterials Park, OH $cASM International$d2005
215   $a1 online resource (302 p.)
300   $aDescription based upon print version of record.
311 08$a0-87170-816-7 
320   $aIncludes bibliographical references and index.
327   $a""Contents""; ""Foreword""; ""Preface""; ""Lead-Free Soldering and Environmental Compliance: An Overview""; ""Microstructural Evolution and Interfacial Interactions in Lead-Free Solder Interconnects""; ""Fatigue and Creep of Lead-Free Solder Alloys: Fundamental Properties""; ""Lead-Free Solder Joint Reliability Trends""; ""Chemical Interactions and Reliability Testing for Lead-Free Solder Interconnects""; ""Tin Whisker Growth on Lead-Free Solder Finishes""; ""Accelerated Testing Methodology for Lead-Free Solder Interconnects""
327   $a""Thermomechanical Reliability Prediction of Lead-Free Solder Interconnects""""Design for Reliability Finite Element Modeling of Lead-Free Solder Interconnects""; ""Characterization and Failure Analyses of Lead-Free Solder Defects""; ""Reliability of Interconnects with Conductive Adhesives""; ""Lead-Free Solder Interconnect Reliability Outlook""; ""Index""
330   $aThis book provides the most up-to-date knowledge and data available on the reliability of lead-free solder interconnects. The content has been written by leading experts working in this important technology area. Both fundamental research and practical considerations are addressed.  Environmental regulations are driving the worldwide adoption of lead-free soldering technology for electronics packaging, board assembly, and related manufacturing operations. While a significant amount of research and development work has been conducted in recent years on manufacturing issues to enable the conversion to lead-free solders, data from studies related to the reliability of lead-free solder interconnects are still emerging. Many research projects around the world have been undertaken to study lead-free solder reliability under different loading conditions. This book is the first comprehensive guide to reliability of lead-free solder interconnects.
606   $aMicroelectronic packaging$xReliability
606   $aSolder and soldering
606   $aLead-free electronics manufacturing processes
615  0$aMicroelectronic packaging$xReliability.
615  0$aSolder and soldering.
615  0$aLead-free electronics manufacturing processes.
676   $a621.381/046
701   $aShangguan$b Dongkai$f1963-$01868863
801  0$bMiAaPQ
801  1$bMiAaPQ
801  2$bMiAaPQ
906   $aBOOK
912   $a9910963455303321
996   $aLead-free solder interconnect reliability$94476908
997   $aUNINA