LEADER 02869nam 2200613 a 450 001 9910457391303321 005 20200520144314.0 010 $a1-280-12880-1 010 $a9786613532688 010 $a0-8261-0828-8 035 $a(CKB)2550000000088964 035 $a(EBL)863083 035 $a(OCoLC)778067475 035 $a(SSID)ssj0000612425 035 $a(PQKBManifestationID)11388676 035 $a(PQKBTitleCode)TC0000612425 035 $a(PQKBWorkID)10571177 035 $a(PQKB)10728014 035 $a(MiAaPQ)EBC863083 035 $a(Au-PeEL)EBL863083 035 $a(CaPaEBR)ebr10532066 035 $a(CaONFJC)MIL353268 035 $a(EXLCZ)992550000000088964 100 $a20110831d2012 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aNurses' guide to teaching diabetes self-management$b[electronic resource] /$fRita Girouard Mertig 205 $a2nd ed. 210 $aNew York $cSpringer Pub.$dc2012 215 $a1 online resource (327 p.) 300 $aDescription based upon print version of record. 311 $a0-8261-0827-X 320 $aIncludes bibliographical references and index. 327 $aDiabetes : the basics -- Treatment : medical nutrition management -- Treatment : physical activity -- Treatment : medication -- Glycemic control -- Chronic complications -- The healthcare professional as teacher -- Teaching and motivating families with young children / by Kearsten Adams -- Teaching and motivating adolescents and their parents / by Bev Baliko -- Teaching and motivating adults -- Teaching and motivating clients with psychiatric/mental health issues / by Bev Baliko -- Client noncompliance. 330 $aThis is an optimistic and empowering approach to the daunting task of teaching diabetes patients to care for themselves. Written by a highly respected diabetes educator who has suffered with diabetes for 25 years, the guide provides the clinical and personal expertise that will help nurses and other health professionals to successfully teach diabetes self-management and compliance to adults, children, adolescents, and parents. The book contains a vast reservoir of information ranging from a thorough overview of diabetes and the physical and emotional toll of living with the disease to number o 606 $aDiabetes$xNursing 606 $aPatient education 606 $aSelf-care, Health 608 $aElectronic books. 615 0$aDiabetes$xNursing. 615 0$aPatient education. 615 0$aSelf-care, Health. 676 $a616.4/620231 700 $aMertig$b Rita G$0953165 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910457391303321 996 $aNurses' guide to teaching diabetes self-management$92154872 997 $aUNINA LEADER 04357nam 2200793 a 450 001 9910960416803321 005 20200520144314.0 010 $a9786611430610 010 $a9781281430618 010 $a1281430617 010 $a9780226753409 010 $a0226753409 024 7 $a10.7208/9780226753409 035 $a(CKB)1000000000410867 035 $a(EBL)408496 035 $a(OCoLC)476229355 035 $a(SSID)ssj0000116947 035 $a(PQKBManifestationID)11140992 035 $a(PQKBTitleCode)TC0000116947 035 $a(PQKBWorkID)10042181 035 $a(PQKB)10353224 035 $a(DE-B1597)524717 035 $a(OCoLC)824145590 035 $a(DE-B1597)9780226753409 035 $a(Au-PeEL)EBL408496 035 $a(CaPaEBR)ebr10230050 035 $a(CaONFJC)MIL143061 035 $a(MiAaPQ)EBC408496 035 $a(Perlego)1851452 035 $a(EXLCZ)991000000000410867 100 $a19970411d1997 uy 0 101 0 $aeng 135 $aurun#---|u||u 181 $ctxt 182 $cc 183 $acr 200 14$aThe calling of education $ethe academic ethic and other essays on higher education /$fEdward Shils ; edited and with an introduction by Steven Grosby ; foreword by Joseph Epstein 205 $a1st ed. 210 $aChicago $cUniversity of Chicago Press$dc1997 215 $a1 online resource (312 p.) 300 $aDescription based upon print version of record. 311 08$a9780226753393 311 08$a0226753395 311 08$a9780226753386 311 08$a0226753387 320 $aIncludes bibliographical references and index. 327 $tFront matter --$tContents --$tForeword --$tIntroduction --$tThe Academic Ethic --$tThe Criteria of Academic Appointment --$tDo We Still Need Academic Freedom? --$tThe Eighth Jefferson Lecture in the Humanities: "Render unto Caesar . . ." Government, Society, and the Universities in Their Reciprocal Rights and Duties --$tThe Idea of the University: Obstacles and Opportunities in Contemporary Societies --$tThe Modern University and Liberal Democracy --$tIndex 330 $aThroughout his long and prolific career, Edward Shils brought an extraordinary knowledge of academic institutions to discussions about higher education. The Calling of Education features Shils's most illuminating and incisive writing on this topic from the last twenty-five years of his life. The first essay, "The Academic Ethic," articulates the unique ethical demands of the academic profession and directs special attention to the integration of teaching and research. Other pieces, including Shils's renowned Jefferson lectures, focus on perennial issues in higher learning: the meaning of academic freedom, the connection between universities and the state, and the criteria for appointing individuals to academic positions. Edward Shils understood the university as a great symphonic conductor comprehends the value of each instrument and section, both separately and in cooperation. The Calling of Education offers Shils's insightful perspective on problems that are no less pressing than when he first confronted them. Edward Shils (1910-1995) was distinguished service professor in the Committee on Social Thought and the department of sociology at the University of Chicago. Among his many books published by the University of Chicago Press are Portraits: A Gallery of Intellectuals and the three-volume Selected Papers of Edward Shils. 606 $aEducation, Higher$xPhilosophy 606 $aEducation, Higher$xAims and objectives 606 $aCollege teachers$xProfessional ethics 606 $aUniversities and colleges$zUnited States$xAdministration 606 $aEducation, Higher$xSocial aspects$zUnited States 615 0$aEducation, Higher$xPhilosophy. 615 0$aEducation, Higher$xAims and objectives. 615 0$aCollege teachers$xProfessional ethics. 615 0$aUniversities and colleges$xAdministration. 615 0$aEducation, Higher$xSocial aspects 676 $a378/.01 700 $aShils$b Edward$f1910-1995.$050550 701 $aGrosby$b Steven$01804093 701 $aEpstein$b Joseph$0600746 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910960416803321 996 $aThe calling of education$94351974 997 $aUNINA LEADER 11643nam 22005893 450 001 9911020272603321 005 20240328080228.0 010 $a9783527845729 010 $a3527845720 010 $a9783527845705 010 $a3527845704 035 $a(CKB)31073524800041 035 $a(MiAaPQ)EBC31227211 035 $a(Au-PeEL)EBL31227211 035 $a(Exl-AI)31227211 035 $a(Perlego)4367301 035 $a(OCoLC)1428261185 035 $a(EXLCZ)9931073524800041 100 $a20240328d2024 uy 0 101 0 $aeng 135 $aur||||||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aFlexible Electronic Packaging and Encapsulation Technology 205 $a1st ed. 210 1$aNewark :$cJohn Wiley & Sons, Incorporated,$d2024. 210 4$dİ2024. 215 $a1 online resource (379 pages) 311 08$a9783527353590 311 08$a3527353593 327 $aCover -- Title Page -- Copyright -- Contents -- Preface -- Chapter 1 Overview of Flexible Electronic Encapsulating Technology -- 1.1 Flexible Electronics Overview -- 1.2 Development of Flexible Electronic Encapsulating Technology -- 1.2.1 Flip Chip Process -- 1.2.2 Progress of CIF?Based Flexible Electronic Encapsulating Technology -- 1.3 Encapsulating Technology of Several Important Flexible Electronic Devices -- 1.3.1 Organic Light?Emitting Diode -- 1.3.2 Flexible Solar Cell Encapsulating -- 1.3.3 Flexible Amorphous Silicon Solar Cells -- 1.3.4 Flexible Perovskite Solar Cells -- 1.4 Flexible Electronic Encapsulating Materials -- 1.4.1 Selection Principle of Flexible Electronic Encapsulating Materials -- 1.4.2 Desirable Properties of Flexible Electronic Encapsulating Materials -- 1.5 Overview of the Development of Flexible Electronic Packaging at Home and Abroad -- References -- Chapter 2 Basic Concepts Related to Flexible Electronic Packaging -- 2.1 Composition of Flexible Electronic Packaging -- 2.1.1 Flexible Substrate -- 2.1.2 Electronic Components -- 2.1.3 Crosslinked Conductive Materials -- 2.1.4 Adhesive Layer -- 2.1.5 Coating Layer -- 2.2 Flexible Electronic Packaging Structure -- 2.2.1 Curved Structures of Hard Thin Films -- 2.2.2 Island?Bridge Structure -- 2.2.3 Pre?strained Super?Soft Interconnect Structure -- 2.2.4 Open Grid Structure -- 2.3 Encapsulation Principle -- 2.3.1 Basic Principle of Penetration -- 2.3.2 Permeation Mechanism of Water Vapor and Gas -- 2.3.3 Barrier Performance Measurement -- 2.3.4 Thin?Film Barrier Technology for Organic Devices -- 2.3.4.1 Single?Layer Film Package -- 2.3.4.2 Multilayer Film Packaging -- 2.3.5 Film Encapsulation Mechanics -- 2.4 Packaging Technology -- 2.4.1 Local Multilayer Packaging -- 2.4.2 Multilayer Barrier Film Packaging -- 2.4.3 Online Thin?Film Encapsulation. 327 $a2.4.4 Atomic Layer Deposition (ALD) Encapsulation -- 2.4.5 Inkjet Packaging -- 2.4.6 Flexible Glass Packaging -- 2.5 Packaging Stability -- 2.6 Encapsulated Products -- 2.7 Chapter Summary -- References -- Chapter 3 Flexible Substrates -- 3.1 Concept and Connotation of Flexible Substrates -- 3.2 Development History of Flexible Substrates -- 3.3 Flexible Substrate Materials -- 3.3.1 Polydimethylsiloxane -- 3.3.2 Polyvinyl Alcohol -- 3.3.3 Polycarbonate -- 3.3.4 Polyester -- 3.3.5 Polyimide -- 3.3.6 Polyurethane -- 3.3.7 Parylene -- 3.3.8 Liquid Crystal Polymer -- 3.3.9 Hydrogel -- 3.4 Molding Technology of Flexible Substrate -- 3.4.1 Coating Technology -- 3.4.1.1 Dip Coating Method -- 3.4.1.2 Air Knife Coating Method -- 3.4.1.3 Scraper Coating Method -- 3.4.1.4 Rotary Coating Method -- 3.4.2 Melt Extrusion Molding -- 3.4.3 Melt Extrusion Blow Molding -- 3.4.4 Solution Tape Casting -- 3.4.5 Bidirectional Drawing Molding -- 3.4.6 Chemical Vapor Deposition -- 3.5 Performance Evaluation of Flexible Substrates -- 3.5.1 Mechanical Flexibility -- 3.5.2 Ductility -- 3.5.3 Adhesive Property -- 3.5.4 Barrier Property -- 3.5.5 Electrical Property -- 3.5.6 Chemical Stability -- 3.5.7 Dimensional Stability -- 3.5.8 Surface Smoothness and Thickness Uniformity -- 3.5.9 Optical Clarity (Transmittance) -- 3.5.10 Biocompatibility -- 3.5.11 Bioabsorbability -- 3.6 Application of Flexible Substrates -- 3.6.1 Flexible Display Substrates -- 3.6.2 Flexible Electrode Substrates -- 3.6.3 Flexible Sensing Substrates -- 3.7 Development Trend of Flexible Substrates -- 3.7.1 Intelligent and Functional Flexible Substrates -- 3.7.2 Green Degradable Flexible Substrates -- 3.7.3 Optimization of Interface Compatibility of Flexible Substrates -- References -- Chapter 4 Test Methods -- 4.1 Sealing Test -- 4.1.1 Direct Diffusion Method -- 4.1.1.1 Weight Cup Test. 327 $a4.1.1.2 Differential Pressure Method -- 4.1.1.3 Balancing Method -- 4.1.1.4 Tunable Diode Laser Absorption Spectrometry -- 4.1.1.5 Isotope Labeling Mass Spectrometry -- 4.1.2 Indirect Optical Method -- 4.1.3 Indirect Electrical Method -- 4.1.3.1 Calcium Electrical Test -- 4.1.3.2 Dielectric Measurement Method -- 4.1.4 Indirect Electrochemical Method -- 4.1.4.1 Electrochemical Impedance Spectroscopy (EIS) -- 4.1.4.2 Leakage Current Monitoring Method (LCM) -- 4.1.4.3 Linear Scanning Voltammetry (LSV) -- 4.1.5 Indirect Electromechanical Method -- 4.2 Bending Test -- 4.2.1 Static Bending and Dynamic Bending -- 4.2.2 Three?Point Bending and Four?Point Bending -- 4.2.3 Push Bending and Roll Bending -- 4.2.3.1 Push Bending -- 4.2.3.2 Rolling Bend -- 4.3 Mechanical Performance Testing -- 4.4 Stability Testing -- References -- Chapter 5 Flexible Electronic Encapsulation -- 5.1 Inorganic Encapsulating Material -- 5.1.1 Metal Encapsulating Material -- 5.1.1.1 Copper, Aluminum -- 5.1.1.2 Favorable Alloys -- 5.1.1.3 Copper-Tungsten Alloy (Cu-W) -- 5.1.2 Ceramic Encapsulating Material -- 5.1.2.1 Al2O3 Ceramic Encapsulation Material -- 5.1.2.2 AlN Ceramic Encapsulation Materials -- 5.1.2.3 BeO Ceramic Encapsulation Material -- 5.1.2.4 BN Ceramic Encapsulation Materials -- 5.1.3 New Trend in Inorganic Encapsulating Materials Combined with Flexible Electronic Technology -- 5.2 Organic Encapsulating Material -- 5.2.1 Polymer Encapsulating Material -- 5.2.1.1 Epoxy Resins -- 5.2.1.2 Polyimide Resins -- 5.2.1.3 Organic Silicon -- 5.2.1.4 Bismaleimide -- 5.2.1.5 Bismaleimide Triazine Resin -- 5.2.2 Development Trend of Organic Encapsulating Materials in Flexible Electronic Devices -- 5.3 Organic-Inorganic Hybrid Encapsulating Material -- 5.3.1 Application of Organic-Inorganic Hybrid Materials in Flexible Electronics -- 5.3.1.1 Strain and Pressure Sensors. 327 $a5.3.1.2 Temperature Sensor -- 5.3.1.3 Humidity Sensor -- 5.3.1.4 Optical Sensors -- 5.3.1.5 Other Types of Sensing Devices -- 5.3.2 Development Trends of Organic-Inorganic Hybrid Materials -- References -- Chapter 6 Development of Flexible Electronics Packaging Technology -- 6.1 Flexible Electronics Packaging -- 6.1.1 Single?Layer Thin?Film Packaging -- 6.1.2 Multi?Layer Thin?Film Packaging -- 6.1.2.1 Barix Multilayer Thin?Film Packaging -- 6.1.2.2 Other Multilayer Thin?Film Packaging -- 6.2 Thin?Film Packaging Technology -- 6.2.1 PECVD Atomic Layer Deposition Packaging Technology -- 6.2.1.1 Introduction to PECVD Technology -- 6.2.1.2 Development of PECVD Technology -- 6.2.2 ALD Atomic Layer Deposition Packaging Technology -- 6.2.2.1 Introduction to ALD Technology -- 6.2.2.2 Development of ALD Technology -- 6.2.3 Inkjet Packaging Technology -- 6.2.3.1 Introduction to Inkjet Encapsulation Technology -- 6.2.3.2 Continuous Inkjet Printing -- 6.2.3.3 Drop?on?Demand Inkjet Printing -- 6.2.3.4 Development of Inkjet Printing Technology -- References -- Chapter 7 Application of Flexible Electronics Packaging -- 7.1 Industry Chain Analysis of Flexible Electronics Packaging -- 7.1.1 Upstream, Midstream, and Downstream of the Flexible Electronics Industry Chain -- 7.1.2 Overview of the Development of Flexible Packaging Materials -- 7.2 Packaging Applications of Flexible OLED Devices -- 7.2.1 Stability Issues of Flexible OLED Devices -- 7.2.2 Flexible OLED Packaging Technology -- 7.2.2.1 Lack of Breakthrough in Encapsulating Technology -- 7.2.2.2 Low Yield Rate -- 7.3 Packaging Applications for Flexible Solar Cells -- 7.3.1 Inorganic Flexible Solar Cells -- 7.3.2 Organic Flexible Solar Cells -- 7.3.3 Dye?Sensitized Solar Cells -- 7.3.3.1 Structure of Dye?Sensitized Solar Cells -- 7.3.3.2 Light Anode -- 7.3.3.3 Counter Electrode. 327 $a7.4 Packaging Applications for Flexible Electronic Devices -- 7.4.1 Basic Structure of Flexible Electronic Devices -- 7.4.2 Application of Flexible Electronic Devices -- 7.4.2.1 Optoelectronics -- 7.4.2.2 Robot -- 7.4.2.3 Biomedical -- 7.4.2.4 Energy Equipment -- 7.5 Packaging Applications for Flexible Electronics Sensors -- 7.5.1 Common Materials of Flexible Sensors -- 7.5.1.1 Flexible Substrate -- 7.5.1.2 Metal Materials -- 7.5.1.3 Inorganic Semiconductor Materials -- 7.5.1.4 Organic Materials -- 7.5.1.5 Carbon Materials -- 7.5.2 Flexible Gas Sensors -- 7.5.3 Flexible Pressure Sensors -- 7.5.4 Flexible Humidity Sensor -- 7.5.5 Normal Sensors Compare with Flexible Sensors -- References -- Chapter 8 Testing Standards -- 8.1 Terminology and Alphabetic Symbols -- 8.1.1 Scope -- 8.1.2 Terms and Definitions -- 8.1.2.1 Terminology Classification -- 8.1.2.2 General Terms -- 8.1.2.3 Physical Characteristics Related Terms -- 8.1.2.4 Terms Related to Construction Elements -- 8.1.2.5 Symbols Related to Performances and Specifications -- 8.1.2.6 Terms Related to the Production Process -- 8.1.3 Alphabetic Symbols (Quantity Symbols/Unit Symbols) -- 8.1.3.1 Classification -- 8.1.3.2 Symbols -- 8.2 Mechanical Test Method (Deformation Test) -- 8.2.1 Cyclic Bending Test -- 8.2.1.1 Purpose -- 8.2.1.2 Testing Device -- 8.2.1.3 Test Procedure -- 8.2.1.4 Test Conditions and Reports -- 8.2.2 Static Bending Test -- 8.2.2.1 Purpose -- 8.2.2.2 Testing Device -- 8.2.2.3 Test Steps -- 8.2.2.4 Test Conditions and Reports -- 8.2.3 Combined Bending Test -- 8.2.3.1 Purpose -- 8.2.3.2 Testing Device -- 8.2.3.3 Test Procedure -- 8.2.3.4 Test Conditions and Reports -- 8.2.4 Rolling Test -- 8.2.4.1 Purpose -- 8.2.4.2 Testing Device -- 8.2.4.3 Test Procedure -- 8.2.4.4 Test Conditions and Reports -- 8.2.5 Static Rolling Test -- 8.2.5.1 Purpose -- 8.2.5.2 Testing Device. 327 $a8.2.5.3 Test Procedure. 330 $aThis book provides a comprehensive exploration of flexible electronic packaging and encapsulation technology, offering insights into its development, basic concepts, and applications. The editors, Hong Meng and Wei Huang, compile contributions from various experts, detailing the historical development and key components of flexible electronics. The book covers topics such as flexible substrates, test methods, and the application of flexible electronic packaging in various industries including healthcare and photovoltaics. It is aimed at researchers, engineers, and students in the field of electronics who are interested in the technological advancements and commercial potentials of flexible electronics.$7Generated by AI. 606 $aFlexible electronics$7Generated by AI 606 $aElectronic packaging$7Generated by AI 615 0$aFlexible electronics 615 0$aElectronic packaging 676 $a621.381046 700 $aMeng$b Hong$01840199 701 $aHuang$b Wei$01110571 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9911020272603321 996 $aFlexible Electronic Packaging and Encapsulation Technology$94421407 997 $aUNINA