LEADER 05635nam 22007334a 450 001 9910878084803321 005 20220318124045.0 010 $a1-280-28820-5 010 $a9786610288205 010 $a1-61344-509-1 010 $a0-470-36407-6 010 $a0-471-75815-9 010 $a0-471-75814-0 035 $a(CKB)1000000000354848 035 $a(EBL)243683 035 $a(OCoLC)70821598 035 $a(SSID)ssj0000182540 035 $a(PQKBManifestationID)11181832 035 $a(PQKBTitleCode)TC0000182540 035 $a(PQKBWorkID)10171856 035 $a(PQKB)10328969 035 $a(MiAaPQ)EBC243683 035 $a(PPN)153527110 035 $a(EXLCZ)991000000000354848 100 $a20050509d2006 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aIntroduction to electromagnetic compatibility /$fClayton R. Paul 205 $a2nd ed. 210 $aHoboken, N.J. $cWiley-Interscience$dc2006 215 $a1 online resource (1013 p.) 225 1 $aWiley series in microwave and optical engineering 300 $aDescription based upon print version of record. 311 $a0-471-75500-1 320 $aIncludes bibliographical references and index. 327 $aIntroduction to Electromagnetic Compatibility Second Edition; Contents; Preface; 1 Introduction to Electromagnetic Compatibility (EMC); 1.1 Aspects of EMC; 1.2 History of EMC; 1.3 Examples; 1.4 Electrical Dimensions and Waves; 1.5 Decibels and Common EMC Units; 1.5.1 Power Loss in Cables; 1.5.2 Signal Source Specification; Problems; References; 2 EMC Requirements for Electronic Systems; 2.1 Governmental Requirements; 2.1.1 Requirements for Commercial Products Marketed in the United States; 2.1.2 Requirements for Commercial Products Marketed outside the United States 327 $a2.1.3 Requirements for Military Products Marketed in the United States2.1.4 Measurement of Emissions for Verification of Compliance; 2.1.4.1 Radiated Emissions; 2.1.4.2 Conducted Emissions; 2.1.5 Typical Product Emissions; 2.1.6 A Simple Example to Illustrate the Difficulty in Meeting the Regulatory Limits; 2.2 Additional Product Requirements; 2.2.1 Radiated Susceptibility (Immunity); 2.2.2 Conducted Susceptibility (Immunity); 2.2.3 Electrostatic Discharge (ESD); 2.2.4 Requirements for Commercial Aircraft; 2.2.5 Requirements for Commercial Vehicles; 2.3 Design Constraints for Products 327 $a2.4 Advantages of EMC DesignProblems; References; 3 Signal Spectra-the Relationship between the Time Domain and the Frequency Domain; 3.1 Periodic Signals; 3.1.1 The Fourier Series Representation of Periodic Signals; 3.1.2 Response of Linear Systems to Periodic Input Signals; 3.1.3 Important Computational Techniques; 3.2 Spectra of Digital Waveforms; 3.2.1 The Spectrum of Trapezoidal (Clock) Waveforms; 3.2.2 Spectral Bounds for Trapezoidal Waveforms; 3.2.2.1 Effect of Rise/Falltime on Spectral Content; 3.2.2.2 Bandwidth of Digital Waveforms; 3.2.2.3 Effect of Repetition Rate and Duty Cycle 327 $a3.2.2.4 Effect of Ringing (Undershoot/Overshoot)3.2.3 Use of Spectral Bounds in Computing Bounds on the Output Spectrum of a Linear System; 3.3 Spectrum Analyzers; 3.3.1 Basic Principles; 3.3.2 Peak versus Quasi-Peak versus Average; 3.4 Representation of Nonperiodic Waveforms; 3.4.1 The Fourier Transform; 3.4.2 Response of Linear Systems to Nonperiodic Inputs; 3.5 Representation of Random (Data) Signals; 3.6 Use of SPICE (PSPICE) In Fourier Analysis; Problems; References; 4 Transmission Lines and Signal Integrity; 4.1 The Transmission-Line Equations; 4.2 The Per-Unit-Length Parameters 327 $a4.2.1 Wire-Type Structures4.2.2 Printed Circuit Board (PCB) Structures; 4.3 The Time-Domain Solution; 4.3.1 Graphical Solutions; 4.3.2 The SPICE Model; 4.4 High-Speed Digital Interconnects and Signal Integrity; 4.4.1 Effect of Terminations on the Line Waveforms; 4.4.1.1 Effect of Capacitive Terminations; 4.4.1.2 Effect of Inductive Terminations; 4.4.2 Matching Schemes for Signal Integrity; 4.4.3 When Does the Line Not Matter, i.e., When is Matching Not Required?; 4.4.4 Effects of Line Discontinuities; 4.5 Sinusoidal Excitation of the Line and the Phasor Solution 327 $a4.5.1 Voltage and Current as Functions of Position 330 $aA Landmark text thoroughly updated, including a new CDAs digital devices continue to be produced at increasingly lower costs and with higher speeds, the need for effective electromagnetic compatibility (EMC) design practices has become more critical than ever to avoid unnecessary costs in bringing products into compliance with governmental regulations. The Second Edition of this landmark text has been thoroughly updated and revised to reflect these major developments that affect both academia and the electronics industry. Readers familiar with the First Edition will find much new mater 410 0$aWiley series in microwave and optical engineering. 606 $aElectromagnetic compatibility 606 $aElectronic circuits$xNoise 606 $aDigital electronics 606 $aShielding (Electricity) 615 0$aElectromagnetic compatibility. 615 0$aElectronic circuits$xNoise. 615 0$aDigital electronics. 615 0$aShielding (Electricity) 676 $a621.382/24 676 $a621.38224 700 $aPaul$b Clayton R$027758 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910878084803321 996 $aIntroduction to electromagnetic compatibility$917429 997 $aUNINA