LEADER 05427nam 2200709Ia 450 001 9910877417603321 005 20200520144314.0 010 $a1-282-00220-1 010 $a9786612002205 010 $a0-470-86693-4 010 $a0-470-86692-6 035 $a(CKB)1000000000579627 035 $a(EBL)406518 035 $a(SSID)ssj0000247047 035 $a(PQKBManifestationID)11208551 035 $a(PQKBTitleCode)TC0000247047 035 $a(PQKBWorkID)10195772 035 $a(PQKB)10913357 035 $a(MiAaPQ)EBC406518 035 $a(OCoLC)299047918 035 $a(CaSebORM)9780470866917 035 $a(OCoLC)837732746 035 $a(OCoLC)ocn837732746 035 $a(EXLCZ)991000000000579627 100 $a20080417d2008 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 00$aSmart sensor systems /$fedited by Gerard C.M. Meijer 205 $a1st edition 210 $aChichester, U.K. $cJ. Wiley & Sons$d2008 215 $a1 online resource (405 p.) 300 $aDescription based upon print version of record. 311 $a0-470-86691-8 320 $aIncludes bibliographical references and index. 327 $aSMART SENSORSYSTEMS; Contents; Preface; About the Authors; 1 Smart Sensor Systems: Why? Where? How?; 1.1 Third Industrial Revolution; 1.2 Definitions for Several Kinds of Sensors; 1.2.1 Definition of Sensors; 1.2.2 Definition of Smart Sensors; 1.2.3 Definition of Integrated Smart Sensors; 1.2.4 Definition of Integrated Smart Sensor Systems; 1.3 Automated Production Machines; 1.4 Automated Consumer Products; 1.4.1 Smart Cars; 1.4.2 Smart Homes; 1.4.3 Smart Domestic Appliances; 1.4.4 Smart Toys; 1.5 Conclusion; References 327 $a2 Interface Electronics and Measurement Techniques for Smart Sensor Systems2.1 Introduction; 2.2 Object-oriented Design of Sensor Systems; 2.3 Sensing Elements and Their Parasitic Effects; 2.3.1 Compatibility of Packaging; 2.3.2 Effect of Cable and Wire Impedances; 2.3.3 Parasitic and Cross-effects in Sensing Elements; 2.3.4 Excitation Signals for Sensing Elements; 2.4 Analog-to-digital Conversion; 2.5 High Accuracy Over a Wide Dynamic Range; 2.5.1 Systematic, Random and Multi-path Errors; 2.5.2 Advanced Chopping Techniques; 2.5.3 Autocalibration; 2.5.4 Dynamic Amplification 327 $a2.5.5 Dynamic Division and Other Dynamic Signal-processing Techniques2.6 A Universal Transducer Interface; 2.6.1 Description of the Interface Chip and the Applied Measurement Techniques; 2.6.2 Realization and Experimental Results; 2.7 Summary and Future Trends; 2.7.1 Summary; 2.7.2 Future Trends; Problems; References; 3 Silicon Sensors: An Introduction; 3.1 Introduction; 3.2 Measurement and Control Systems; 3.3 Transducers; 3.3.1 Form of Signal-carrying Energy; 3.3.2 Signal Conversion in Transducers; 3.3.3 Smart Silicon Sensors; 3.3.4 Self-generating and Modulating Transducers 327 $a3.4 Transducer Technologies3.4.1 Introduction; 3.4.2 Generic Nonsilicon Technologies; 3.4.3 Silicon; 3.5 Examples of Silicon Sensors; 3.5.1 Radiation Domain; 3.5.2 Mechanical Domain; 3.5.3 Thermal Domain; 3.5.4 Magnetic Domain; 3.5.5 Chemical Domain; 3.6 Summary and Future Trends; 3.6.1 Summary; 3.6.2 Future Trends; References; 4 Optical Sensors Based on Photon Detection; 4.1 Introduction; 4.2 Photon Absorption in Silicon; 4.3 The Interface: Photon Transmission Into Silicon; 4.4 Photon Detection in Silicon Photoconductors; 4.4.1 Photoconductors in Silicon: Operation and Static Performance 327 $a4.4.2 Photoconductors in Silicon: Dynamic Performance4.5 Photon Detection in Silicon pn Junctions; 4.5.1 Defining the Depletion Layer at a pn Junction; 4.5.2 Electron-hole Collection in the Depletion Layer; 4.5.3 Electron-hole Collection in the Substrate; 4.5.4 Electron-hole Collection Close to the Surface; 4.5.5 Backside-illuminated Pin Photodiode; 4.5.6 Electron-hole Collection in Two Stacked pn Junctions; 4.6 Detection Limit; 4.6.1 Noise in the Optical Signal; 4.6.2 Photon Detector Noise; 4.6.3 Photon Detector Readout; 4.7 Photon Detectors with Gain; 4.7.1 The Phototransistor 327 $a4.7.2 The Avalanche Photodiode 330 $aInformation processing systems need sensors to acquire the physical, mechanical and chemical information to be able to function. For extended use of sensors in industrial production tools and consumer components, such as smart cars and smart homes, the reliability of the sensors should be improved and the cost dramatically reduced. The improvement of reliability, together with a reduction of cost, can only be achieved with smart sensor systems. These systems combine the functions of sensors and interfaces, including sensors, signal conditioning A-D (analog to digital) conversion, and bus int 606 $aDetectors$xDesign and construction 606 $aDetectors$xIndustrial applications 606 $aMicrocontrollers 615 0$aDetectors$xDesign and construction. 615 0$aDetectors$xIndustrial applications. 615 0$aMicrocontrollers. 676 $a681 676 $a681.25 676 $a681/.25 686 $aZQ 3120$2rvk 701 $aMeijer$b G. C. M$g(Gerard C. M.)$01753792 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910877417603321 996 $aSmart sensor systems$94189795 997 $aUNINA