LEADER 02628oas 22008053 450 001 9910874599803321 005 20251106213014.0 011 $a1065-2221 035 $a(OCoLC)556575073 035 $a(CONSER) 2018200150 035 $a(CKB)5280000000213331 035 $a(EXLCZ)995280000000213331 100 $a20100315a19919999 uy a 101 0 $aeng 135 $aurbn||||||abp 135 $aurbn||||||ada 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aProceedings /$fAnnual IEEE Semiconductor Thermal Measurement and Management Symposium 210 1$aNew York, NY :$cInstitute of Electrical and Electronics Engineers,$d1991- 311 08$a2577-1000 517 1 $aIEEE SEMI-THERM Symposium 517 1 $aAnnual IEEE Semiconductor Thermal Measurement and Management Symposium 517 1 $aAnnual Semiconductor Thermal Measurement and Management Symposium 517 1 $aSEMI-THERM 517 1 $aSemiconductor Thermal Measurement and Management Symposium 531 0 $aProceedings 606 $aSemiconductors$xThermal properties$vCongresses 606 $aSemiconductors$xCooling$vCongresses 606 $aAmorphous semiconductors$xThermal properties$vCongresses 606 $aIntegrated circuits$vCongresses 606 $aAmorphous semiconductors$xThermal properties$2fast$3(OCoLC)fst00807853 606 $aIntegrated circuits$2fast$3(OCoLC)fst00975535 606 $aSemiconductors$xCooling$2fast$3(OCoLC)fst01112209 606 $aSemiconductors$xThermal properties$2fast$3(OCoLC)fst01112264 608 $aConference papers and proceedings.$2fast 615 0$aSemiconductors$xThermal properties 615 0$aSemiconductors$xCooling 615 0$aAmorphous semiconductors$xThermal properties 615 0$aIntegrated circuits 615 7$aAmorphous semiconductors$xThermal properties. 615 7$aIntegrated circuits. 615 7$aSemiconductors$xCooling. 615 7$aSemiconductors$xThermal properties. 676 $a621 676 $a621.3815/2 712 02$aIEEE Components, Hybrids, and Manufacturing Technology Society. 801 0$bOCLCE 801 1$bOCLCE 801 2$bOCLCQ 801 2$bOCLCF 801 2$bOCLCO 801 2$bOCL 801 2$bOCLCO 801 2$bFXG 801 2$bTXJ 801 2$bCUD 801 2$bOCLCQ 801 2$bDLC 801 2$bOCLCQ 801 2$bAU@ 801 2$bOCL 801 2$bU3W 801 2$bOCLCL 801 2$bOCLCQ 906 $aCONFERENCE 912 $a9910874599803321 996 $aProceedings$957126 997 $aUNINA