LEADER 01262oam  2200397zu 450 
001 9910873068403321
005 20241212215139.0
035   $a(CKB)111055184255708
035   $a(SSID)ssj0000454054
035   $a(PQKBManifestationID)12140487
035   $a(PQKBTitleCode)TC0000454054
035   $a(PQKBWorkID)10482833
035   $a(PQKB)10631098
035   $a(NjHacI)99111055184255708
035   $a(EXLCZ)99111055184255708
100   $a20160829d2002      uy 
101 0 $aeng
135   $aur|||||||||||
181   $ctxt
182   $cc
183   $acr
200 10$a2002 8th International Advanced Packaging Materials Symposium
210 31$a[Place of publication not identified]$cIEEE$d2002
215   $a1 online resource
300   $aBibliographic Level Mode of Issuance: Monograph
311 08$a9780780374348 
311 08$a0780374347 
606   $aElectronic packaging
615  0$aElectronic packaging.
676   $a621.381/046
712 02$aComponents, Packaging & Manufacturing Technology Society.
712 02$aGeorgia Institute of Technology.$bPackaging Research Center.
801  0$bPQKB
912   $a9910873068403321
996   $a2002 8th International Advanced Packaging Materials Symposium$92326833
997   $aUNINA