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035   $a(CKB)111055184249194
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035   $a(PQKBManifestationID)12250512
035   $a(PQKBTitleCode)TC0000558263
035   $a(PQKBWorkID)10558970
035   $a(PQKB)11726296
035   $a(NjHacI)99111055184249194
035   $a(EXLCZ)99111055184249194
100   $a20160829d2000      uy 
101 0 $aeng
135   $aur|||||||||||
181   $ctxt
182   $cc
183   $acr
200 10$a2000 3rd Electronics Packaging Technology Conference
210 31$a[Place of publication not identified]$cI E E E$d2000
215   $a1 online resource
300   $aBibliographic Level Mode of Issuance: Monograph
311   $a0-7803-6644-1 
320   $aIncludes bibliographical references and index.
330   $aTopics covered by this title include: packaging materials; packaging trends; thermal design and modelling; solder joint metallurgy; process and reliability modelling; thermal characterization; materials characterization techniques; and assembly/manufacturing technologies.
606   $aElectronic packaging$vCongresses
615  0$aElectronic packaging
676   $a621.381/046
701   $aLim$b Thiam Beng$01230133
701   $aLee$b Charles$0387058
701   $aToh$b Kok Chuan$01230134
712 02$aIEEE Reliability/CPMT/ED Singapore Chapter.
712 02$aComponents, Packaging & Manufacturing Technology Society.
712 02$aInternational Microelectronics and Packaging Society.
712 12$aElectronics Packaging Technology Conference$d(3rd :$f2000 :$eSingapore)
801  0$bPQKB
906   $aPROCEEDING
912   $a9910872989603321
996   $a2000 3rd Electronics Packaging Technology Conference$92855463
997   $aUNINA