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100   $a20160829d1997      uy 
101 0 $aeng
181   $ctxt
182   $cc
183   $acr
200 00$aElectrical performance of electronic packaging : October 27-29, 1997, The Wyndham Hotel, San Jose, California
210 31$a[Place of publication not identified]$cIEEE Service Center$d1997
300   $aBibliographic Level Mode of Issuance: Monograph
311   $a0-7803-4203-8 
606   $aElectronic packaging$xCongresses
606   $aMaterials$xElectric properties$xCongresses
606   $aElectrical & Computer Engineering$2HILCC
606   $aElectrical Engineering$2HILCC
606   $aEngineering & Applied Sciences$2HILCC
615  0$aElectronic packaging$xCongresses
615  0$aMaterials$xElectric properties$xCongresses
615  7$aElectrical & Computer Engineering
615  7$aElectrical Engineering
615  7$aEngineering & Applied Sciences
676   $a621.381/046
712 02$aIEEE Microwave Theory and Techniques Society
712 02$aComponents, Packaging & Manufacturing Technology Society
712 12$aTopical Meeting on Electrical Performance of Electronic Packaging$d(6th :$f1997 :$eSan Jose, California)
801  0$bPQKB
906   $aBOOK
912   $a9910872843403321
996   $aElectrical performance of electronic packaging : October 27-29, 1997, The Wyndham Hotel, San Jose, California$92508649
997   $aUNINA