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200 10$aIWIPP proceedings : IEEE International Workshop on Integrated Power Packaging : the Congress Plaza Hotel, Chicago, Illinois, USA, September 17-19, 1998
210 31$a[Place of publication not identified]$cIEEE$d1998
300   $aBibliographic Level Mode of Issuance: Monograph
311   $a0-7803-5033-2 
606   $aElectronic packaging$vCongresses
606   $aPower electronics$vCongresses
606   $aElectrical & Computer Engineering$2HILCC
606   $aEngineering & Applied Sciences$2HILCC
606   $aElectrical Engineering$2HILCC
615  0$aElectronic packaging
615  0$aPower electronics
615  7$aElectrical & Computer Engineering
615  7$aEngineering & Applied Sciences
615  7$aElectrical Engineering
676   $a621.381/045
712 02$aComponents, Packaging & Manufacturing Technology Society
712 12$aIEEE International Workshop on Integrated Power Packaging
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906   $aPROCEEDING
912   $a9910872658803321
996   $aIWIPP proceedings : IEEE International Workshop on Integrated Power Packaging : the Congress Plaza Hotel, Chicago, Illinois, USA, September 17-19, 1998$92525514
997   $aUNINA