LEADER 02353oam 2200421zu 450 001 9910872627603321 005 20241212214919.0 035 $a(CKB)111026746729636 035 $a(SSID)ssj0000557907 035 $a(PQKBManifestationID)12228078 035 $a(PQKBTitleCode)TC0000557907 035 $a(PQKBWorkID)10559424 035 $a(PQKB)10111546 035 $a(NjHacI)99111026746729636 035 $a(EXLCZ)99111026746729636 100 $a20160829d2000 uy 101 0 $aeng 135 $aur||||||||||| 181 $ctxt 182 $cc 183 $acr 200 10$aAdhesive Joining and Coating Technology in Electronics Manufacturing, 2000: 4th International Conference 210 31$a[Place of publication not identified]$cI E E E$d2000 215 $a1 online resource 300 $aBibliographic Level Mode of Issuance: Monograph 311 08$a9780780364608 311 08$a0780364600 330 $aNew isotropic conductive adhesive (ICA) for plated Sn or Sn/Pb electrode was developed. The new ICA and our existing ICA were evaluated for SMT as lead containing solder replacement, using on-chip resistors with plated Sn/Pb (90/10) and fired Ag/Pd terminations, from contact resistance and adhesion strength points of view. The new ICA gave more stable contact resistance and adhesion strength through reliability testing, even in the case of using 0/spl Omega/ chip resistor with plated Sn/Pb termination. Formation of boundaries or Sn grains on the surface and diffusion of Ni into Sn/Pb layer in the cross section, after chip resistors with plated Sn/Pb termination exposed to several reliability conditions, were observed by SEM and EDX. Though degree of these changes of plated Sn/Pb termination depends on each exposure condition, it can be estimated that the new ICA gets less influence by the changes of plated Sn/Pb termination and that it has some effect which prevents changing by plated Sn/Pb termination before it occurs. 606 $aProtective coatings 615 0$aProtective coatings. 676 $a621.381/046 701 $aHyytia?inen$b Marika$01229392 712 02$aNokia (Firm) 801 0$bPQKB 906 $aPROCEEDING 912 $a9910872627603321 996 $aAdhesive Joining and Coating Technology in Electronics Manufacturing, 2000: 4th International Conference$92853620 997 $aUNINA