LEADER 01238oam 2200385zu 450 001 9910872428503321 005 20241212215245.0 035 $a(CKB)1000000000022012 035 $a(SSID)ssj0000558264 035 $a(PQKBManifestationID)12234496 035 $a(PQKBTitleCode)TC0000558264 035 $a(PQKBWorkID)10557912 035 $a(PQKB)10345793 035 $a(EXLCZ)991000000000022012 100 $a20160829d2002 uy 101 0 $aeng 181 $ctxt 182 $cc 183 $acr 200 10$a2002 4th Electronic Packaging Technology Conference 210 31$a[Place of publication not identified]$cIEEE$d2002 300 $aBibliographic Level Mode of Issuance: Monograph 311 08$a9780780374355 311 08$a0780374355 701 $aLee$b Charles$0387058 701 $aToh$b Kok Chuan$01230134 701 $aIyer$b Mahadevan K$01232093 712 02$aIEEE Reliability/CPMT/ED Singapore Chapter. 712 02$aComponents, Packaging & Manufacturing Technology Society. 712 02$aInternational Microelectronics and Packaging Society. 801 0$bPQKB 906 $aPROCEEDING 912 $a9910872428503321 996 $a2002 4th Electronic Packaging Technology Conference$92860777 997 $aUNINA