LEADER 01665nam 22003613a 450 001 9910870868603321 005 20240202165330.0 035 $a(CKB)32612667900041 035 $a(ScCtBLL)152c51d6-f4bf-4cd5-a024-68e55668e9c3 035 $a(Perlego)2330316 035 $a(EXLCZ)9932612667900041 100 $a20240202i20122020 uu 101 0 $aeng 135 $aur||||||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 00$aStrain-Engineered MOSFETs$fC. K. Maiti, T. K. Maiti 210 1$aBoca Raton :$cCRC Press,$d2012. 215 $a1 online resource (1 p.) 311 08$a9781138075603 330 $aThis book brings together new developments in the area of strain-engineered MOSFETs using high-mibility substrates such as SIGe, strained-Si, germanium-on-insulator and III-V semiconductors into a single text which will cover the materials aspects, principles, and design of advanced devices, their fabrication and applications. The book presents a full TCAD methodology for strain-engineering in Si CMOS technology involving data flow from process simulation to systematic process variability simulation and generation of SPICE process compact models for manufacturing for yield optimization. 606 $aTechnology & Engineering / Electronics / Microelectronics$2bisacsh 606 $aTechnology 615 7$aTechnology & Engineering / Electronics / Microelectronics 615 0$aTechnology. 700 $aMaiti$b C. K$0866187 702 $aMaiti$b T. K 801 0$bScCtBLL 801 1$bScCtBLL 912 $a9910870868603321 996 $aStrain-Engineered MOSFETs$94191418 997 $aUNINA