LEADER 07916nam 22004453 450 001 9910841712403321 005 20240216080300.0 010 $a1-394-21096-5 010 $a1-394-21094-9 035 $a(MiAaPQ)EBC31151561 035 $a(Au-PeEL)EBL31151561 035 $a(EXLCZ)9930362975500041 100 $a20240216d2024 uy 0 101 0 $aeng 135 $aurcnu|||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aReliability Prediction for Microelectronics 205 $a1st ed. 210 1$aNewark :$cJohn Wiley & Sons, Incorporated,$d2024. 210 4$d©2024. 215 $a1 online resource (401 pages) 225 1 $aQuality and Reliability Engineering Series 311 $a1-394-21093-0 327 $aCover -- Title Page -- Copyright Page -- Dedication Page -- Contents -- Author Biography -- Series Foreword -- Preface -- Scope -- Introduction -- Chapter 1 Conventional Electronic System Reliability Prediction -- 1.1 Electronic Reliability Prediction Methods -- 1.2 Electronic Reliability in Manufacturing, Production, and Operations -- 1.2.1 Failure Foundation -- 1.2.2 Reliability Foundational Models (Markovian, Gamma, Lévy, Wiener Processes) -- 1.2.3 Correlation Versus Causation and Representativeness of Trackers -- 1.2.4 Functional Safety Standard ISO 26262 -- 1.2.5 Additional Considerations -- 1.3 Reliability Criteria -- 1.3.1 The Failure Rate Curve for Electronic Systems -- 1.3.2 Basic Lifetime Distribution Models -- 1.4 Reliability Testing -- 1.4.1 Reliability Test Methods -- 1.4.2 Accelerated Testing -- Chapter 2 The Fundamentals of Failure -- 2.1 The Random Walk -- 2.1.1 Approximate Solution -- 2.1.2 Constant Velocity -- 2.2 Diffusion -- 2.2.1 Particle Diffusion -- 2.3 Solutions for the Diffusion Equation -- 2.3.1 Normal Distribution -- 2.3.2 Error Function Solution -- 2.3.3 Finite Thickness -- 2.3.4 Thermal Diffusion -- 2.4 Drift -- 2.5 Statistical Mechanics -- 2.5.1 Energy -- 2.6 Chemical Potential -- 2.6.1 Thermodynamics -- 2.7 Thermal Activation Energy -- 2.7.1 Arrhenius Relation -- 2.7.2 Einstein Relation -- 2.7.3 Magnitude of Energy -- 2.8 Oxidation and Corrosion -- 2.8.1 Reaction Rate -- 2.8.2 Limiting Time Scales -- 2.8.3 Material Properties -- 2.9 Vibration -- 2.9.1 Oscillations -- 2.9.2 Multiple Resonances -- 2.9.3 Random Vibration -- 2.10 Summary -- Chapter 3 Physics-of-Failure-based Circuit Reliability -- 3.1 Problematic Areas -- 3.1.1 Single-Failure Mechanism Versus Competing-Failure Mechanism -- 3.1.2 Acceleration Factor -- 3.1.3 An Alternative Acceleration Factor Calculation - Matrix Method. 327 $a3.1.4 Single-Failure Mechanism Assumption: Conventional Approach -- 3.1.5 Failure Rate Calculations Assuming Multiple-Failure Mechanism -- 3.1.6 Constant-Failure-Rate Approximation/Justification -- 3.1.7 Exponential Distribution and Its Characterization -- 3.2 Reliability of Complex Systems -- 3.2.1 Drenick's Theorem -- 3.3 Physics-of-Failure-based Circuit Reliability Prediction Methodology -- 3.3.1 Methodology -- 3.3.2 Assembly, Materials and Processes, and Packaging -- 3.3.3 External Environment -- 3.3.4 PoF and Failure Mechanisms -- 3.3.5 Key Considerations for Reliability Models in Emerging Technologies -- 3.3.6 Input Data -- 3.3.7 Applicability of Reliability Models -- Chapter 4 Transition State Theory -- 4.1 Stress-Related Failure Mechanisms -- 4.2 Non-Arrhenius Model Parameters -- 4.2.1 Hot Carrier Injection (HCI) -- 4.2.2 Negative Apparent EA -- 4.2.3 Time-Dependent Dielectric Breakdown (TDDB) -- 4.2.3.1 Thermochemical E-Model -- 4.2.3.2 1/E Model (Anode-Hole Injection Model) -- 4.2.3.3 Power-Law Voltage VN-Model -- 4.2.3.4 Exponential E1/2-Model -- 4.2.3.5 Percolation Model -- 4.2.4 Stress-Induced Leakage Current (SILC) -- 4.2.5 Negative Bias Temperature Instability (NBTI) -- 4.2.5.1 Time Dependence -- 4.2.5.2 1/n-Root Measurements -- 4.2.5.3 Voltage Power Law -- 4.2.6 Electromigration (EM) -- 4.3 Physics of Healthy -- 4.3.1 Definitions -- 4.3.2 Entropy and Generalization -- Chapter 5 Multiple Failure Mechanism in Reliability Prediction -- 5.1 MTOL Testing System -- 5.1.1 Accelerated Element, Control System, and Counter -- 5.1.2 Separating Failure Mechanisms -- 5.1.3 EA and ã Extrapolation -- 5.2 MTOL Matrix: A Use Case Application -- 5.2.1 Effective Activation Energy Characteristics (Eyring-M-STORM Model) -- 5.3 Comparison of DSM Technologies (45, 28, and 20 nm) -- 5.3.1 BTI's High Voltage Constant. 327 $a5.4 16 nm FinFET Reliability Profile Using the MTOL Method -- 5.4.1 Thermal Dissipation Concerns of 16 nm Technologies -- 5.5 16 nm Microchip Health Monitoring (MHM) from MTOL Reliability -- 5.5.1 Weibull Distribution Tapering by Increasing Devices -- 5.5.2 The FLL Measurement Circuit -- 5.5.3 Degradation Data Correction with Temperature Compensation -- 5.5.4 Accurate Lifetime Calculations Using Early Failure -- 5.5.5 Algorithm to Calculate the TTF of Early Failures -- 5.5.6 The Microchip Health Monitor -- Chapter 6 System Reliability -- 6.1 Definitions -- 6.2 Series Systems -- 6.2.1 Parallel Systems -- 6.2.2 Poisson Distribution Function -- 6.2.3 Weibull Distribution Function -- 6.2.4 Complex Systems -- 6.3 Weibull Analysis of Data -- 6.4 Weibull Analysis to Correlate Process Variations and BTI Degradation -- Chapter 7 Device Failure Mechanism -- 7.1 Time-Dependent Dielectric Breakdown -- 7.1.1 Physics of Breakdown -- 7.1.2 Early Models for Dielectric Breakdown -- 7.1.3 Acceleration Factors -- 7.1.4 Models for Ultra-Thin Dielectric Breakdown -- 7.1.5 Statistical Model -- 7.2 Hot Carrier Injection -- 7.2.1 Hot Carrier Effects -- 7.2.2 Hot Carrier Generation Mechanism and Injection to the Gate Oxide Film -- 7.2.3 Hot Carrier Models -- 7.2.4 Hot Carrier Degradation -- 7.2.5 Hot Carrier Resistant Structures -- 7.2.6 Acceleration Factor -- 7.2.6.1 Statistical Models for HCI Lifetime -- 7.2.6.2 Lifetime Sensitivity -- 7.3 Negative Bias Temperature Instability -- 7.3.1 Physics of Failure -- 7.3.2 Interface Trap Generation: Reaction-Diffusion Model -- 7.3.3 Fixed Charge Generation -- 7.3.4 Recovery and Saturation -- 7.3.5 NBTI Models -- 7.3.6 Lifetime Models -- 7.4 Electromigration -- 7.4.1 Electromigration Physics -- 7.4.2 Lifetime Prediction -- 7.4.3 Lifetime Distribution Model -- 7.4.4 Lifetime Sensitivity -- 7.5 Soft Errors due to Memory Alpha Particles. 327 $aChapter 8 Reliability Modeling of Electronic Packages -- 8.1 Failure Mechanisms of Electronic Packages -- 8.2 Failure Mechanisms' Description and Models -- 8.2.1 Wire Bond Failures (Wire Lifting, Broken Wires, Bond Fracture,etc.) -- 8.2.2 BGA and Package-on-Package Failures -- 8.2.3 Die Cracking Failures -- 8.2.3.1 Die Cracking Failure Mechanisms -- 8.2.4 Interface Delamination -- 8.2.5 Package Cracking Failure -- 8.2.6 Solder Joint Fatigue Failure -- 8.3 Failure Models -- 8.3.1 IMC Diffusion Models -- 8.3.2 Fracture Models Due to Cyclic Loads -- 8.3.3 Die Cracking Failure Models -- 8.3.4 Solder Joint Fatigue Failure Models -- 8.4 Electromigration -- 8.4.1 Electromigration Failure Description -- 8.4.2 Electromigration Failure Models -- 8.5 Corrosion Failure -- 8.5.1 Corrosion Failure Models -- 8.6 Failure Rate and Acceleration Factors -- 8.6.1 Creep -- 8.7 Reliability Prediction of Electronic Packages -- 8.7.1 Reliability and Failure Description -- 8.8 Reliability Failure Models -- 8.8.1 Inverse Power Law Models -- 8.8.2 Arrhenius Models -- 8.8.3 Arrhenius-Weibull Models -- References -- Index -- EULA. 410 0$aQuality and Reliability Engineering Series 700 $aBernstein$b Joseph B$01727607 701 $aBensoussan$b Alain$014378 701 $aBender$b Emmanuel$01727608 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910841712403321 996 $aReliability Prediction for Microelectronics$94134988 997 $aUNINA LEADER 03433oam 2200697I 450 001 9910970731503321 005 20251117102911.0 010 $a9786612454387 010 $a9781317099789 010 $a1317099788 010 $a9781315594187 010 $a1315594188 010 $a9781282454385 010 $a1282454382 010 $a9780754699897 010 $a0754699897 010 $a9781317099796 010 $a1317099796 024 7 $a10.4324/9781315594187 035 $a(CKB)3810000000076437 035 $a(Au-PeEL)EBL4523508 035 $a(CaPaEBR)ebr11506461 035 $a(OCoLC)1022780217 035 $a(OCoLC)953046818 035 $a(FINmELB)ELB139537 035 $a(MiAaPQ)EBC4523508 035 $a(BIP)116719892 035 $a(EXLCZ)993810000000076437 100 $a20180706e20162010 uy 0 101 0 $aeng 135 $aurcnu|||||||| 181 $2rdacontent 182 $2rdamedia 183 $2rdacarrier 200 10$aMasculinity in four Victorian epics $ea Darwinist reading /$fClinton Machann 205 $a1st ed. 210 1$aLondon ;$aNew York :$cRoutledge,$d2016. 215 $a1 online resource (166 pages) 300 $a"First published 2010 by Ashgate Publishing"--t.p. verso. 311 08$a9781032929187 311 08$a1032929189 311 08$a9780754666875 311 08$a0754666875 320 $aIncludes bibliographical references and index. 327 $a1. Introduction -- 2. Tennyson's Arthur and manly codes of behavior -- 3. Barrett Browning's construction of masculinity in Aurora Leigh -- 4. Clough's ambivalent Victorian manhood -- 5. Browning's chivalrous Christianity -- 6. Conclusion. 330 $aOffering provocative readings of Tennyson's Idylls of the King, Barrett Browning's Aurora Leigh, Clough's Amours de Voyage, and Browning's The Ring and the Book, Clinton Machann brings to bear the ideas and methods of literary Darwinism to shed light on the central issue of masculinity in the Victorian epic. This critical approach enables Machann to take advantage of important research in evolutionary psychology, cognitive science, anthropology, among other scientific fields, and to bring the concept of human nature into his discussions of the poems. The importance of the Victorian long poem as a literary genre is reviewed in the introduction, followed by transformative close readings of the poems that engage with questions of gender, particularly representations of masculinity and the prevalence of male violence. Machann contextualizes his reading within the poets' views on social, philosophical, and religious issues, arguing that the impulses, drives, and tendencies of human nature, as well as the historical and cultural context, influenced the writing and thus must inform the interpretation of the Victorian epic. 606 $aEnglish poetry$y19th century$xHistory and criticism 606 $aMasculinity in literature 606 $aNarrative poetry, English$xHistory and criticism 615 0$aEnglish poetry$xHistory and criticism. 615 0$aMasculinity in literature. 615 0$aNarrative poetry, English$xHistory and criticism. 676 $a821/.809353 700 $aMachann$b Clinton.$01801815 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910970731503321 996 $aMasculinity in four Victorian epics$94347210 997 $aUNINA