LEADER 03684nam 2200517Ia 450 001 9910831030403321 005 20230721021113.0 010 $a0-470-74296-8 010 $a1-282-03138-4 010 $a9786612031380 035 $a(CKB)1000000000725493 035 $a(EBL)428292 035 $a(SSID)ssj0000097774 035 $a(PQKBManifestationID)11130880 035 $a(PQKBTitleCode)TC0000097774 035 $a(PQKBWorkID)10120268 035 $a(PQKB)10165625 035 $a(MiAaPQ)EBC428292 035 $a(OCoLC)352829735 035 $a(EXLCZ)991000000000725493 100 $a20080922d2009 uy 0 101 0 $aeng 135 $aur|n||||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 00$aAdvanced millimeter-wave technologies$b[electronic resource] $eantennas, packaging and circuits /$fDuixian Liu ... [et al.] 210 $aChichester, U.K. ;$aHoboken, NJ $cJ. Wiley & Sons$d2009 215 $a1 online resource (851 p.) 300 $aDescription based upon print version of record. 320 $aIncludes bibliographical references and index. 327 $a1 Introduction ; 1.1 Challenges ; 1.2 Discussion Framework ; 1.3 Circuits ; 1.4 Antenna ; 1.5 RF Electronics ; .5.1 Receiver ; 1.5.2 Transmitter ; 1.6 Packaging ; 1.7 Organization and Flow of this Book ; References ; 2 Millimeter-wave Packaging ; 2.1 Introduction ; 2.1.1 Definition of Packaging ; 2.1.2 Packaging Challenges and Future Directions ; 2.2 Review of Microwave Packaging Technologies ; 2.2.1 MMICs ;$a.4.7 Wafer-level Packaging and Assembly of mmWave Devices ; 2.5 Package Codesign at mmWaves ; 2.5.1 Electromagnetic Modeling of mmWave Packages and Interconnects ; 2.5.2 Integrated Antennas ; References ; 3 Dielectric Properties at Millimeter-wave and THz Bands ; 3.1 Introduction ; 3.2 Dielectric Characterization""; 3.3 Outside the THz Gap a???Material Characterization Techniques ; 3.3.1 Parallel Plate (~DCa???30 MHz) ; 3.3.2 Resonant Cavity (~0.5a???50 GHz) ; 3.3.3 Transmission Line Methods (~0.01a???300 GHz) ; 3.3.4 THz TDS (~0.1a???10 THz) ; 327 $a3.4 THz TDS (~0.1a???10 THz) ; 3.4.1 Transmission ; 3.4.2 Error Analysis ; 3.5 Dielectric Properties ; 3.5.1 Semiconductors ; 3.5.2 Ceramic Materials ; 3.5.3 Thin Films ; 3.5.4 Metamaterials ; 3.5.5 Biomaterials ; 3.5.6 Material Needs ; References ; 4 Millimeter-wave Interconnects ; 4.1 Introduction ; 4.2 Interconnects at Millimeter-wave Frequencies 4.2.1 Printed Planar Transmission Lines ; 4.2.2 Metal Rectangular Waveguides ; 4.3 Interconnect Technology Options for Millimeter-wave Applications ; 4.3.1 Basic Technological Requirements ;$a4.3.2 MCM-L ; 4.3.3 LTCC ; 4.3.4 MCM-D ; 4.3.5 Flexible Substrates ; 4.3.6 Silicon Micromachining ; 4.3.7 Plastic Injection Molding ; 4.4 Performance-oriented Interconnect Technology Optimization ; 4.4.1 Performance-oriented BCB Dielectric Thickness Optimization ; 4.4.2 Transmission Line Discontinuities and Distributed Passives ; 4.4.3 Bends ; 4.5 Chip-to-package Interconnects at Millimeter-wave Frequencies ; 4.5.1 Wirebonding ; 4.5.2 Flip-chip Bonding ; 4.5.3 Alternative Chip Interconnection Methods ; References ; 5 Printed Millimeter Antennas a??? Multilayer Technologies 606 $aMillimeter wave devices 606 $aMillimeter waves 615 0$aMillimeter wave devices. 615 0$aMillimeter waves. 676 $a621.381 701 $aLiu$b Duixian$01628621 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910831030403321 996 $aAdvanced millimeter-wave technologies$93965842 997 $aUNINA