LEADER 03553nam 2200697 450 001 9910830973203321 005 20240219135730.0 010 $a1-280-54203-9 010 $a9786610542031 010 $a0-471-66090-6 010 $a0-471-72310-X 024 7 $a10.1002/047172310X 035 $a(CKB)111087027820616 035 $a(EBL)469725 035 $a(SSID)ssj0000145749 035 $a(PQKBManifestationID)11162119 035 $a(PQKBTitleCode)TC0000145749 035 $a(PQKBWorkID)10177401 035 $a(PQKB)11779169 035 $a(MiAaPQ)EBC469725 035 $a(CaBNVSL)mat05237459 035 $a(IDAMS)0b00006481095766 035 $a(IEEE)5237459 035 $a(OCoLC)85820230 035 $a(PPN)270977104 035 $a(EXLCZ)99111087027820616 100 $a20151221d2005 uy 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aEMC and the printed circuit board $edesign, theory, and layout made simple /$fMark I. Montrose 210 1$aNew York :$cIEEE Press,$dc1999. 210 2$a[Piscataqay, New Jersey] :$cIEEE Xplore,$d[2005] 215 $a1 online resource (344 p.) 225 1 $aIEEE Press series on electronics technology ;$v9 300 $a"IEEE Electromagnetic Compatibility Society, sponsor." 311 $a0-7803-4703-X 320 $aIncludes bibliographical references (p. 287-290) and index. 327 $aPreface. Acknowledgements. EMC Fundamentals. EMC Inside the PCB. Components and EMC. Image Planes. Bypassing and Decoupling. Transmission Lines. Signal Integrity and Crosstalk. Trace Termination. Grounding. Glossary. Bibliography. Appendix A: The Decibel. Appendix B: Fourier Analysis. Appendix C: Conversion Tables. Appendix D: International EMC Requirements. Index. About the Author. 330 $aThis accessible, new reference work shows how and why RF energy is created within a printed circuit board and the manner in which propagation occurs. With lucid explanations, this book enables engineers to grasp both the fundamentals of EMC theory and signal integrity and the mitigation process needed to prevent an EMC event. Author Montrose also shows the relationship between time and frequency domains to help you meet mandatory compliance requirements placed on printed circuit boards. Using real-world examples the book features:. Clear discussions, without complex mathematical analysis, of flux minimization concepts. Extensive analysis of capacitor usage for various applications. Detailed examination of components characteristics with various grounding methodologies, including implementation techniques. An in-depth study of transmission line theory. A careful look at signal integrity, crosstalk, and termination. 410 0$aIEEE Press series on electronics technology ;$v9 517 3 $aElectromagnetic compatibility and the printed circuit board 606 $aPrinted circuits$xDesign and construction 606 $aElectromagnetic compatibility 610 $aElectrical and Electronics Engineering. 615 0$aPrinted circuits$xDesign and construction. 615 0$aElectromagnetic compatibility. 676 $a621.3815 676 $a621.3815/31 676 $a621.381531 700 $aMontrose$b Mark I.$028377 712 02$aIEEE Electromagnetic Compatibility Society. 801 0$bCaBNVSL 801 1$bCaBNVSL 801 2$bCaBNVSL 906 $aBOOK 912 $a9910830973203321 996 $aEMC and the printed circuit board$9328617 997 $aUNINA