LEADER 05543nam 2200709 a 450 001 9910830941803321 005 20210415232447.0 010 $a1-280-25507-2 010 $a9786610255078 010 $a0-470-36189-1 010 $a0-471-72425-4 010 $a0-471-72424-6 035 $a(CKB)1000000000355165 035 $a(EBL)227410 035 $a(OCoLC)59760348 035 $a(SSID)ssj0000227432 035 $a(PQKBManifestationID)11173572 035 $a(PQKBTitleCode)TC0000227432 035 $a(PQKBWorkID)10264338 035 $a(PQKB)11277038 035 $a(MiAaPQ)EBC227410 035 $a(PPN)156584948 035 $a(EXLCZ)991000000000355165 100 $a20041013d2005 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aPrinciples of plasma discharges and materials processing$b[electronic resource] /$fMichael A. Lieberman, Allan J. Lichtenberg 205 $a2nd ed. 210 $aHoboken, N.J. $cWiley-Interscience$dc2005 215 $a1 online resource (795 p.) 300 $aDescription based upon print version of record. 311 $a0-471-72001-1 320 $aIncludes bibliographical references (p. 735-748) and index. 327 $aPRINCIPLES OF PLASMA DISCHARGES AND MATERIALS PROCESSING; CONTENTS; PREFACE; PREFACE TO THE FIRST EDITION; SYMBOLS AND ABBREVIATIONS; PHYSICAL CONSTANTS AND CONVERSION FACTORS; PRACTICAL FORMULAE; 1 INTRODUCTION; 1.1 Materials Processing; 1.2 Plasmas and Sheaths; Plasmas; Sheaths; 1.3 Discharges; Radio Frequency Diodes; High-Density Sources; 1.4 Symbols and Units; 2 BASIC PLASMA EQUATIONS AND EQUILIBRIUM; 2.1 Introduction; 2.2 Field Equations, Current, and Voltage; Maxwell's Equations; 2.3 The Conservation Equations; Boltzmann's Equation; Macroscopic Quantities; Particle Conservation 327 $aMomentum ConservationEnergy Conservation; Summary; 2.4 Equilibrium Properties; Boltzmann's Relation; Debye Length; Quasi-neutrality; Problems; 3 ATOMIC COLLISIONS; 3.1 Basic Concepts; Elastic and Inelastic Collisions; Collision Parameters; Differential Scattering Cross Section; 3.2 Collision Dynamics; Center-of-Mass Coordinates; Energy Transfer; Small Angle Scattering; 3.3 Elastic Scattering; Coulomb Collisions; Polarization Scattering; 3.4 Inelastic Collisions; Atomic Energy Levels; Electric Dipole Radiation and Metastable Atoms; Electron Ionization Cross Section 327 $aElectron Excitation Cross SectionIon-Atom Charge Transfer; Ion-Atom Ionization; 3.5 Averaging Over Distributions and Surface Effects; Averaging Over a Maxwellian Distribution; Energy Loss per Electron-Ion Pair Created; Surface Effects; Problems; 4 PLASMA DYNAMICS; 4.1 Basic Motions; Motion in Constant Fields; E x B Drifts; Energy Conservation; 4.2 Nonmagnetized Plasma Dynamics; Plasma Oscillations; Dielectric Constant and Conductivity; Ohmic Heating; Electromagnetic Waves; Electrostatic Waves; 4.3 Guiding Center Motion; Parallel Force; Adiabatic Constancy of the Magnetic Moment 327 $aDrift Due to Motion Along Field Lines (Curvature Drift)Drift Due to Gyration (Gradient Drift); Polarization Drift; 4.4 Dynamics of Magnetized Plasmas; Dielectric Tensor; The Wave Dispersion; 4.5 Waves in Magnetized Plasmas; Principal Electron Waves; Principal Waves Including Ion Dynamics; The CMA Diagram; 4.6 Wave Diagnostics; Interferometer; Cavity Perturbation; Wave Propagation; Problems; 5 DIFFUSION AND TRANSPORT; 5.1 Basic Relations; Diffusion and Mobility; Free Diffusion; Ambipolar Diffusion; 5.2 Diffusion Solutions; Boundary Conditions; Time-Dependent Solution 327 $aSteady-State Plane-Parallel SolutionsSteady-State Cylindrical Solutions; 5.3 Low-Pressure Solutions; Variable Mobility Model; Langmuir Solution; Heuristic Solutions; 5.4 Diffusion Across a Magnetic Field; Ambipolar Diffusion; 5.5 Magnetic Multipole Confinement; Magnetic Fields; Plasma Confinement; Leak Width w; Problems; 6 DIRECT CURRENT (DC) SHEATHS; 6.1 Basic Concepts and Equations; The Collisionless Sheath; 6.2 The Bohm Sheath Criterion; Plasma Requirements; The Presheath; Sheath Potential at a Floating Wall; Collisional Sheaths; Simulation Results; 6.3 The High-Voltage Sheath 327 $aMatrix Sheath 330 $aA Thorough Update of the Industry Classic on Principles of Plasma ProcessingThe first edition of Principles of Plasma Discharges and Materials Processing, published over a decade ago, was lauded for its complete treatment of both basic plasma physics and industrial plasma processing, quickly becoming the primary reference for students and professionals.The Second Edition has been carefully updated and revised to reflect recent developments in the field and to further clarify the presentation of basic principles. Along with in-depth coverage of the fundamentals of plasma physics 606 $aPlasma dynamics 606 $aThin films$xSurfaces 606 $aPlasma etching 606 $aPlasma chemistry$xIndustrial applications 615 0$aPlasma dynamics. 615 0$aThin films$xSurfaces. 615 0$aPlasma etching. 615 0$aPlasma chemistry$xIndustrial applications. 676 $a530.4/4 676 $a530.44 700 $aLieberman$b M. A$g(Michael A.)$01709292 701 $aLichtenberg$b Allan J$027130 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910830941803321 996 $aPrinciples of plasma discharges and materials processing$94098940 997 $aUNINA