LEADER 02723nam 2200493 450 001 9910830709603321 005 20240219172219.0 010 $a1-119-55664-3 010 $a1-119-55667-8 010 $a1-119-55665-1 024 7 $a10.1002/9781119556671 035 $a(CKB)4100000010563973 035 $a(MiAaPQ)EBC6128722 035 $a(CaBNVSL)mat09063370 035 $a(IDAMS)0b0000648c8c354a 035 $a(IEEE)9063370 035 $a(EXLCZ)994100000010563973 100 $a20200429d2020 uy 101 0 $aeng 135 $aurcnu|||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 00$aAntenna-in-package technology and applications /$fedited by Duixian Liu, Yueping Zhang 205 $aFirst edition. 210 1$aHoboken, New Jersey :$cWiley-IEEE Press,$d[2020] 210 2$a[Piscataqay, New Jersey] :$cIEEE Xplore,$d[2020] 215 $a1 online resource (518 pages) 311 $a1-119-55663-5 320 $aIncludes bibliographical references and index. 327 $aAntennas for AiP technology / Yueping Zhang -- Package technologies / Dr Ning Ye -- Electrical, mechanical, and thermal co-design / Xiaoxiong Gu and Pritish R Parida. 330 $a"This book starts with some historical notes about how AiP technology has evolved as we know it today. Then, the authors consider antennas and packages, thermal analysis and design, and measurement setups and methods for AiP technology. The authors show that the choice of antennas is usually given to those popular antennas that can be easily designed for the applications; the choice of packages is a trade-off among constraints such as electrical performance, thermo-mechanical reliability, compactness, manufacturability and cost; the choice of interconnects is governed by JEDEC for automatic assembly. Next, the book describes respectively low-temperature co-fired ceramic (LTCC), high-density interconnects (HDI), fan-out wafer level packaging (FOWLP) based AiP, and 3D-printing-based AiP. After that, the authors discuss in details the surface laminar circuit (SLC) based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Finally, the book touches on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications"--$cProvided by publisher. 606 $aMicrostrip antennas 615 0$aMicrostrip antennas. 676 $a621.3824 702 $aLiu$b Duixian 702 $aZhang$b Yueping 801 0$bCaBNVSL 801 1$bCaBNVSL 801 2$bCaBNVSL 906 $aBOOK 912 $a9910830709603321 996 $aAntenna-in-package technology and applications$93932657 997 $aUNINA