LEADER 05496nam 2200685Ia 450 001 9910830706903321 005 20230721004825.0 010 $a1-282-11349-6 010 $a9786612113499 010 $a0-470-44421-5 010 $a0-470-44420-7 035 $a(CKB)1000000000707540 035 $a(EBL)427828 035 $a(OCoLC)437111393 035 $a(SSID)ssj0000334782 035 $a(PQKBManifestationID)11255949 035 $a(PQKBTitleCode)TC0000334782 035 $a(PQKBWorkID)10271777 035 $a(PQKB)10138134 035 $a(MiAaPQ)EBC427828 035 $a(EXLCZ)991000000000707540 100 $a20080718d2009 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aApplications of texture analysis$b[electronic resource] $ea collection of papers presented at the 15th International Conference on Textures of Materials (ICOTOM 15), June 1-6, 2008, Pittsburgh, Pennsylvania /$fedited by A.D. Rollett 210 $aHoboken, N.J. $cWiley$dc2009 215 $a1 online resource (838 p.) 225 1 $aCeramic transactions ;$vv. 201 300 $a"American Ceramic Society." 311 $a0-470-40835-9 320 $aIncludes bibliographical references and index. 327 $aApplications of Texture Analysis; Contents; Preface; Acknowledgments; THIN FILMS (MICROELECTRONICS, HTSC; The Texture of Thin NiSi Films and Its Effect on Agglomeration; Epitaxial Substrates from Ni-Based Ternary Alloys With Cr and W; Cube Texture Formation in Ni-Pd and Ni-Pd-W Alloys For HTS Tapes; Texture of Rapidly Solidified Cu Thin Films Studied by SEM EBSD and TEM; Control of Texture in Polycrystalline Thin Films Used as DataStorage Media; Influences of Processing Parameters on Microstructures and Microtextures of Au Flip Chip Bonds During Microelectronics Packaging 327 $aTEXTURE AT NON-AMBIENT CONDITIONSIn Situ Observation of Texture Evolution in Ti-10-2-3; Study of Texture Evolution at High Strain Rates in FCC Materials; Texture and Microstructure Development in Copper after Cryogenic Rolling and Heat Treatment; In-Situ EBSD Study of the ?-?-? Phase Transformation in a Microalloyed Steel; Texture Changes during Phase Transformations Studied In Situ With Neutron Diffraction; NOVEL TEXTURE MEASUREMENT TECHNIQUES INCLUDING 3D; Three-Dimensional FIB-OIM of Ceramic Materials; Comparison of X-Ray and EBSD Textures for Back-Annealed Al-Mg Alloys 327 $aA New Method for Quantification of Texture Uniformity of PlateSeparating Coincident Electron Backscatter Diffraction Patterns Near Interfaces; Rapid Texture Determination Based on Two Dimensional X Ray Detector; Semiautomatic Determination of Orientations and Elastic Strain from Kossel Microdiffraction; Statistically Reliable EBSD Analysis Method of Grain Boundary Characterization; 3D Microstructures and Textures of a Plane Strain Compressed {1 10} AI-0.3% Mn Single Crystal 327 $aThree Laws of Substructure Anisotropy of Textured Metal Materials, Revealed by X-Ray Method of Generalized Pole Figures3D-Microstructural and Texture Characterization in Different Length Scales; Local Crystal Rotations of Bulk Grains by High-Resolution EBSD during Hot PSC of AI-0.1 % Mn Polycrystals; Grain Boundary Orientations in a Fe-Mn-Cu Polycrystalline Alloy; Development of a TEM-Based Orientation Microscopy System; COMPLEX OXIDES AND OTHER COMPOUNDS; Domain Control Effect on Voltage-Strain in BaTiO3 Single Crystal; Tentative Simulation of Crystal Rotation for NaCl Structures 327 $aINTERFACE TEXTURESGrain Boundary Patterns in Dynamically Recrystallized Quartz Aggregates; The Correlation between Grain Boundary Character and lntergranular Corrosion Susceptibility of 2124 Aluminum Alloy; Rodrigues-Frank Spaces for Misorientations and Orientation Relationships between Crystals of Any Two Crystallographic Point Groups; Origins of Texture Memory in Steels; A Grain Boundary Analysis of Cemented Tungsten Carbides using OIM; The Effect of Grain and Phase Boundary Misorientation on Nucleation during Solid-State Phase Transformations in a Co-15Fe Alloy 327 $aMicrostructural Modification in a 15Cr-1 5Ni-2.2 Mo-Ti Modified Austenitic Stainless Steel through Twin Induced Grain Boundary Engineering 330 $aThis volume contains papers presented at The 15th International Conference on the Texture of Materials from June 1-5th, 2008 in Pittsburgh, PA. Chapters include: Thin FilmsTexture at Non-Ambient ConditionsNovel Texture Measurement Techniques Including 3DComplex OxidesInterface TexturesRecrystallization TextureBiomaterialsTexture Effects on Damage AccumulationDigital MicrostructuresView information on Materials Processing and Texture: Ceramic Transactions, Volume 200. 410 0$aCeramic transactions ;$vv. 201. 606 $aMaterials$xTexture$vCongresses 606 $aMetals$xTexture$vCongresses 606 $aTexture (Crystallography)$vCongresses 615 0$aMaterials$xTexture 615 0$aMetals$xTexture 615 0$aTexture (Crystallography) 676 $a620.11 686 $aUQ 8500$2rvk 701 $aRollett$b A. D$g(Anthony D.)$01640823 712 02$aAmerican Ceramic Society. 712 12$aInternational Conference on Textures of Materials 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910830706903321 996 $aApplications of texture analysis$93984559 997 $aUNINA