LEADER 02994nam 2200553 450 001 9910830486103321 005 20221205191837.0 010 $a1-119-68604-0 010 $a1-119-68603-2 024 7 $a10.1002/9781119686040 035 $a(MiAaPQ)EBC6992822 035 $a(Au-PeEL)EBL6992822 035 $a(CKB)22444727100041 035 $a(OCoLC)1305501326 035 $a(OCoLC-P)1305501326 035 $a(CaSebORM)9781119685975 035 $a(EXLCZ)9922444727100041 100 $a20221205d2022 uy 0 101 0 $aeng 135 $aurcnu|||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aThermal design $eheat sinks, thermoelectrics, heat pipes, compact heat exchangers, ands solar cells /$fHosung Lee 205 $aSecond edition. 210 1$aHoboken, NJ :$cJohn Wiley & Sons, Inc.,$d[2022] 210 4$dİ2022 215 $a1 online resource (931 pages) 311 08$aPrint version: Lee, Hosung Thermal Design Newark : John Wiley & Sons, Incorporated,c2022 9781119685975 320 $aIncludes bibliographical references. 327 $aHeat Sinks -- Heat Pipes -- Compact Heat Exchangers -- Thermoelectric Design -- Thermoelectric Materials -- Solar Cells -- Appendix A: Thermophysical Properties -- Appendix B -- Appendix C: Pipe Dimensions -- Appendix D: Periodic Table -- Appendix E: Thermoelectric Properties -- Appendix F: Fermi Integral -- Appendix G: Hall Factor -- Appendix H: Curve Fitting of Working Fluids -- Appendix L: Tutorial for MathCAD -- Appendix M: Conversion Factors. 330 $a"In this significantly updated new edition, Thermal Design details the physical mechanisms of standard thermal devices while integrating essential formulas and detailed derivations to give a practical understanding of the field to students. The textbook examines the design of thermal devices through mathematical modeling, graphical optimization, and occasionally computational-fluid-dynamic (CFD) simulation. Moreover, it presents information on significant thermal devices such as heat sinks, thermoelectric generators and coolers, heat pipes, and heat exchangers as design components in larger systems -- all of which are increasingly important and fundamental to numerous fields such as microelectronic cooling, green or thermal energy conversion, and thermal control and management in space."--$cProvided by publisher. 606 $aHeat engineering$xMaterials 606 $aThermodynamics 606 $aHeat-transfer media 606 $aThermoelectric apparatus and appliances 615 0$aHeat engineering$xMaterials. 615 0$aThermodynamics. 615 0$aHeat-transfer media. 615 0$aThermoelectric apparatus and appliances. 676 $a621.4021 700 $aLee$b HoSung$0932413 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910830486103321 996 $aThermal design$92225336 997 $aUNINA